公开(公告)号：US5356949A

公开(公告)日：1994-10-18

申请号：US837117

申请日：1992-02-21

申请人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

发明人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

IPC分类号： C08F2/50 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/02 ,  H01L21/302 ,  H01L21/52 ,  H01L21/58 ,  H01L21/68 ,  C09J163/02 ,  C09J133/06

CPC分类号： H01L21/6835 ,  C09J4/06 ,  C09J7/00 ,  C09J7/0239 ,  H01L21/302 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T156/1062 ,  Y10T428/2809 ,  Y10T428/287 ,  Y10T428/2891

摘要： An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable latent curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

摘要翻译： 一种胶带，包括表面张力不大于40达因/厘米的能量束透射性基片和形成在基片的一个表面上的粘合剂层，所述粘合层包含（甲基）丙烯酸酯聚合物，环氧树脂， 可光聚合的低分子量化合物，用于环氧树脂的可热活化的潜在性固化剂和用于可光聚合的低分子量化合物的光聚合引发剂。 粘合剂层中的粘合剂可用能量束固化，并且如此固化的粘合剂在加热时再次发生粘性。 当胶带用于处理半导体晶片时，其用作在切割步骤期间将晶片保持在适当位置的切割胶带。 通过加热而附着在每个芯片上并且能够被加热的每块切割和固化的粘合剂层提供了在芯片接合步骤中将芯片牢固地安装在引线框架上所需的粘合剂。

公开(公告)号：US5110388A

公开(公告)日：1992-05-05

申请号：US653232

申请日：1991-02-08

申请人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

发明人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

IPC分类号： C08F2/50 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/02 ,  H01L21/302 ,  H01L21/52 ,  H01L21/58 ,  H01L21/68

CPC分类号： H01L21/6835 ,  C09J4/06 ,  C09J7/00 ,  C09J7/0239 ,  H01L21/302 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T156/1062 ,  Y10T428/2809 ,  Y10T428/287 ,  Y10T428/2891

摘要： An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

公开(公告)号：US5118567A

公开(公告)日：1992-06-02

申请号：US380548

申请日：1989-07-14

申请人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

发明人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

IPC分类号： C08F2/50 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/02 ,  H01L21/302 ,  H01L21/52 ,  H01L21/58 ,  H01L21/68

CPC分类号： H01L21/6835 ,  C09J4/06 ,  C09J7/00 ,  C09J7/0239 ,  H01L21/302 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T156/1062 ,  Y10T428/2809 ,  Y10T428/287 ,  Y10T428/2891

摘要： An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

公开(公告)号：US5187007A

公开(公告)日：1993-02-16

申请号：US549496

申请日：1990-06-29

申请人： Kazuyoshi Ebe ,  Hiroaki Narita ,  Katsuhisa Taguchi ,  Yoshitaka Akeda ,  Takanori Saito

发明人： Kazuyoshi Ebe ,  Hiroaki Narita ,  Katsuhisa Taguchi ,  Yoshitaka Akeda ,  Takanori Saito

IPC分类号： C09J4/06 ,  C09J7/02 ,  C09J175/16 ,  H01L21/00 ,  H01L21/302 ,  H01L21/68

CPC分类号： H01L21/6835 ,  C09J175/16 ,  C09J4/06 ,  C09J7/0207 ,  C09J7/0239 ,  C09J7/0246 ,  H01L21/302 ,  H01L21/67132 ,  H01L21/6836 ,  C09J2203/326 ,  H01L2221/68322 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2891 ,  Y10T428/2896

摘要： An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.

摘要翻译： 根据本发明的粘合片包括在其表面上涂覆有由粘合剂和可辐射聚合化合物组成的粘合剂层的基材，该化合物是分子量为3,000-10,000，优选4,000-8,000的氨基甲酸酯丙烯酸酯低聚物 。 粘合片优选用于使半导体晶片进行切割操作，并且没有粘合剂粘附并保留在拾取的晶片芯片的背侧表面上。

公开(公告)号：US4965127A

公开(公告)日：1990-10-23

申请号：US111849

申请日：1987-10-22

申请人： Kazuyoshi Ebe ,  Hiroaki Narita ,  Katsuhisa Taguchi ,  Yoshitaka Akeda ,  Takanori Saito

发明人： Kazuyoshi Ebe ,  Hiroaki Narita ,  Katsuhisa Taguchi ,  Yoshitaka Akeda ,  Takanori Saito

IPC分类号： C09J4/06 ,  C09J7/02 ,  C09J175/16 ,  H01L21/00 ,  H01L21/302 ,  H01L21/68

CPC分类号： C09J4/06 ,  C09J175/16 ,  C09J7/0207 ,  C09J7/0239 ,  C09J7/0246 ,  H01L21/302 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  C08L2205/03 ,  C08L33/00 ,  C08L75/04 ,  C09J2203/326 ,  H01L2221/68322 ,  H01L2221/68327 ,  Y10S428/901 ,  Y10T428/28 ,  Y10T428/2809

摘要： An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.

