公开(公告)号：US20090309117A1

公开(公告)日：2009-12-17

申请号：US11915921

申请日：2006-05-29

申请人： Mitsuru Okazaki ,  Naoki Takahashi ,  Akira Shimizu ,  Kenichi Nakata

发明人： Mitsuru Okazaki ,  Naoki Takahashi ,  Akira Shimizu ,  Kenichi Nakata

IPC分类号： H01L33/00 ,  H01L29/73 ,  H02H9/00

CPC分类号： H05B33/0884 ,  H01L27/0248 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/1305 ,  H01L2924/30107 ,  Y02B20/341 ,  H01L2924/00

摘要： In a protection circuit connected, via lines including an inductance component, to a circuit to be protected, a first transistor is arranged on a path to ground from a connection point of the protection circuit and the line. A second transistor is arranged on a path to ground from a connection point of the circuit to be protected and the line, and extracts, from a connection point, a current corresponding to a current flowing in the first transistor. The first and the second transistors are NPN bipolar transistors having a base and an emitter are commonly connected. A resistor is connected between the base and the emitter of the first transistor, and a diode is connected between the base and a collector.

摘要翻译： 在通过包括电感分量的线路连接到保护电路的保护电路中，第一晶体管被布置在从保护电路和线路的连接点到达的路径上。 第二晶体管被布置在从被保护电路的连接点到线路的路径上，并从连接点提取与流过第一晶体管的电流相对应的电流。 第一和第二晶体管是具有基极和发射极共同连接的NPN双极晶体管。 电阻器连接在第一晶体管的基极和发射极之间，二极管连接在基极和集电极之间。

公开(公告)号：US07889467B2

公开(公告)日：2011-02-15

申请号：US11915921

申请日：2006-05-29

申请人： Mitsuru Okazaki ,  Naoki Takahashi ,  Akira Shimizu ,  Kenichi Nakata

发明人： Mitsuru Okazaki ,  Naoki Takahashi ,  Akira Shimizu ,  Kenichi Nakata

IPC分类号： H02H9/00

CPC分类号： H05B33/0884 ,  H01L27/0248 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/1305 ,  H01L2924/30107 ,  Y02B20/341 ,  H01L2924/00

摘要： In a protection circuit connected, via lines including an inductance component, to a circuit to be protected, a first transistor is arranged on a path to ground from a connection point of the protection circuit and the line. A second transistor is arranged on a path to ground from a connection point of the circuit to be protected and the line, and extracts, from a connection point, a current corresponding to a current flowing in the first transistor. The first and the second transistors are NPN bipolar transistors having a base and an emitter are commonly connected. A resistor is connected between the base and the emitter of the first transistor, and a diode is connected between the base and a collector.

摘要翻译： 在通过包括电感分量的线路连接到保护电路的保护电路中，第一晶体管被布置在从保护电路和线路的连接点到达的路径上。 第二晶体管被布置在从被保护电路的连接点到线路的路径上，并从连接点提取与流过第一晶体管的电流相对应的电流。 第一和第二晶体管是具有基极和发射极共同连接的NPN双极晶体管。 电阻器连接在第一晶体管的基极和发射极之间，二极管连接在基极和集电极之间。

公开(公告)号：US08786092B2

公开(公告)日：2014-07-22

申请号：US13240054

申请日：2011-09-22

申请人： Mitsuru Okazaki ,  Youichi Kajiwara ,  Naoki Takahashi ,  Akira Shimizu

发明人： Mitsuru Okazaki ,  Youichi Kajiwara ,  Naoki Takahashi ,  Akira Shimizu

IPC分类号： H01L23/50

CPC分类号： H01L29/0603 ,  H01L23/50 ,  H01L23/528 ,  H01L23/5283 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor integrated circuit device includes: a rectangular shaped semiconductor substrate; a metal wiring layer formed on or over the semiconductor substrate; and a passivation layer covering the metal wiring layer. A corner non-wiring region where no portion of the metal wiring layer is formed is disposed in a corner of the semiconductor substrate. A slit is formed in a portion of the metal wiring layer which is close to the corner of the semiconductor substrate. The passivation layer includes a first passivation layer which is formed on the metal wiring layer and a second passivation layer which is formed on the first passivation layer. The first passivation layer is formed of a material that is softer than a material of the second passivation layer.

