公开(公告)号：US20120007112A1

公开(公告)日：2012-01-12

申请号：US13242641

申请日：2011-09-23

申请人： Motokazu YAMADA ,  Mototaka INOBE ,  Kunihiro IZUNO

发明人： Motokazu YAMADA ,  Mototaka INOBE ,  Kunihiro IZUNO

IPC分类号： H01L33/08 ,  H01L33/50 ,  H01L33/60

CPC分类号： H01L33/46 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/4945 ,  H01L2924/01322 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

摘要： A light emitting device includes a substrate, a light emitting element, an additional light emitting element, a light reflecting resin member, an electrically conductive wire, an additional electrically conductive wire, and a sealing member. The substrate is provided with a conductor wiring. The light emitting element is mounted on the substrate. The electrically conductive wire electrically connects the conductor wiring and the light emitting element with at least a part of the electrically conductive wire being embedded in the light reflecting resin member. The additional electrically conductive wire electrically connects the light emitting element and the additional light emitting element, with the additional electrically conductive wire not being in contact with the light reflecting resin member. The sealing member is disposed in a region surrounded by the light reflecting resin member to cover the light emitting element.

摘要翻译： 发光器件包括衬底，发光元件，附加发光元件，光反射树脂构件，导电线，附加导电线和密封构件。 基板设有导线。 发光元件安装在基板上。 所述导电线将所述导体布线和所述发光元件电连接，所述导电线的至少一部分嵌入在所述光反射树脂构件中。 附加的导电线将发光元件和附加的发光元件电连接，附加的导电线不与光反射树脂构件接触。 密封构件设置在由光反射树脂构件包围的区域中以覆盖发光元件。

公开(公告)号：US20090166657A1

公开(公告)日：2009-07-02

申请号：US12341189

申请日：2008-12-22

申请人： Motokazu YAMADA ,  Mototaka INOBE ,  Kunihiro IZUNO

发明人： Motokazu YAMADA ,  Mototaka INOBE ,  Kunihiro IZUNO

IPC分类号： H01L21/00

CPC分类号： H01L33/46 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/4945 ,  H01L2924/01322 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

摘要： A light emitting device includes a substrate provided with a conductor wiring, a light emitting element mounted on the substrate and a light reflecting resin member configured and arranged to reflect light emitted from the light emitting element. The light emitting device also includes at least one of an electrically conductive wire electrically connecting the conductor wiring and the light emitting element, an exposed region of the substrate on which the conductor wiring is not disposed, and a protective element mounted on the conductor wiring. At least a part of the electrically conductive wire, the exposed region or the protective element is buried in the light reflecting resin member.

摘要翻译： 一种发光器件，包括设置有导体布线的基板，安装在基板上的发光元件和被配置为布置成反射从发光元件发射的光的光反射树脂部件。 发光装置还包括电连接导体布线和发光元件的导电线，未布置导体布线的基板的暴露区域和安装在导体布线上的保护元件中的至少一个。 至少一部分导电线，暴露区域或保护元件被埋在光反射树脂构件中。