公开(公告)号：US4756968A

公开(公告)日：1988-07-12

申请号：US932210

申请日：1986-11-18

申请人： Kazuyoshi Ebe ,  Hiroaki Narita ,  Katsuhisa Taguchi ,  Yoshitaka Akeda ,  Takanori Saito

发明人： Kazuyoshi Ebe ,  Hiroaki Narita ,  Katsuhisa Taguchi ,  Yoshitaka Akeda ,  Takanori Saito

IPC分类号： C09J4/06 ,  C09J7/02 ,  C09J175/16 ,  H01L21/00 ,  H01L21/302 ,  H01L21/68 ,  B05D3/06

CPC分类号： C09J4/06 ,  C09J175/16 ,  C09J7/0207 ,  C09J7/0239 ,  C09J7/0246 ,  H01L21/302 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  C08L2205/03 ,  C08L33/00 ,  C08L75/04 ,  C09J2203/326 ,  H01L2221/68322 ,  H01L2221/68327 ,  Y10S428/901 ,  Y10T428/28 ,  Y10T428/2809

摘要： An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, said compound being a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chip as picked up.

摘要翻译： 根据本发明的粘合片包括在其表面上涂覆有由粘合剂和可辐射聚合化合物组成的粘合剂层的基材，所述化合物是分子量为3,000-10,000，优选4,000-8,000的氨基甲酸酯丙烯酸酯低聚物 。 粘合片优选用于对半导体晶片进行切割操作，并且在拾取时没有粘合剂粘附到晶片芯片的背侧表面并保留在其上。

公开(公告)号：US09324591B2

公开(公告)日：2016-04-26

申请号：US13438234

申请日：2012-04-03

申请人： Koji Yoshii ,  Tatsuya Yamaguchi ,  Wenling Wang ,  Takanori Saito

发明人： Koji Yoshii ,  Tatsuya Yamaguchi ,  Wenling Wang ,  Takanori Saito

IPC分类号： F27D21/00 ,  H01L21/67

CPC分类号： H01L21/67109 ,  H01L21/67248

摘要： A heat treatment apparatus including: a processing container for processing wafers held in a boat; heaters for heating the processing container; and a control section for controlling the heaters. Heater temperature sensors are provided between the heaters and the processing container, in-container temperature sensors are provided in the processing container, and movable temperature sensors are provided in the boat. The temperature sensors are connected to a temperature estimation section. The temperature estimation section selects two of the three types of temperature sensors, e.g. the movable temperature sensors and the in-container temperature sensors, and determines the temperature of a wafer according to the following formula: T=T1×(1−α)+T2×α, α>1, where T1 and T2 represent detection temperatures of the selected temperature sensors, and α represents a mixing ratio.

摘要翻译： 一种热处理设备，包括：处理容器，用于处理保存在船上的晶片; 用于加热处理容器的加热器; 以及用于控制加热器的控制部。 加热器温度传感器设置在加热器和处理容器之间，容器内温度传感器设置在处理容器中，并且可移动的温度传感器设置在船上。 温度传感器连接到温度估计部。 温度估计部分选择三种类型的温度传感器中的两种，例如， 可移动温度传感器和容器内温度传感器，并根据以下公式确定晶片的温度：T = T1×（1-α）+ T2×α，α> 1，其中T1和T2表示检测温度 的选定温度传感器，α表示混合比。

公开(公告)号：US09273128B2

公开(公告)日：2016-03-01

申请号：US14236793

申请日：2012-08-03

申请人： Fumiyoshi Okano ,  Shinichi Kobayashi ,  Yoshitaka Minamida ,  Takanori Saito

发明人： Fumiyoshi Okano ,  Shinichi Kobayashi ,  Yoshitaka Minamida ,  Takanori Saito

IPC分类号： C07K16/30 ,  A61K39/395 ,  C07K16/18 ,  A61K45/06 ,  C07K16/28

CPC分类号： C07K16/18 ,  A61K39/39558 ,  A61K45/06 ,  C07K16/28 ,  C07K16/30 ,  C07K2317/24 ,  C07K2317/34 ,  C07K2317/73 ,  C07K2317/732

摘要： This invention provides an antibody targeting a cancer antigenic protein specifically expressed on the surface of cancer cells and use thereof as a therapeutic and/or preventive agent for cancer. More specifically, the present invention provides an antibody, or a fragment thereof which has immunological reactivity with a partial CAPRIN-1 polypeptide consisting of the amino acid sequence shown by SEQ ID NO: 5 or an amino acid sequence having 80% or higher sequence identity to the amino acid sequence, and a pharmaceutical composition for treatment and/or prevention of cancer comprising the same as an active ingredient.

