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    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    电子元件及其制造方法

    公开(公告)号：US20150084487A1

    公开(公告)日：2015-03-26

    申请号：US14487122

    申请日：2014-09-16

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Haruhiko MORI ,  Hiroyuki OTSUNA

    IPC: H01C7/00 ,  H01F27/28 ,  H01G4/30 ,  H01G4/008 ,  H01L41/047 ,  H01L41/083

    CPC classification number: H01C7/008 ,  H01F17/0013 ,  H01F27/292 ,  H01G4/232 ,  H01L41/0472 ,  H01L41/0477 ,  Y10T29/42 ,  Y10T29/49206

    Abstract: In an electronic component, an outer electrode includes a sintered layer including a sintered metal, a reinforcement layer not containing Sn but including Cu or Ni, an insulation layer, and a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover each end surface of the element assembly. The reinforcement layer extends on the sintered layer and covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly, extends in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.

    Abstract translation: 在电子部件中，外部电极包括烧结金属的烧结层，不含Sn但不包含Cu或Ni的加强层，绝缘层和含Sn层。 烧结层从元件组件的每个端表面延伸到其至少一个主表面上以覆盖元件组件的每个端表面。 加强层在烧结层上延伸并完全覆盖烧结层。 绝缘层直接设置在元件组件的每个端表面处的加强层上，在与元件组件的侧表面垂直或基本垂直的方向上延伸，并且限定外电极表面的一部分。 含有Sn的层覆盖加强层，除了由绝缘层覆盖的加强层的一部分，并且限定外部电极的表面的另一部分。

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    电子元件及其制造方法

    公开(公告)号：US20150084481A1

    公开(公告)日：2015-03-26

    申请号：US14487121

    申请日：2014-09-16

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Haruhiko MORI ,  Hiroyuki OTSUNA

    IPC: H01C7/00 ,  H01F17/00 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30 ,  H01G4/12

    CPC classification number: H01C7/008 ,  H01C1/148 ,  H01C7/18 ,  H01F17/0013 ,  H01F17/04 ,  H01G4/012 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/49124

    Abstract: In an electronic component, an outer electrode includes a sintered layer containing a sintered metal, an insulation layer containing an electric insulation material, and a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof so as to cover each of the end surfaces of the element assembly. The insulation layer is directly provided on the sintered layer at each of the end surfaces of the element assembly so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.

    Abstract translation: 在电子部件中，外部电极包括含有烧结金属的烧结层，含有电绝缘材料的绝缘层和含有Sn的含Sn层。 烧结层从元件组件的每个端面延伸到其至少一个主表面上，以覆盖元件组件的每个端面。 绝缘层直接设置在元件组件的每个端表面处的烧结层上，以沿与元件组件的侧表面垂直或基本垂直的方向延伸，并限定外部表面的一部分表面 电极。 含有Sn的层覆盖烧结层，除了被绝缘层覆盖的烧结层的一部分之外，构成外部电极表面的另一部分。

    CARRIER-TAPE FABRICATION DIE AND CARRIER-TAPE FABRICATION METHOD
    6.
    发明申请
    CARRIER-TAPE FABRICATION DIE AND CARRIER-TAPE FABRICATION METHOD 有权
    载体制造和载体制造方法

    公开(公告)号：US20140165802A1

    公开(公告)日：2014-06-19

    申请号：US14104910

    申请日：2013-12-12

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Haruhiko MORI ,  Hisashi YOSHIKA

    IPC: B26F1/14

    CPC classification number: B26F1/14 ,  B26F2001/4481 ,  Y10T83/04 ,  Y10T83/9425

    Abstract: A die for fabricating a carrier tape such that the carrier tape is provided with a plurality of housing holes for housing electronic components therein in a state where the housing holes are arranged in a longitudinal direction and penetrates the carrier tape in a thickness direction. The die is less prone to be damaged and is less prone to induce breakages in the interval portions between the housing holes in the carrier tape. A male die includes housing-hole formation convex portions which are constituted by a plurality of first housing-hole formation convex portions having respective tip ends at a relatively-higher heightwise position, and a plurality of second housing-hole formation convex portions having respective tip ends at a relatively-lower heightwise position.

    Abstract translation: 一种用于制造载带的模具，使得所述载带在容纳孔沿长度方向布置并在厚度方向上穿透载带的状态下设置有用于容纳电子部件的多个容纳孔。 模具不容易被损坏，并且不容易在载带中的壳体孔之间的间隔部分中引起断裂。 阳模具包括：容纳孔形成凸部，其由在相对较高的高度位置具有各自的末端的多个第一容纳孔形成凸部构成，多个第二容纳孔形成凸部具有各自的尖端 在相对较低的高度位置处结束。

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    7.
    发明申请
    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20180040397A1

    公开(公告)日：2018-02-08

    申请号：US15729762

    申请日：2017-10-11

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Haruhiko MORI ,  Hiroyuki OTSUNA

    IPC: H01C7/00 ,  H01F17/00 ,  H01L41/047 ,  H01F27/29 ,  H01G4/232

    Abstract: In an electronic component, an outer electrode includes a sintered layer including a sintered metal, a reinforcement layer not containing Sn but including Cu or Ni, an insulation layer, and a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover each end surface of the element assembly. The reinforcement layer extends on the sintered layer and covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly, extends in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.

    CARRIER TAPE, PACKAGE TAPE AND SERIES OF ELECTRONIC COMPONENTS
    8.
    发明申请
    CARRIER TAPE, PACKAGE TAPE AND SERIES OF ELECTRONIC COMPONENTS 有权
    载体带，包装带和电子部件系列

    公开(公告)号：US20140166534A1

    公开(公告)日：2014-06-19

    申请号：US14103739

    申请日：2013-12-11

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Haruhiko MORI

    IPC: H05K13/00

    CPC classification number: H05K13/0084

    Abstract: A series of electronic components formed using a carrier tape. The carrier tape is adapted to enable smoothly picking up even small-sized electronic components with a suction nozzle. The carrier tape has housing holes housing electronic components therein. The housing holes are arranged in the longitudinal direction. A top tape and a bottom tape are attached to the upper and lower surfaces of the carrier tape. Interval portions between the housing holes are provided with concave slots in their lower surfaces, thereby forming air flow paths 12. The air flow paths form air passages which enable smoothly picking up the small-sized electronic components using a suction nozzle 14.

    Abstract translation: 使用载带形成的一系列电子部件。 载带适于使用吸嘴平稳地拾取小尺寸的电子部件。 载带具有容纳电子部件的容纳孔。 容纳孔沿长度方向排列。 顶带和底带附着到载带的上表面和下表面。 壳体孔之间的间隔部分在其下表面上设有凹槽，从而形成空气流动通道12.气流通道形成空气通道，这使得能够使用吸嘴14平稳地拾取小尺寸的电子部件。

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