摘要:
An image fixing apparatus includes such an image fixing roller for thermally fixing images on an image receiving material that includes (a) a core roller member; and (b) an exothermic phase transition layer provided on the core roller member. The exothermic phase transition layer includes an exothermic phase transition material capable of performing reversible phase transition from an amorphous state to a crystalline state and vice versa, and crystallizing at a crystallization temperature which is lower than a predetermined image fixing temperature, with liberation of crystallization heat therefrom, and the exothermic phase transition material having a melting point higher than the image fixing temperature, thereby additionally increasing the temperature elevation rate before the temperature of the outer peripheral surface of the image fixing roller reaches the image fixing temperature to shorten the warm up time of the image fixing roller.
摘要:
An image formation apparatus includes an image fixing roller for performing thermal image fixing, which image fixing roller includes an exothermic phase transition layer capable of performing reversible phase transition from an amorphous state to a crystalline state and vice versa, with liberation of crystallization heat at the phase transition from the amorphous state to the crystalline state, and the crystallization heat is used for increasing the temperature elevation rate for the image fixing roller.
摘要:
An image formation apparatus includes an image fixing roller for performing thermal image fixing, which image fixing roller includes an exothermic phase transition layer capable of performing reversible phase transition from an amorphous state to a crystalline state and vice versa, with liberation of crystallization heat at the phase transition from the amorphous state to the crystalline state, and the crystallization heat is used for increasing the temperature elevation rate for the image fixing roller.
摘要:
An image fixing apparatus includes such an image fixing roller for thermally fixing images on an image receiving material that includes (a) a core roller member; and (b) an exothermic phase transition layer provided on the core roller member. The exothermic phase transition layer includes an exothermic phase transition material capable of performing reversible phase transition from an amorphous state to a crystalline state and vice versa, and crystallizing at a crystallization temperature which is lower than a predetermined image fixing temperature, with liberation of crystallization heat therefrom, and the exothermic phase transition material having a melting point higher than the image fixing temperature, thereby additionally increasing the temperature elevation rate before the temperature of the outer peripheral surface of the image fixing roller reaches the image fixing temperature to shorten the warm up time of the image fixing roller.
摘要:
An image fixing apparatus for thermally fixing images on an image receiving material at a predetermined image fixing temperature, comprising an image fixing device comprising a core member, and an exothermic phase transition layer provided on said core member, comprising an exothermic phase transition material which is capable of performing reversible phase transition from an amorphous solid state to a crystalline state with liberation of crystallization heat therefrom, and vice versa, and has a melting point higher than said predetermined image fixing temperature, a heating device which maintains the temperature of at least an outer surface of said image fixing device at said predetermined image fixing temperature, a first phase transition device which heats said exothermic phase transition layer, thereby having said exothermic phase transition material perform phase transition from said amorphous state to said crystalline state for liberation of crystallization heat therefrom, a second phase transition device which has said exothermic phase transition material perform phase transition from said crystalline state to said amorphous solid state and a pressure application device which rotates in pressure contact with the outer surface of said image fixing device with the application of a predetermined pressure thereto.
摘要:
An image formation apparatus includes an image fixing roller for performing thermal image fixing, which image fixing roller includes an exothermic phase transition layer capable of performing reversible phase transition from an amorphous state to a crystalline state and vice versa, with liberation of crystallization heat at the phase transition from the amorphous state to the crystalline state, and the crystallization heat is used for increasing the temperature elevation rate for the image fixing roller.
摘要:
In a raw material preparing step, a rice powder as a primary raw material powder is added with a water to prepare a mixed raw material. In a kneading step, the mixed raw material is kneaded to form a kneaded substance. In a pressing/extending step, the kneaded substance is pressed and extended to form noodle dough sheet. In a slitting step, the noodle dough sheet is slit into predetermined noodle strand shape to obtain a continuous noodle strand However, these steps maintain a non-alpha state of the rice powder component In a packaging step, a unit-length noodle strand is accommodated in a pouch-like heat-resistant packaging container and hermetically sealed to obtain a packaged unit-length noodle strand, while maintaining a non-alpha state of the rice powder component in the noodle strand.
摘要:
The present invention provides a refrigerator with improved refrigerator box strength and high heat insulating performance, which is configured such that external deformation due to entry of air into a vacuum heat insulating material, the entry of air being caused by aging degradation, is prevented. The present invention includes: a heat-insulated box including an inner casing and an outer casing, in which space between the inner casing and the outer casing is filled with a foamed heat insulating material; and a vacuum heat insulating material disposed in at least a side wall of the heat-insulated box together with the foamed heat insulating material, the vacuum heat insulating material including an outer skin material, the outer skin material including at least a core material and being decompression-sealed. The vacuum heat insulating material includes a gas adsorbent. Since the vacuum heat insulating material including the gas adsorbent is included in the side wall, which tends to be greatly distorted among the heat insulating walls of the refrigerator, the rigidity of the side wall is improved and aging degradation of the vacuum heat insulating material is suppressed. As a result, the rigidity of the heat-insulated box can be maintained for a long term, and external deformation of the outer casing of the body can be prevented.
摘要:
A method include disposing a semiconductor chip having an electrode pad formed on a circuit forming surface on one surface of a support so that the electrode pad contacts with the one surface of the support, forming a first insulating layer on the one surface of the support so that the first insulating layer covers at least a side surface of the semiconductor chip, removing the support and forming an interconnection terminal on the electrode pad, forming a second insulating layer on the circuit forming surface of the semiconductor chip and the first insulating layer so that the second insulating layer covers the interconnection terminal, exposing an end portion of the interconnection terminal from a top surface of the second insulating layer, and forming a wiring pattern that is electrically connected to the end portion of the interconnection terminal, on the top surface of the second insulating layer.
摘要:
There are provided the steps of connecting a chip component 13 to a first substrate 10 through a wire 14, providing an electrode 21 on a second substrate 20, attaching, to the first substrate 10, a molding tool 30 having a protruded portion 31 formed corresponding to an array of a bump connecting pad 12 of the first substrate 10 and a cavity 32 formed corresponding to a region in which the chip component 13 is mounted, thereby forming a first sealing resin 34 for sealing the chip component 13 and the wire 14, bonding the electrode 21 to the bump connecting pad 12 through a solder, thereby bonding the first substrate 10 to the second substrate 20, and filling a second filling resin 40 in a clearance portion between the first substrate 10 and the second substrate 20.