摘要翻译： 本发明提供靶向癌细胞表面特异性表达的癌抗原蛋白的抗体及其作为癌症治疗和/或预防剂的用途。 更具体地，本发明提供了与由SEQ ID NO：5所示的氨基酸序列或具有80％以上序列同一性的氨基酸序列组成的部分CAPRIN-1多肽具有免疫学反应性的抗体或其片段 和用于治疗和/或预防癌症的药物组合物，其包含其作为活性成分。

公开(公告)号：US09180188B2

公开(公告)日：2015-11-10

申请号：US14236795

申请日：2012-08-03

申请人： Shinichi Kobayashi ,  Fumiyoshi Okano ,  Yoshitaka Minamida ,  Takanori Saito

发明人： Shinichi Kobayashi ,  Fumiyoshi Okano ,  Yoshitaka Minamida ,  Takanori Saito

IPC分类号： C07K16/30 ,  A61K39/395 ,  A61K45/06 ,  C07K16/28 ,  A61K39/00

CPC分类号： A61K39/39558 ,  A61K45/06 ,  A61K2039/505 ,  C07K16/28 ,  C07K2317/24 ,  C07K2317/56 ,  C07K2317/732 ,  A61K2300/00

摘要： It is intended to identify a cancer antigenic protein specifically expressed on the surface of cancer cells and to provide an antibody targeting the antigenic protein and use of the antibody as a therapeutic and/or preventive agent for cancer. The present invention provides an antibody or a fragment thereof which has immunological reactivity with a CAPRIN-1 protein, the antibody comprising a heavy chain variable region comprising amino acid sequences of SEQ ID NOs: 5, 6, and 7 and a light chain variable region comprising amino acid sequences of SEQ ID NOs: 9, 10, and 11, and a pharmaceutical composition for treatment and/or prevention of cancer, comprising this antibody or fragment as an active ingredient.

摘要翻译： 旨在鉴定在癌细胞表面上特异性表达的癌抗原蛋白，并提供靶向抗原蛋白的抗体和使用抗体作为癌症的治疗和/或预防剂。 本发明提供了与CAPRIN-1蛋白具有免疫反应性的抗体或其片段，所述抗体包含包含SEQ ID NO：5,6和7的氨基酸序列的重链可变区和轻链可变区 包含SEQ ID NO：9,10和11的氨基酸序列，和包含该抗体或片段作为活性成分的用于治疗和/或预防癌症的药物组合物。

公开(公告)号：US20140178373A1

公开(公告)日：2014-06-26

申请号：US14236665

申请日：2012-08-03

申请人： Shinichi Kobayashi ,  Fumiyoshi Okano ,  Takanori Saito

发明人： Shinichi Kobayashi ,  Fumiyoshi Okano ,  Takanori Saito

IPC分类号： C07K16/30 ,  A61K45/06 ,  A61K39/395

CPC分类号： C07K16/30 ,  A61K39/39558 ,  A61K45/06 ,  A61K47/6851 ,  A61K47/6855 ,  A61K47/6857 ,  A61K47/6861 ,  A61K47/6865 ,  A61K47/6869 ,  A61K2039/505 ,  C07K16/28 ,  C07K2317/24 ,  C07K2317/732

摘要： An object of the present invention is to prepare an antibody that targets CAPRIN-1 specifically expressed on the surface of cancer cells and is superior in antitumor activity to conventional antibodies and to provide use of the antibody as a therapeutic and/or preventive agent for cancer. The present invention provides use of an antibody targeting an identified cancer antigenic protein specifically expressed on the surface of cancer cells as a therapeutic and/or preventive agent for cancer, specifically, a pharmaceutical composition for treatment and/or prevention of cancer, comprising as an active ingredient an antibody or a fragment thereof which has immunological reactivity with a CAPRIN-1 protein, the antibody or the fragment thereof comprising a heavy chain variable region comprising amino acid sequences represented by SEQ ID NOs: 5, 6, and 7 and a light chain variable region comprising amino acid sequences represented by SEQ ID NOs: 9, 10, and 11.