摘要翻译： 半导体集成电路器件包括：矩形半导体衬底; 形成在所述半导体衬底上或之上的金属布线层; 以及覆盖金属布线层的钝化层。 在半导体基板的角部设置没有形成金属布线层的部分的角部非布线区域。 在金属布线层的靠近半导体基板的角部的部分形成狭缝。 钝化层包括形成在金属布线层上的第一钝化层和形成在第一钝化层上的第二钝化层。 第一钝化层由比第二钝化层的材料软的材料形成。

公开(公告)号：US20090096107A1

公开(公告)日：2009-04-16

申请号：US11917186

申请日：2006-06-13

申请人： Mitsuru Okazaki ,  Youichi Kajiwara ,  Naoki Takahashi ,  Akira Shimizu

发明人： Mitsuru Okazaki ,  Youichi Kajiwara ,  Naoki Takahashi ,  Akira Shimizu

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3171 ,  H01L23/562 ,  H01L27/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a semiconductor integrated circuit device, an element forming region and a metal wiring layer are covered with a passivation layer on a semiconductor substrate which is cut out in a rectangular shape. At four corners of the device, the passivation layer is provided with corner non-wiring regions formed directly on the semiconductor substrate. Thus, crack generation on the passivation layer due to heat stress can be suppressed.

摘要翻译： 在半导体集成电路器件中，元件形成区域和金属布线层在被切割成矩形的半导体衬底上被钝化层覆盖。 在器件的四个角处，钝化层设置有直接形成在半导体衬底上的拐角非布线区域。 因此，可以抑制由于热应力引起的钝化层上的裂纹产生。

公开(公告)号：US09109276B2

公开(公告)日：2015-08-18

申请号：US12885026

申请日：2010-09-17

申请人： Koichi Kanai ,  Kiyokazu Sugiyama ,  Eiji Shiotani ,  Kimio Nishimura ,  Junichi Uchiyama ,  Kiyohisa Suzuki ,  Jun Inomata ,  Daisuke Terada ,  Akira Shimizu ,  Hidenobu Matsuyama ,  Kiyoshi Hasegawa ,  Takashi Iiya

发明人： Koichi Kanai ,  Kiyokazu Sugiyama ,  Eiji Shiotani ,  Kimio Nishimura ,  Junichi Uchiyama ,  Kiyohisa Suzuki ,  Jun Inomata ,  Daisuke Terada ,  Akira Shimizu ,  Hidenobu Matsuyama ,  Kiyoshi Hasegawa ,  Takashi Iiya

IPC分类号： C23C4/18 ,  C23C4/12 ,  C23C4/16 ,  F02F1/00 ,  B05B7/22 ,  B05B13/06

CPC分类号： C23C4/124 ,  B05B7/224 ,  B05B13/0636 ,  C23C4/12 ,  C23C4/129 ,  C23C4/16 ,  C23C4/18 ,  F02F1/00 ,  F05C2253/12 ,  Y10T29/49272 ,  Y10T428/13

摘要： A cylindrical internal surface processing method comprises forming a cylinder bore, roughening an upper section of the bore, depositing coating onto the bore, and machining a lower section of the bore and the coating. The forming of the cylinder bore includes forming the upper and lower sections with the lower section being axially spaced from the upper section and having an axial length greater than zero. The roughening creates a roughened surface such that a radially innermost edge of the roughened surface has an internal diameter smaller than an internal diameter of the lower section. The coating is deposited to cover the upper section and at least a portion of the lower section. The machining forms a tapered portion and a cylindrical portion, a radially outermost edge of the cylindrical portion having an internal diameter larger than that of a radially outermost edge of the roughened surface.

摘要翻译： 圆柱形内表面处理方法包括形成气缸孔，使孔的上部部分粗糙化，在孔上沉积涂层，以及加工孔的下部和涂层。 缸孔的形成包括形成上部和下部，其中下部与上部轴向间隔开并具有大于零的轴向长度。 粗糙化产生粗糙表面，使得粗糙表面的径向最内边缘具有小于下部内径的内径。 沉积涂层以覆盖上部和下部的至少一部分。 加工形成锥形部分和圆柱形部分，圆柱形部分的径向最外边缘的内径大于粗糙表面的径向最外边缘的内径。

