公开(公告)号：US07994084B2

公开(公告)日：2011-08-09

申请号：US12323840

申请日：2008-11-26

申请人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

发明人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

IPC分类号： C04B35/468 ,  H01G4/12

CPC分类号： H01G4/129 ,  B82Y30/00 ,  C04B35/468 ,  C04B2235/3281 ,  C04B2235/3298 ,  C04B2235/365 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/9615 ,  H01G4/1227 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.

摘要翻译： 提供一种电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷衬底。 电介质组合物包括约80重量％以上的主成分BaTiO 3和约20重量％以下的辅助成分CuBi 2 O 4和ZnO-B 2 O 3 -SiO 2基玻璃。

公开(公告)号：US20090141427A1

公开(公告)日：2009-06-04

申请号：US12323840

申请日：2008-11-26

申请人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

发明人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

IPC分类号： H01G4/12 ,  C04B35/468

CPC分类号： H01G4/129 ,  B82Y30/00 ,  C04B35/468 ,  C04B2235/3281 ,  C04B2235/3298 ,  C04B2235/365 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/9615 ,  H01G4/1227 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.

摘要翻译： 提供一种电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷衬底。 电介质组合物包括约80重量％以上的主成分BaTiO 3和约20重量％以下的辅助成分CuBi 2 O 4和ZnO-B 2 O 3 -SiO 2基玻璃。

公开(公告)号：US08093172B2

公开(公告)日：2012-01-10

申请号：US12271386

申请日：2008-11-14

申请人： Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

发明人： Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

IPC分类号： C04B35/468

CPC分类号： H01G4/1227 ,  C03C3/064 ,  C03C8/02 ,  C04B35/4682 ,  C04B2235/3215 ,  C04B2235/3232 ,  C04B2235/3298 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/5445 ,  H01G4/129 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40≦a≦89, 10≦b≦50, 1≦c≦20, 0≦d≦10, and 0≦e≦10, respectively.

摘要翻译： 提供一种玻璃组合物，电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷基板。 多层陶瓷电容器嵌入式低温共烧陶瓷基板在低温下可烧结，同时显示高介电常数。 该玻璃组合物包含由Bi 2 O 3 -bB 2 O 3 -cSiO 2 -dBaO-eTiO 2的组成式表示的组成成分，其中a + b + c + d + e = 100，a，b，c，d和e为40＆ a＆nlE; 89，10＆nlE; b＆nlE; 50,1＆nlE; c＆nlE; 20,0＆nlE; d＆nlE; 10和0＆nlE; e＆nlE; 10。

公开(公告)号：US20090135542A1

公开(公告)日：2009-05-28

申请号：US12271386

申请日：2008-11-14

申请人： Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

发明人： Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

IPC分类号： H01G4/30 ,  C03C3/064

CPC分类号： H01G4/1227 ,  C03C3/064 ,  C03C8/02 ,  C04B35/4682 ,  C04B2235/3215 ,  C04B2235/3232 ,  C04B2235/3298 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/5445 ,  H01G4/129 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40≦a≦89, 10≦b≦50, 1≦c≦20, O≦d≦10, and O≦e≦10, respectively.

摘要翻译： 提供一种玻璃组合物，电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷基板。 多层陶瓷电容器嵌入式低温共烧陶瓷基板在低温下可烧结，同时显示高介电常数。 玻璃组合物包括由组成式表示的Bi 2 O 3 -bB 2 O 3 -cSiO 2 -dBaO-eTiO 2的组成成分，其中a + b + c + d + e = 100，a，b，c，d和e分别为40 < = a <= 89，10 <= b <= 50，1 <= c <= 20，O <= d <= 10，O <= e <= 10。

公开(公告)号：US20090214881A1

公开(公告)日：2009-08-27

申请号：US12388849

申请日：2009-02-19

申请人： Myung Whun Chang ,  Jong Myeon Lee ,  Soo Hyun Lyoo ,  Ho Sung Choo

发明人： Myung Whun Chang ,  Jong Myeon Lee ,  Soo Hyun Lyoo ,  Ho Sung Choo

IPC分类号： B32B18/00 ,  C03B29/00

CPC分类号： C04B37/005 ,  C04B2237/062 ,  C04B2237/10 ,  C04B2237/341 ,  C04B2237/62 ,  C04B2237/74 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： There is provided a low temperature co-fired ceramic substrate having a diffusion barrier layer to prevent diffusion occurring in a heterojunction during firing and a method of manufacturing the same. A low temperature co-fired ceramic substrate according to an aspect of the invention may include: a first ceramic layer formed of a material having a first dielectric constant; a second ceramic layer formed of a material having a second dielectric constant lower than the first dielectric constant; and a diffusion barrier layer interposed between the first ceramic layer and the second ceramic layer and formed of the first ceramic layer material, the second ceramic layer material, and a barium (Ba) compound, wherein inter-diffusion between the first ceramic layer material and the second ceramic layer material is prevented by using the diffusion barrier layer.

