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33 条记录 (耗时 0.054 秒)

    Method and Apparatus for Die Assembly
    2.
    发明申请
    Method and Apparatus for Die Assembly 有权
    模具组装方法与装置

    公开(公告)号：US20130093094A1

    公开(公告)日：2013-04-18

    申请号：US13276184

    申请日：2011-10-18

    申请人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

    发明人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

    IPC分类号： H01L23/48 ,  H01L21/78

    CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/73104

    摘要： Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits.

    摘要翻译： 模具组装的方法和装置 一种方法包括形成从半导体衬底的有源表面延伸的沟槽，其包括多个集成电路管芯，所述多个集成电路管芯具有从所述有源表面延伸的连接器端子， 形成覆盖在半导体衬底和沟槽的有源表面上的保护层，并覆盖连接器端子的下部; 在保护层和沟槽内打开预切割开口; 在半导体晶片的有源表面，保护层和连接器端子上施加带; 以及在半导体衬底的背面进行操作以去除材料，直到在半导体晶片的背面露出预切割开口。 一种装置包括具有集成电路的半导体衬底和围绕集成电路的连接器端子的保护层。

    Rotating curing
    3.
    发明授权
    Rotating curing 有权
    旋转固化

    公开(公告)号：US09147584B2

    公开(公告)日：2015-09-29

    申请号：US13297390

    申请日：2011-11-16

    申请人： Jing Ruei Lu ,  Yu-Chih Liu ,  Ming-Chung Sung ,  Wei-Ting Lin ,  Chien-Kuo Chang

    发明人： Jing Ruei Lu ,  Yu-Chih Liu ,  Ming-Chung Sung ,  Wei-Ting Lin ,  Chien-Kuo Chang

    IPC分类号： H01L21/50 ,  H01L23/29 ,  H01L21/56 ,  H01L21/67 ,  H01L21/687

    CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L21/67109 ,  H01L21/68764 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.

    摘要翻译： 提供了一种用于固化材料的系统和方法。 诸如底部填充材料的材料在固化过程中旋转。 固化系统可以包括腔室，用于支撑一个或多个工件的保持器和旋转机构。 旋转机构在固化过程中使工件旋转。 腔室可以包括一个或多个热源和风扇，并且还可以包括控制器。 固化过程可以包括改变旋转速度，连续旋转，周期性旋转等。

    Method and apparatus for die assembly
    4.
    发明授权
    Method and apparatus for die assembly 有权
    模具组装方法和装置

    公开(公告)号：US08652939B2

    公开(公告)日：2014-02-18

    申请号：US13276184

    申请日：2011-10-18

    申请人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

    发明人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

    IPC分类号： H01L21/00

    CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/73104

    摘要： Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits.

    摘要翻译： 模具组装的方法和装置 一种方法包括形成从半导体衬底的有源表面延伸的沟槽，其包括多个集成电路管芯，所述多个集成电路管芯具有从所述有源表面延伸的连接器端子， 形成覆盖在半导体衬底和沟槽的有源表面上的保护层，并覆盖连接器端子的下部; 在保护层和沟槽内打开预切割开口; 在半导体晶片的有源表面，保护层和连接器端子上施加带; 以及在半导体衬底的背面进行操作以去除材料，直到在半导体晶片的背面露出预切割开口。 一种装置包括具有集成电路的半导体衬底和围绕集成电路的连接器端子的保护层。

    Rotating Curing
    5.
    发明申请
    Rotating Curing 有权
    旋转固化

    公开(公告)号：US20130119565A1

    公开(公告)日：2013-05-16

    申请号：US13297390

    申请日：2011-11-16

    申请人： Jing Ruei Lu ,  Yu-Chih Liu ,  Ming-Chung Sung ,  Wei-Ting Lin ,  Chien-Kuo Chang

    发明人： Jing Ruei Lu ,  Yu-Chih Liu ,  Ming-Chung Sung ,  Wei-Ting Lin ,  Chien-Kuo Chang

    IPC分类号： H01L23/29 ,  H05B1/02 ,  F24C7/08

    CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L21/67109 ,  H01L21/68764 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.

    摘要翻译： 提供了一种用于固化材料的系统和方法。 诸如底部填充材料的材料在固化过程中旋转。 固化系统可以包括腔室，用于支撑一个或多个工件的保持器和旋转机构。 旋转机构在固化过程中使工件旋转。 腔室可以包括一个或多个热源和风扇，并且还可以包括控制器。 固化过程可以包括改变旋转速度，连续旋转，周期性旋转等。

    Apparatus and methods for semiconductor packages with improved warpage
    6.
    发明授权
    Apparatus and methods for semiconductor packages with improved warpage 有权
    具有改善翘曲的半导体封装的装置和方法

    公开(公告)号：US08288208B1

    公开(公告)日：2012-10-16

    申请号：US13192379

    申请日：2011-07-27

    申请人： Yu-Chih Liu ,  Jing Ruei Lu ,  Wei-Ting Lin ,  Sao-Ling Chiu ,  Chien-Kuo Chang

    发明人： Yu-Chih Liu ,  Jing Ruei Lu ,  Wei-Ting Lin ,  Sao-Ling Chiu ,  Chien-Kuo Chang

    IPC分类号： H01L21/44

    CPC分类号： H01L23/3677 ,  H01L21/50 ,  H01L21/563 ,  H01L23/42 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00

    摘要： Methods for making a substrate for semiconductor packaging with improved warpage and an apparatus. A method includes providing on a die side of a substrate at least one flip chip mounted integrated circuit die. The substrate may include through substrate vias (TSVs). An underfill is dispensed between the integrated circuit die and the substrate. Initially the underfill is left uncured. A thermal interface material is provided on the upper surface of the at least one integrated circuit die. A heat sink is mounted over the integrated circuit die and in thermal contact with the thermal interface material. A thermal cure is performed to simultaneously cure the underfill material and the thermal interface material. In another embodiment, the thermal cure may simultaneously cure an adhesive mounting the heat sink to the substrate. Solder balls are disposed on a board surface of the substrate to form a ball grid array package.

    摘要翻译： 用于制造具有改进的翘曲的半导体封装用基板的方法和装置。 一种方法包括在衬底的裸片侧提供至少一个倒装芯片安装的集成电路管芯。 衬底可以包括通过衬底通孔（TSV）。 在集成电路管芯和衬底之间分配底部填充物。 最初，底部填充物未固化。 在所述至少一个集成电路管芯的上表面上设置热界面材料。 散热器安装在集成电路管芯上并与热界面材料热接触。 进行热固化以同时固化底部填充材料和热界面材料。 在另一个实施例中，热固化可以同时固化将散热器安装到基板上的粘合剂。 焊球设置在基板的板表面上以形成球栅阵列封装。