公开(公告)号：US20150169591A1

公开(公告)日：2015-06-18

申请号：US14402878

申请日：2012-05-24

申请人： Michiko Yoshida ,  Akira Shimizu ,  Seisuke Tokuda ,  Kazuhiko Mogi ,  Shinji Fujiwara ,  Nobuo Kawamura ,  Masaru Kitsuregawa ,  Kazuo Goda

发明人： Michiko Yoshida ,  Akira Shimizu ,  Seisuke Tokuda ,  Kazuhiko Mogi ,  Shinji Fujiwara ,  Nobuo Kawamura ,  Masaru Kitsuregawa ,  Kazuo Goda

IPC分类号： G06F17/30

CPC分类号： G06F16/252 ,  G06F16/24532 ,  G06F16/2455 ,  G06F16/24569

摘要： A database management system (DBMS) manages a database existing in a second storage device with an access speed lower than that of a first storage device. In an execution of a query, the DBMS dynamically generates tasks two or more executable tasks in parallel. The DBMS generates task start information which is information representing a content of the execution of the task, manages the task start information, and executes a content represented by the task start information by the task. The task start information includes a data address set existing in the second storage device. The DBMS controls movement of the data address sets between the first storage device and the second storage device based on a management state of the task start information. In addition, the DBMS selects the task start information based on whether or not the data address set exists in the first storage device.

摘要翻译： 数据库管理系统（DBMS）以比第一存储设备低的访问速度来管理第二存储设备中存在的数据库。 在执行查询时，DBMS并行动态生成任务两个或多个可执行任务。 DBMS生成作为任务执行内容的信息的任务开始信息，管理该任务开始信息，并执行任务开始信息所表示的内容。 任务开始信息包括存在于第二存储装置中的数据地址集。 DBMS基于任务开始信息的管理状态，控制第一存储装置与第二存储装置之间的数据地址集的移动。 另外，DBMS根据第一存储装置中是否存在数据地址组来选择任务开始信息。

公开(公告)号：US20130159303A1

公开(公告)日：2013-06-20

申请号：US13814989

申请日：2011-02-24

申请人： Kazutomo Ushijima ,  Akira Shimizu ,  Seisuke Tokuda ,  Michiko Tanaka ,  Nobuo Kawamura ,  Norihiro Hara

发明人： Kazutomo Ushijima ,  Akira Shimizu ,  Seisuke Tokuda ,  Michiko Tanaka ,  Nobuo Kawamura ,  Norihiro Hara

IPC分类号： G06F17/30

CPC分类号： G06F17/30283 ,  G06F17/30339

摘要： A computer system, comprising: a computer for outputting a result in response to a request; and a storage system for storing data output based on the request, the computer including: a request reception module for receiving the request; a processing procedure generation module for generating a plurality of processing procedures including an order of access to the data stored in the plurality of storage devices; a data division module for dividing the data; an information obtaining module for obtaining load information indicating a load condition of the storage system; an allotment determination module for determining, based on the obtained load information, allotments for allocating the divided data to be processed by the generated plurality of processing procedures; and a processing execution module for executing, based on the determined allotments, the generated plurality of processing procedures in parallel.

摘要翻译： 一种计算机系统，包括：用于响应于请求输出结果的计算机; 以及存储系统，用于存储基于所述请求输出的数据，所述计算机包括：用于接收所述请求的请求接收模块; 处理过程生成模块，用于生成包括访问存储在所述多个存储装置中的数据的顺序的多个处理过程; 数据分割模块，用于分割数据; 信息获取模块，用于获取指示所述存储系统的负载状况的负载信息; 分配确定模块，用于基于所获得的负载信息，确定用于分配由所生成的多个处理过程来处理的划分数据的分配; 以及处理执行模块，用于基于所确定的分配，并行地执行生成的多个处理过程。

公开(公告)号：US20130084714A1

公开(公告)日：2013-04-04

申请号：US13250721

申请日：2011-09-30

申请人： Takahiro Oka ,  Akira Shimizu

发明人： Takahiro Oka ,  Akira Shimizu

IPC分类号： H01L21/31

CPC分类号： C23C16/401 ,  C23C16/30 ,  C23C16/45536 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/02167 ,  H01L21/02274 ,  H01L21/0228

摘要： A method for forming a single-phase multi-element film on a substrate in a reaction zone by PEALD repeating a single deposition cycle. The single deposition cycle includes: adsorbing a precursor on the substrate in the absence of reactant and plasma; decomposing the precursor adsorbed on the substrate by an inert gas plasma; and reacting the decomposed precursor with a reactant gas plasma in the presence of the inert gas plasma. The multi-element film contains silicon and at least two non-metal elements constituting a matrix of the film, the precursor contains silicon and optionally at least one non-metal element to be incorporated in the matrix, and the reactant gas contains at least one non-metal element to be incorporated in the matrix.