摘要翻译： 提供了具有扩散阻挡层的低温共烧陶瓷基板及其制造方法，以防止在烧成期间发生异质结的扩散。 根据本发明的一个方面的低温共烧陶瓷衬底可以包括：由具有第一介电常数的材料形成的第一陶瓷层; 由具有低于第一介电常数的第二介电常数的材料形成的第二陶瓷层; 以及介于所述第一陶瓷层和所述第二陶瓷层之间并且由所述第一陶瓷层材料，所述第二陶瓷层材料和钡（Ba）化合物形成的扩散阻挡层，其中所述第一陶瓷层材料和 通过使用扩散阻挡层来防止第二陶瓷层材料。

公开(公告)号：US20090107616A1

公开(公告)日：2009-04-30

申请号：US12262104

申请日：2008-10-30

申请人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Eun Tae Park ,  Hyoung Ho Kim

发明人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Eun Tae Park ,  Hyoung Ho Kim

IPC分类号： C03B29/00

CPC分类号： B32B18/00 ,  C04B2237/346 ,  C04B2237/56 ,  C04B2237/62 ,  H01L2224/16225 ,  H01L2924/09701 ,  H05K1/0231 ,  H05K1/0306 ,  H05K1/183 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/10636 ,  H05K2203/308 ,  Y02P70/611

摘要： Provided is a manufacturing method of a multi-layer ceramic substrate. The manufacturing method includes preparing an unsintered ceramic laminated body with a cavity, mounting a chip device within the cavity, filling the cavity, in which the chip device is mounted, with a ceramic slurry, attaching a constrained layer on top and/or bottom of the ceramic laminated body, and firing the ceramic laminated body. Accordingly, since the deformation of the cavity is prevented during the firing of the ceramic laminated body, the dimension precision and reliability of the multi-layer ceramic substrate can be improved.

摘要翻译： 提供一种多层陶瓷基板的制造方法。 该制造方法包括制备具有空腔的未烧结的陶瓷层叠体，在空腔内安装芯片装置，将其中安装有芯片装置的空腔填充到陶瓷浆料中，将约束层附着在顶部和/或底部上 陶瓷层叠体，烧结陶瓷层叠体。 因此，由于在烧结陶瓷层叠体期间防止了空腔的变形，因此可以提高多层陶瓷基板的尺寸精度和可靠性。

公开(公告)号：US20090133805A1

公开(公告)日：2009-05-28

申请号：US12276656

申请日：2008-11-24

申请人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Eun Tae Park ,  Hyong Ho Kim

发明人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Eun Tae Park ,  Hyong Ho Kim

IPC分类号： B32B37/06

CPC分类号： H05K3/0052 ,  H01L21/481 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/308

摘要： There is provided a method of manufacturing a multilayer ceramic substrate that can be easily performed with high efficiency at low cost without affecting the performance of a multilayer ceramic substrate. A method of manufacturing a multilayer ceramic substrate according to an aspect of the invention may include: printing a cutting region onto at least one of a plurality of ceramic green sheets when the plurality of ceramic green sheets are laminated to form the ceramic laminate; firing the ceramic laminate; and cutting the fired ceramic laminate along the cutting region.

摘要翻译： 提供一种制造多层陶瓷基板的方法，其可以以低成本高效率地进行而不影响多层陶瓷基板的性能。 根据本发明的一个方面的制造多层陶瓷基板的方法可以包括：当多个陶瓷生片被层压以形成陶瓷层压体时，将切割区域印刷到多个陶瓷生片中的至少一个上; 烧制陶瓷层压板; 并沿着切割区域切割烧制的陶瓷层压体。

公开(公告)号：US20090117290A1

公开(公告)日：2009-05-07

申请号：US12265692

申请日：2008-11-05

申请人： Hyung Ho KIM ,  Jong Myeon Lee ,  Eun Tae Park ,  Soo Hyun Lyoo

发明人： Hyung Ho KIM ,  Jong Myeon Lee ,  Eun Tae Park ,  Soo Hyun Lyoo

IPC分类号： B05D5/12 ,  C23C14/30 ,  C23C14/34

CPC分类号： H05K3/4611 ,  B32B18/00 ,  C04B2237/32 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  H05K1/0306 ,  H05K3/245 ,  H05K3/4629 ,  H05K2203/0315 ,  H05K2203/308

摘要： In a method of manufacturing a non-shrinkage ceramic substrate, a ceramic laminated structure, which is formed of a plurality of laminated green sheets each having an interconnecting pattern and has an external electrode formed on at least one of a top and bottom thereof, is prepared. A metal layer is formed to cover at least a portion of the external electrode. A constraining green sheet is disposed on at least one of the top and bottom of the ceramic laminated structure to suppress a planar shrinkage of the green sheets. The ceramic laminated structure is fired at the firing temperature of the green sheets to oxidize the metal layer. The constraining green sheet and a metal oxide layer, which is formed by oxidizing the metal layer, are removed. Accordingly, an electrode post-firing process can be omitted and the adhering strength between the electrode and the ceramic laminated structure can be increased.

