摘要:
A circuit for testing a semiconductor apparatus includes a test voltage applying unit configured to apply a test voltage to a first end of a through-silicon via (TSV) in response to a test mode signal and a detecting unit configured to be connected to a second end of the TSV and detect a current outputted from the second end of the TSV.
摘要:
A semiconductor apparatus includes a signal transmission block and signal reception blocks. The signal transmission block is disposed in a first chip and configured to transmit fuse information in synchronization with transmission control signals. The signal reception blocks are respectively disposed in the first chip and a second chip and configured to receive the fuse information in synchronization with reception control signals.
摘要:
A plasma display apparatus comprises a plasma display panel and a driver. The plasma display panel comprises a first electrode, a second electrode, and a third electrode crossing the first electrode and the second electrode. During a first frame, the driver alternately supplies a sustain signal to the first electrode and the second electrode and supplies a constant voltage to the third electrode. During a second frame having a smaller APL of the first frame, the driver alternately supplies a sustain signal to the first electrode and the second electrode and supplies an auxiliary signal to the third electrode so as to correspond to at least one sustain signal of the sustain signals supplied to the first electrode and the second electrode.
摘要:
A method for extracting a probability model value from a probability model table and a method and apparatus for decoding a symbol value using the same are provided. The method for extracting a probability model value from a probability model table includes: segmenting and reducing a probability model table including a plurality of probability model values; disposing indexes on the basis of the segmented and reduced probability model table; and searching the probability model table for a probability model value by using the disposed indexes.
摘要:
Disclosed is a multi-core processor, and more particularly, a method of optimizing performance of a multi-core processor having a hierarchical structure and a multi-core processor system for performing the method. To this end, the method of optimizing performance of a hierarchical multi-core processor including a plurality of kernel cores, each kernel core including a plurality of cores sharing a memory, the method includes calculating a correlation between a plurality of threads by a thread correlation managing module within a main processor; grouping the plurality of threads into two or more threads according to information on the calculated correlation by the main processor; and allocating each of the grouped threads within an equal group to each core within an equal kernel core of the hierarchical multi-core processor by a scheduler of the main processor.
摘要:
A semiconductor apparatus may include a transmission control signal generation unit, a fuse signal transmission unit, a reception control signal generation unit and a fuse signal reception unit. The transmission control signal generation unit receives a clock signal and generates a plurality of divided clock signals based on the clock signal to output transmission control signals from the plurality of divided clock signals. The fuse signal transmission unit transmits fuse information in synchronization with the transmission control signals. The reception control signal generation unit receives the clock signal and generates the plurality of divided clock signals, and generates reception control signals based on the plurality of divided clock signals. The fuse signal reception unit receives the fuse information in synchronization with the reception control signals.
摘要:
Provided is a 3D stacked semiconductor integrated circuit including a plurality of chips coupled through a plurality of TSVs. A first chip among the plurality of chips is configured to detect and repair a defective TSV among the plurality of TSVs, and transmit repair information to remaining chips other than the first chip, and the remaining chips other than the first chip are configured to repair the defective TSV in response to the repair information.
摘要:
A repair circuit of a semiconductor apparatus includes a transmission control unit configured to generate first through nth (n is an integer equal to or greater than 2) control signals in response to a repair information signal, and enable all mth through nth control signals when the repair information signal indicating an mth (m is an integer equal to or greater than 1 and equal to or less than n) TSV is inputted; transmission units configured to allocate transmission paths for first through nth signals to first through nth TSVs and a repair TSV in response to the first through nth control signals; and receiving units configured to receive the signals transmitted from the first through nth TSVs and the repair TSV in response to the first through nth control signals.