公开(公告)号：US20030034740A1

公开(公告)日：2003-02-20

申请号：US09932913

申请日：2001-08-20

Applicant: Motorola, Inc.

Inventor： Bernard F. Coll ,  Frederic Zenhausern ,  Jeremy W. Burdon ,  Chowdary R. Koripella

IPC: H05B031/26

CPC classification number: G01N21/31 ,  G01N21/05 ,  G01N2021/0112 ,  G01N2021/0346

Abstract: A microhollow cathode discharge (MHCD) cavity and microfluidic channel are combined for interrogation of samples. The apparatus includes a dielectric body and layers of conductive material defining a MHCD cavity containing an environment for carrying a gas discharge within the MHCD cavity. The gas discharge generates gas based electromagnetic waves. Electrical connections apply a cathode discharge potential to the layers of conductive material. A microfluidic channel is integrated on the substrate, and a path extends from the MHCD cavity laterally through a portion of the microfluidic channel. A detector, which may be integrated on the common substrate, is positioned to receive electromagnetic waves from the path and electronic circuitry is coupled to the detector for acquiring and processing data.

公开(公告)号：US20020174935A1

公开(公告)日：2002-11-28

申请号：US09865330

申请日：2001-05-25

Applicant: Motorola, Inc.

Inventor： Jeremy W. Burdon ,  David L. Wilcox

IPC: C03B029/00

CPC classification number: B32B18/00 ,  B32B2311/04 ,  B32B2311/08 ,  B32B2311/09 ,  B32B2315/02 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/019 ,  C04B35/111 ,  C04B35/486 ,  C04B35/565 ,  C04B35/581 ,  C04B35/584 ,  C04B35/634 ,  C04B35/63424 ,  C04B35/638 ,  C04B2235/36 ,  C04B2235/365 ,  C04B2235/656 ,  C04B2237/32 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/52 ,  C04B2237/561 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  G03F7/0017 ,  H05K1/0306 ,  H05K3/0014 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/0759

Abstract: Cast-on-resist (COR) methods of manufacturing patterned ceramic layers that can be used in forming a multilayered ceramic device are provided according to preferred exemplary embodiments of the present invention. The COR methods are comprised of processing steps that are conducted on a transporting system and include: depositing a resist on a substrate (102) and selectively exposing the resist to a radiation source (104) such that a first portion of the resist having a positive image of the pattern is soluble in a solvent and a second portion of the resist having a negative image of the pattern is insoluble in the solvent, immersing the resist in the solvent to remove the first portion to form a casting substrate having the negative image of the pattern (106), applying ceramic slurry on the casting substrate (204), curing the ceramic slurry on the casting substrate (206), and removing the ceramic slurry from the casting substrate after the curing such that a patterned ceramic layer is formed for use in a multilayered ceramic device (208).

Abstract translation: 根据本发明的优选示例性实施例提供了可用于形成多层陶瓷器件的图案化陶瓷层的抗蚀刻（COR）抗蚀剂（COR）方法。 COR方法包括在传送系统上进行的处理步骤，包括：在衬底（102）上沉积抗蚀剂并选择性地将抗蚀剂暴露于辐射源（104），使得抗蚀剂的第一部分具有阳性 图案的图像可溶于溶剂，具有图案的负像的抗蚀剂的第二部分不溶于溶剂中，将抗蚀剂浸入溶剂中以除去第一部分以形成具有负像的 图案（106），在铸造基材（204）上施加陶瓷浆料，固化铸塑基材（206）上的陶瓷浆料，以及在固化之后从铸造基材除去陶瓷浆料，使得形成图案化的陶瓷层， 用于多层陶瓷器件（208）中。

公开(公告)号：US20030037857A1

公开(公告)日：2003-02-27

申请号：US09940291

申请日：2001-08-27

Applicant: Motorola, Inc.