摘要翻译： 在制造非收缩陶瓷基板的方法中，由多个层叠的生片（各自具有互连图案）形成的陶瓷层叠结构，并且在其顶部和底部中的至少一个上形成有外部电极， 准备 形成金属层以覆盖外部电极的至少一部分。 在陶瓷层叠结构的顶部和底部中的至少一个上设置约束生片，以抑制生片的平面收缩。 在生片的烧成温度下烧结陶瓷层叠结构，使金属层氧化。 去除通过氧化金属层形成的约束生片和金属氧化物层。 因此，可以省略电极后烧制工艺，并且可以增加电极和陶瓷层叠结构之间的粘合强度。

公开(公告)号：US20090114433A1

公开(公告)日：2009-05-07

申请号：US12264869

申请日：2008-11-04

申请人： Min Ji KO ,  Eun Tae Park ,  Yong Seok Choi ,  Soo Hyun Lyoo

发明人： Min Ji KO ,  Eun Tae Park ,  Yong Seok Choi ,  Soo Hyun Lyoo

IPC分类号： H05K1/02 ,  H05K3/00

CPC分类号： H05K3/4688 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/38 ,  H05K3/4629 ,  Y10T29/49124

摘要： There is provided a multi-layered ceramic board and a method of manufacturing the same. A multi-layered ceramic board according to an aspect of the invention may include: an internal layer having a plurality of first dielectric sheets laminated, each of the first dielectric sheets prepared by mixing glass powder with a predetermined amount of alumina powder; and an external layer having at least one second dielectric sheet laminated on the surface of the internal layer, the second dielectric sheet prepared by mixing glass powder with alumina powder in a smaller amount than the first dielectric sheet, wherein via hole conductors and internal electrodes provided in the internal layer are electrically connected to a surface electrode provided on the surface of the external layer, and the internal layer, the external layer, the via hole conductors, the internal layer, and the surface electrode are fired at a predetermined temperature.

摘要翻译： 提供了一种多层陶瓷板及其制造方法。 根据本发明的一个方面的多层陶瓷板可以包括：层叠多个第一电介质片的内层，通过将玻璃粉与预定量的氧化铝粉末混合而制备的每个第一电介质片; 以及外部层，其具有层叠在所述内层的表面上的至少一个第二电介质片，所述第二电介质片通过将玻璃粉末与比所述第一电介质片材更少量的氧化铝粉末混合而制备，其中设置有通孔导体和内部电极 在内层中电连接到设置在外层表面上的表面电极，内部层，外层，通孔导体，内层和表面电极在预定温度下烧制。

公开(公告)号：US20100101702A1

公开(公告)日：2010-04-29

申请号：US12476538

申请日：2009-06-02

申请人： Yong Seok CHOI ,  Seung Gyo Jeong ,  Eun Tae Park ,  Ki Pyo Hong ,  Soo Hyun Lyoo

发明人： Yong Seok CHOI ,  Seung Gyo Jeong ,  Eun Tae Park ,  Ki Pyo Hong ,  Soo Hyun Lyoo

IPC分类号： C03B29/00

CPC分类号： B32B18/00 ,  C04B35/634 ,  C04B37/005 ,  C04B2235/36 ,  C04B2237/10 ,  C04B2237/341 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/595 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  H01G4/105 ,  H01G4/232 ,  H01G4/30 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2203/061 ,  Y10T156/1089

摘要： Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.

摘要翻译： 公开了一种制造多层陶瓷基板的方法。 该方法包括提供多个陶瓷块，每个陶瓷块包括具有第一表面和第二表面的陶瓷层压体，并且具有包含玻璃陶瓷部件的多个陶瓷生片的层叠结构，以及第一粘合陶瓷生片， 玻璃组分，并且设置在陶瓷层压体的第一和第二表面的与另一陶瓷层压体接触的表面上，烧制多个陶瓷块，层叠多个陶瓷块，使得相邻的第一粘合陶瓷生片 陶瓷块彼此面对，并且使用第一接合陶瓷生片的玻璃成分接合多个陶瓷块。