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    Substrate processing apparatus and substrate processing method
    6.
    发明申请
    Substrate processing apparatus and substrate processing method 审中-公开

    公开(公告)号：US20070214620A1

    公开(公告)日：2007-09-20

    申请号：US11802352

    申请日：2007-05-22

    申请人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Teruyuki Watanabe ,  Yasuyuki Motojima

    发明人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Teruyuki Watanabe ,  Yasuyuki Motojima

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67173 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6723

    摘要： The present invention relates to a substrate processing apparatus and a substrate processing method suitable for processing a substrate with a plurality of liquids. A substrate processing apparatus comprises a substrate holding device for holding a substrate, a container having an opening portion disposed so that the opening portion is opposed to a surface, to be processed, of the substrate, a driving device for moving the container or the substrate holding device between a position at which the container approaches the substrate or a position at which the substrate enters the container, and a position at which the container is positioned away from the substrate, a first treatment liquid supply device for bringing the surface, to be processed, of the substrate which has approached or entered the container into a first treatment liquid, a covering member for covering the opening portion of the container at the position at which the container is positioned away from the substrate, and a second treatment liquid supply device for bringing the surface, to be processed, of the substrate into a second treatment liquid in a state in which the opening portion of the container is covered with the covering member.

    Substrate processing apparatus and substrate processing method
    8.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号：US07235135B2

    公开(公告)日：2007-06-26

    申请号：US10458184

    申请日：2003-06-11

    申请人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Teruyuki Watanabe ,  Yasuyuki Motojima

    发明人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Teruyuki Watanabe ,  Yasuyuki Motojima

    IPC分类号： B05C3/00

    CPC分类号： H01L21/288 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67219 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76873 ,  Y10T29/41

    摘要： The present invention relates to a substrate processing apparatus and a substrate processing method suitable for processing a substrate with a plurality of liquids. A substrate processing apparatus comprises a substrate holding device for holding a substrate, a container having an opening portion disposed so that the opening portion is opposed to a surface, to be processed, of the substrate, a driving device for moving the container or the substrate holding device between a position at which the container approaches the substrate or a position at which the substrate enters the container, and a position at which the container is positioned away from the substrate, a first treatment liquid supply device for bringing the surface, to be processed, of the substrate which has approached or entered the container into a first treatment liquid, a covering member for covering the opening portion of the container at the position at which the container is positioned away from the substrate, and a second treatment liquid supply device for bringing the surface, to be processed, of the substrate into a second treatment liquid in a state in which the opening portion of the container is covered with the covering member.

    摘要翻译： 本发明涉及适用于处理具有多种液体的基板的基板处理装置和基板处理方法。 基板处理装置包括用于保持基板的基板保持装置，具有开口部的容器，该开口部设置成使得开口部与待处理的表面相对，基板的移动容器或基板的驱动装置 保持装置在容器接近基板的位置或基板进入容器的位置之间，以及容器位于远离基板的位置，第一处理液供给装置，用于使表面成为 已经接近或进入容器的基板被处理成第一处理液体;覆盖部件，用于在容器位于远离基板的位置处覆盖容器的开口部分;以及第二处理液体供应装置 用于使基板的待处理表面在开口的状态下进入第二处理液 容器的离子被覆盖部件覆盖。

    Substrate polishing apparatus and method
    9.
    发明授权
    Substrate polishing apparatus and method 有权
    基材抛光装置及方法

    公开(公告)号：US07976362B2

    公开(公告)日：2011-07-12

    申请号：US12534465

    申请日：2009-08-03

    申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

    发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

    IPC分类号： B24B29/00

    CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

    摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

    摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

    Substrate polishing apparatus and method
    10.
    发明授权
    Substrate polishing apparatus and method 有权
    基材抛光装置及方法

    公开(公告)号：US07585205B2

    公开(公告)日：2009-09-08

    申请号：US11905687

    申请日：2007-10-03

    申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

    发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

    IPC分类号： B24B49/00

    CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

    摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

    摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。