Inventor： Jeremy W. Burdon ,  Rong Fong Huang

IPC: C03B029/00

CPC classification number: C04B35/10 ,  B32B18/00 ,  B32B37/04 ,  B32B2309/022 ,  C04B35/632 ,  C04B35/63444 ,  C04B35/638 ,  C04B35/645 ,  C04B35/653 ,  C04B2235/36 ,  C04B2235/656 ,  C04B2235/9615 ,  C04B2237/343 ,  C04B2237/525 ,  C04B2237/62

Abstract: An intermediate low-pressure laminated ceramic device is formed from a plurality of layers of unfired ceramic material each including ceramic particles in an organic binder. A polymer interfacial layer having a glass transition temperature such that it flows at a temperature below a temperature required for the unfired ceramic layers to substantially deform, is deposited on one surface of each of the unfired ceramic layers. The unfired ceramic layers are stacked with an interfacial layer positioned between adjacent unfired ceramic layers in the stack. The stack is heated to a temperature greater than the glass transition temperature of the interfacial layers and a pressure is applied to the heated stack below approximately 1200 psi to fixedly bond the plurality of layers in the stack together.

公开(公告)号：US20030039841A1

公开(公告)日：2003-02-27

申请号：US09940290

申请日：2001-08-27

Applicant: Motorola, Inc.

Inventor： Ross A. Miesem ,  Kristen June Law ,  Jeremy W. Burdon ,  Rickey G. Pastor

IPC: B32B015/00 ,  B05D003/02

CPC classification number: C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2111/00844 ,  H01L21/4857 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/38 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/4578 ,  C04B41/5031 ,  C04B41/0072 ,  C04B41/51 ,  C04B35/10 ,  C04B35/00

Abstract: An enhanced ceramic layer is produced for use in laminated ceramic devices. A layer of unfired ceramic material is provided and a coating of dielectric material (preferably alumina) is applied on at least one surface. The dielectric material forms a reaction barrier between excess glass forced to the surface during firing and metallization positioned on the coating. The coating can be applied by screen printing, spraying a slurry of dielectric material, or spraying a slurry of dielectric material and an adhesive allowing low pressure lamination.

Abstract translation: 制造用于层压陶瓷器件的增强陶瓷层。 提供一层未焙烧的陶瓷材料，并且在至少一个表面上施加电介质材料（优选氧化铝）的涂层。 电介质材料在烧制过程中强制到表面的过剩玻璃和位于涂层上的金属化之间形成反应屏障。 可以通过丝网印刷，电介质材料的浆料喷涂或喷涂电介质材料的浆料和允许低压层压的粘合剂来施加涂层。

公开(公告)号：US20020174937A1

公开(公告)日：2002-11-28

申请号：US09953664

申请日：2001-09-13

Applicant: Motorola, Inc.

Inventor： Jeremy W. Burdon ,  David L. Wilcox

IPC: C03B029/00

CPC classification number: B32B18/00 ,  B32B2311/04 ,  B32B2311/08 ,  B32B2311/09 ,  B32B2315/02 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/019 ,  C04B35/111 ,  C04B35/486 ,  C04B35/565 ,  C04B35/581 ,  C04B35/584 ,  C04B35/634 ,  C04B35/63424 ,  C04B35/638 ,  C04B2235/36 ,  C04B2235/365 ,  C04B2235/656 ,  C04B2237/32 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/52 ,  C04B2237/561 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  G03F7/0017 ,  H05K1/0306 ,  H05K3/0014 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/0759

Abstract: Cast-on-resist (COR) methods and apparatus are provided for forming green-sheets. The COR method is comprised of depositing a resist (102) on a substrate (104) and selectively exposing the resist (102) to a radiation source such that a first portion (106) of the resist (102) having a positive image of the pattern is soluble in a solvent and a second portion (108) of the resist (102) having a negative image of the pattern is insoluble in the solvent. The COR method is also comprised of immersing the resist (102) in the solvent to remove the first portion (106) to form a casting substrate (100) having the negative image of the pattern, applying ceramic slurry (212) on the casting substrate (100), curing the ceramic slurry (212) on the casting substrate (100), and removing the ceramic slurry (212) from the casting substrate (100) after the curing.