摘要翻译： 一种通过重复单个沉积循环的PEALD在反应区中在衬底上形成单相多元素膜的方法。 单个沉积循环包括：在不存在反应物和等离子体的情况下在基底上吸附前体; 通过惰性气体等离子体分解吸附在基板上的前体; 并在惰性气体等离子体存在下使分解的前体与反应气体等离子体反应。 多元素膜含有硅和构成膜的基质的至少两种非金属元素，前体含有硅和任选的至少一种待掺入基质的非金属元素，并且反应物气体含有至少一种 非金属元素加入基质中。

公开(公告)号：US08283822B2

公开(公告)日：2012-10-09

申请号：US12703372

申请日：2010-02-10

申请人： Daigo Kuraishi ,  Akira Shimizu

发明人： Daigo Kuraishi ,  Akira Shimizu

IPC分类号： H02K5/00 ,  H02K11/00

CPC分类号： H02K5/225 ,  H02K3/522 ,  H02K2203/03

摘要： A connection circuit board includes a main portion and a lead wire connecting portion. The main portion is positioned between an end portion of a motor case body and an end bracket. The lead wire connecting portion projects outwardly from the motor case body. A protective cap including a connecting portion receiving chamber for receiving the lead wire connecting portion of the connection circuit board is attached to the lead wire connecting portion through an engaging structure. An adhesive is filled in the connecting portion receiving chamber of the protective cap. In a small-sized motor of the above configuration, the protective cap can securely be fixed to the motor case.

摘要翻译： 连接电路板包括主要部分和引线连接部分。 主要部分位于马达壳体的端部和端托架之间。 引线连接部从电动机壳体向外突出。 包括用于接纳连接电路板的引线连接部分的连接部分接收室的保护盖通过接合结构附接到引线连接部分。 粘合剂填充在保护盖的连接部分接收室中。 在上述结构的小型电动机中，保护盖可以牢固地固定在电动机壳上。

公开(公告)号：US20120200951A1

公开(公告)日：2012-08-09

申请号：US13502019

申请日：2009-10-21

申请人： Takeshi Koda ,  Katsutoshi Inagaki ,  Akira Shimizu ,  Hirokazu Oishi ,  Masayoshi Yoshida ,  Tsuyoshi Hasebe ,  Tsuyoshi Namiki

发明人： Takeshi Koda ,  Katsutoshi Inagaki ,  Akira Shimizu ,  Hirokazu Oishi ,  Masayoshi Yoshida ,  Tsuyoshi Hasebe ,  Tsuyoshi Namiki

IPC分类号： G11B5/86

CPC分类号： G11B20/10 ,  G11B2020/10768 ,  G11B2020/10833 ,  G11B2220/2516 ,  G11B2220/2537

摘要： A duplication device is provided. When content is duplicated by recording, in a recording medium of a recording destination, the same content as content recorded in a recording medium of a duplication source, even if a reading speed is slower than a writing speed, the duplication device can reduce a duplication time as much as possible. The duplication device 100 reads a reading portion of content from an optical disc D in which content is recorded, and in parallel to this reading, downloads a transmission portion which includes a portion of content other than the reading portion, from a distribution server 200, and records the read reading portion and the downloaded transmission portion in the hard disc 106 at a speed faster than a speed of reading the reading portion.

摘要翻译： 提供复制设备。 当通过记录复制内容时，在记录目的地的记录介质中，与复制源的记录介质中记录的内容相同的内容，即使读取速度比写入速度慢，复制设备也可以减少重复 时间尽可能多。 复制装置100从记录有内容的光盘D读取内容的读取部分，并且与该读取并行地，从分发服务器200下载包含读取部分以外的内容的一部分的传输部分， 并将阅读部分和下载的传输部分以比阅读部分读取速度快的速度记录在硬盘106中。