公开(公告)号：US5746904A

公开(公告)日：1998-05-05

申请号：US610882

申请日：1996-03-05

申请人： Ming Shing Lee

发明人： Ming Shing Lee

IPC分类号： B03D1/14 ,  C02F1/463 ,  C02F1/465 ,  G02F1/461

CPC分类号： B03D1/1437 ,  B03D1/028 ,  B03D1/1481 ,  B03D1/1493 ,  C02F1/463 ,  C02F1/465

摘要： A method for continuously treating a water body, comprising a step of using a substantially sealed processing tank, at a top and a bottom portions of which a water outlet and a water inlet are arranged respectively, and in an interior space of which three or more conductive plates substantially in parallel relation with the tank bottom and substantially in parallel relation with one another for upwardly forming a substantially closed S-shaped one-way flow path in said processing tank, wherein said conductive plates are made of a conductive material having a resistivity ranged from 1.59 .mu..OMEGA.to 1300 .mu..OMEGA.cm and at least two of said conductive plates are respectively electrically connected to a positive and a negative power source to serve as an anode and a cathode, wherein said water to be treated is introduced into said processing tank from said water inlet, flows upwardly through said S-shaped one-way flow path, and then is discharged out of said processing tank form said water outlet, and wherein a voltage is applied to said cathode and said anode to generate an electric field having an intensity ranged from 0.5 mV/cm to 1000 V/cm during the flow of said water body in said flow path, thereby polarizing and coagulating impurities in said water body to removing said coagulating impurities.

摘要翻译： 一种用于连续处理水体的方法，包括在分别布置出水口和入水口的顶部和底部分别使用基本上密封的处理槽的步骤，并且在其内部空间中具有三个或更多个 导电板基本上与罐底部平行关系并且基本上彼此平行关系，用于在所述处理槽中向上形成基本封闭的S形单向流动路径，其中所述导电板由具有电阻率的导电材料制成 范围为1.59μmOMEGA至1300μm欧米伽厘米，并且至少两个所述导电板分别电连接到正电源和负电源以用作阳极和阴极，其中所述待处理水被引入所述处理 水箱从所述进水口向上流过所述S形单向流动路径，然后从所述水槽排出所述处理槽 r出口，并且其中在所述流动路径中的所述水体的流动期间，向所述阴极和所述阳极施加电压以产生具有范围为0.5mV / cm至1000V / cm的强度的电场，由此偏振和凝结 所述水体中的杂质以除去所述凝结杂质。

公开(公告)号：US20120305956A1

公开(公告)日：2012-12-06

申请号：US13150449

申请日：2011-06-01

申请人： Fu-Wen Liu ,  Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Yung-Chang Chen ,  Ming Shing Lee ,  Tzu-Wen Shih ,  Hsin-Hung Chen

发明人： Fu-Wen Liu ,  Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Yung-Chang Chen ,  Ming Shing Lee ,  Tzu-Wen Shih ,  Hsin-Hung Chen

IPC分类号： H01L33/44

CPC分类号： H01L33/0095 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

摘要： The present disclosure provides a method of patterning a phosphor layer on a light emitting diode (LED) emitter. The method includes providing at least one LED emitter disposed on a substrate; forming a polymer layer over the at least one LED emitter; providing a mask over the polymer layer and the at least one LED emitter; etching the polymer layer through the mask to expose the at least one LED emitter within a cavity having polymer layer walls; and coating the at least one LED emitter with phosphor.

摘要翻译： 本公开提供了在发光二极管（LED）发射器上图案化磷光体层的方法。 该方法包括提供设置在基板上的至少一个LED发射器; 在所述至少一个LED发射器上形成聚合物层; 在所述聚合物层和所述至少一个LED发射器上提供掩模; 通过掩模蚀刻聚合物层，以在具有聚合物层壁的空腔内露出至少一个LED发射器; 以及用磷光体涂覆所述至少一个LED发射器。

公开(公告)号：US08610161B2

公开(公告)日：2013-12-17

申请号：US13253797

申请日：2011-10-05

申请人： Yung-Chang Chen ,  Hsin-Hsien Wu ,  Ming Shing Lee ,  Huai-En Lai ,  Fu-Wen Liu ,  Andy Wu

发明人： Yung-Chang Chen ,  Hsin-Hsien Wu ,  Ming Shing Lee ,  Huai-En Lai ,  Fu-Wen Liu ,  Andy Wu

IPC分类号： H01L33/42

CPC分类号： H01L33/58 ,  H01L24/24 ,  H01L24/82 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2933/0066 ,  H01L2924/00

摘要： An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.

摘要翻译： 光发射器包括在封装晶片上的发光二极管（LED），透明绝缘体以及LED管芯与封装晶片上的一个或多个接触焊盘之间的一个或多个透明电连接器。 透明绝缘体沉积在封装晶圆上，并使用光刻法或丝网印刷法连接LED芯片。 使用物理气相沉积，化学气相沉积，旋涂，喷涂或丝网印刷沉积透明电连接器，并且可以使用光刻工艺和蚀刻来图案化。