Abstract translation: 提供抗蚀剂（COR）方法和装置用于形成生片。 COR方法包括在衬底（104）上沉积抗蚀剂（102）并选择性地将抗蚀剂（102）暴露于辐射源，使得抗蚀剂（102）的第一部分（106）具有正像 图案可溶于溶剂，并且具有图案的负像的抗蚀剂（102）的第二部分（108）不溶于溶剂。 COR方法还包括将抗蚀剂（102）浸入溶剂中以去除第一部分（106）以形成具有图案的负像的流延基底（100），将陶瓷浆料（212）施加到流延基底 （100），固化所述浇铸基材（100）上的陶瓷浆料（212），并且在固化后从所述铸塑基材（100）除去所述陶瓷浆料（212）。

公开(公告)号：US20020174936A1

公开(公告)日：2002-11-28

申请号：US09865925

申请日：2001-05-25

Applicant: Motorola, Inc.

Inventor： Jeremy W. Burdon ,  Manuel Oliver

IPC: C03B029/00

CPC classification number: B81C1/00119 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00824 ,  B32B18/00 ,  B81B2201/058 ,  B81C2201/019 ,  B81C2201/034 ,  C04B35/62218 ,  C04B2235/6567 ,  C04B2235/667 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/76 ,  H05K1/0306 ,  H05K3/0014 ,  H05K2203/0582 ,  H05K2203/0759

Abstract: A cast-on-resist (COR) method of forming a ceramic layer (114) with a recessed pattern is provided according to a preferred exemplary embodiment of the present invention. The COR method is comprised of depositing a resist (102) on a substrate (104) and selectively exposing the resist (102) to a radiation source such that a first portion (106) of the resist (102) having a positive image of the pattern is soluble in a solvent and a second portion (108) of the resist (102) having a negative image of the pattern is insoluble in the solvent. The COR method is further comprised of immersing the resist (102) in the solvent to remove the first portion (106) to form a casting substrate (110) having the negative image of the pattern, applying ceramic slurry (112) on the casting substrate (110), curing the ceramic slurry (112) on the casting substrate (110) and removing the ceramic layer (114) from the casting substrate (110) after the curing.

Abstract translation: 根据本发明的优选示例性实施例提供了形成具有凹陷图案的陶瓷层（114）的耐蚀刻（COR）方法。 COR方法包括在衬底（104）上沉积抗蚀剂（102）并选择性地将抗蚀剂（102）暴露于辐射源，使得抗蚀剂（102）的第一部分（106）具有正像 图案可溶于溶剂，并且具有图案的负像的抗蚀剂（102）的第二部分（108）不溶于溶剂。 COR方法还包括将抗蚀剂（102）浸入溶剂中以去除第一部分（106）以形成具有图案的负像的流延基底（110），将陶瓷浆料（112）施加到流延基底 （110），固化所述铸塑基材（110）上的陶瓷浆料（112）并在固化后从所述铸塑基材（110）除去所述陶瓷层（114）。

公开(公告)号：US20020066593A1

公开(公告)日：2002-06-06

申请号：US09730959

申请日：2000-12-06

Applicant: Motorola, Inc.

Inventor： Jeremy W. Burdon ,  Ross A. Miesem ,  Chowdary Ramesh Koripella

IPC: H05K001/11

CPC classification number: H05K3/4061 ,  H01L21/486 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2201/09809 ,  Y10T29/49083 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via in a first layer, filling the first via with a cross-linkable paste, curing the paste to form an electrical insulator precursor and forming the via in the insulator precursor. The electrical connection formed includes an insulator made from a cross-linked paste supported by a substrate of a multilayer ceramic package and a conductive connection supported by the insulator.

Abstract translation: 公开了一种在多层陶瓷封装中形成电隔离通孔的方法和形成在通孔内的电连接。 该方法包括在第一层中冲压第一通孔，用可交联的浆料填充第一通孔，固化糊料以形成电绝缘体前体并在绝缘体前体中形成通孔。 形成的电连接包括由多层陶瓷封装的衬底支撑的交联膏和由绝缘体支撑的导电连接器制成的绝缘体。