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公开(公告)号：US11057015B2
公开(公告)日：2021-07-06
申请号：US16529877
申请日：2019-08-02
发明人： Koichiro Kawasaki
摘要： A surface acoustic wave device includes a piezoelectric substrate and functional elements on a first surface of the piezoelectric substrate. At least a portion of the functional elements includes an interdigital transducer (IDT) electrode, and a surface acoustic wave resonator is defined by the piezoelectric substrate and the IDT electrode. A portion of a wiring pattern connecting a first functional element and a second functional element is on a second surface different from the first surface of the piezoelectric substrate.
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公开(公告)号：US10177740B2
公开(公告)日：2019-01-08
申请号：US15468143
申请日：2017-03-24
摘要： A ladder filter includes a piezoelectric substrate, an insulating film on the piezoelectric substrate, first and second electrodes provided on the piezoelectric substrate and including a pair of busbars and plurality of electrode fingers, a first line electrode at least a portion of which is defined by the busbar at one side of the first electrode, a second line electrode at least a portion of which is defined by the busbar at one side of the second electrode, and a third line electrode laminated on the second line electrode. The first line electrode and the second line electrode are electrically connected to different electric potentials. The first line electrode is separated from the second line electrode by a predetermined distance. At least a portion of the third line electrode is overlapped with at least a portion of the first line electrode with the insulating film interposed therebetween in a laminating direction.
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公开(公告)号：US20170317002A1
公开(公告)日：2017-11-02
申请号：US15654219
申请日：2017-07-19
CPC分类号： H03F3/21 , H01L23/12 , H01L23/3121 , H01L23/3677 , H01L23/49827 , H01L25/04 , H01L25/18 , H01L2224/14 , H01L2224/16225 , H01L2224/73253 , H01L2924/15313 , H01L2924/181 , H01L2924/3025 , H01L2924/00012
摘要： A power amplifier module includes a substrate, a power amplifier having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces a principal surface of the substrate, a surface acoustic wave duplexer having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces the principal surface of the substrate, a heat dissipation unit defined on another principal surface of the substrate, a heat dissipation path that connects a connecting portion between the power amplifier and the principal surface to the heat dissipation unit, an insulating resin that covers the power amplifier and the surface acoustic wave duplexer, a conductive shield that covers the insulating resin, and a first conductive unit defined on the second surface of the surface acoustic wave duplexer and electrically connected to the conductive shield.
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公开(公告)号：US11791797B2
公开(公告)日：2023-10-17
申请号：US17168329
申请日：2021-02-05
发明人： Koichiro Kawasaki
CPC分类号： H03H9/1092 , H01L23/02 , H01L23/04 , H03H9/02897 , H03H9/02937 , H03H9/02984 , H03H9/059 , H03H9/1071 , H03H9/25 , H03H9/6483
摘要： An electronic device includes an insulation material layer provided on a first main surface of a piezoelectric substrate and surrounding a functional element, and a protective layer provided on the insulation material layer. The piezoelectric substrate and the insulation material layer define a hollow portion accommodating the functional element. The protective layer includes a first portion above the hollow portion, a second portion adjacent to the first portion at one end of the second portion, and a third portion adjacent to the second portion at another end of the second portion. A distance between the first main surface and a surface of the protective layer in the thickness direction is greatest at a location where the second portion is adjacent to or in a vicinity of the first portion, and the distance is shortest at a location where the second portion is adjacent to or in a vicinity of the third portion.
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公开(公告)号：US10404226B2
公开(公告)日：2019-09-03
申请号：US15654219
申请日：2017-07-19
IPC分类号： H01L23/12 , H03F3/21 , H01L25/04 , H01L25/18 , H01L23/31 , H01L23/367 , H01L23/498
摘要： A power amplifier module includes a substrate, a power amplifier having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces a principal surface of the substrate, a surface acoustic wave duplexer having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces the principal surface of the substrate, a heat dissipation unit defined on another principal surface of the substrate, a heat dissipation path that connects a connecting portion between the power amplifier and the principal surface to the heat dissipation unit, an insulating resin that covers the power amplifier and the surface acoustic wave duplexer, a conductive shield that covers the insulating resin, and a first conductive unit defined on the second surface of the surface acoustic wave duplexer and electrically connected to the conductive shield.
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公开(公告)号：US10128816B2
公开(公告)日：2018-11-13
申请号：US15205090
申请日：2016-07-08
发明人： Morio Takeuchi , Koichiro Kawasaki , Yohei Konaka
摘要： In a high frequency module, in addition to a main transmission path in which a high-frequency signal propagates in first filter elements, a sub transmission path is defined by inductive coupling or capacitive coupling between a first inductor and a matching element or by inductive coupling between the first inductor and a second inductor. The sub transmission path has different amplitude characteristics and phase characteristics from those of the main transmission path depending on a degree of the inductive coupling or capacitive coupling, and transmission characteristics as a high-frequency module are adjustable by adjusting the amplitude characteristics and the phase characteristics of the sub transmission path.
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公开(公告)号：US11700491B2
公开(公告)日：2023-07-11
申请号：US17980614
申请日：2022-11-04
发明人： Koichiro Kawasaki
CPC分类号： H04R17/00 , H04R1/025 , H04R7/04 , H04R2400/11
摘要： An acoustic wave device includes a substrate, functional elements on a first main surface of the substrate, an outer support portion on the substrate around a region where the functional elements are disposed, a cover portion opposed to the first main surface of the substrate with the outer support portion interposed therebetween, a support portion in a hollow space defined by the substrate, the outer support portion, and the cover portion, a wiring pattern electrically connected to the functional elements, and a through electrode extending through the substrate and electrically connected to the wiring pattern. A gap is provided between the support portion and the cover portion. A distance from the first main surface of the substrate to an upper surface of the support portion is greater than a distance from the first main surface of the substrate to an upper surface of the functional elements.
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公开(公告)号：US11159143B2
公开(公告)日：2021-10-26
申请号：US16574251
申请日：2019-09-18
发明人： Koichiro Kawasaki
摘要： A filter device includes a piezoelectric substrate, first and second functional elements provided on a surface of the piezoelectric substrate, a first conductive layer provided on the surface of the piezoelectric substrate, the first conductive layer connecting the first and second functional elements to each other, an insulating layer provided at least on the first conductive layer, a cover that faces the surface of the piezoelectric substrate, a support layer located between the surface of the piezoelectric substrate and the cover, the support layer defining hollow portions, in which the first and second functional elements are provided, between the piezoelectric substrate and the cover, and a first conductor that connects the insulating layer to the cover.
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公开(公告)号：US10931258B2
公开(公告)日：2021-02-23
申请号：US16669553
申请日：2019-10-31
发明人： Koichiro Kawasaki
摘要： An electronic device includes a support layer is provided on a piezoelectric substrate and surrounds a functional element. A cover layer is located above the support layer, and faces the piezoelectric substrate. A protective layer seals the support layer and the cover layer. The support layer is provided on at least the outer periphery of the piezoelectric substrate, and defines a hollow portion within the outer periphery of the piezoelectric substrate. The protective layer includes a first portion above the hollow portion, a second portion above the support layer, and a curved surface that is convex in an opposite direction from the piezoelectric substrate.
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公开(公告)号：US10861900B2
公开(公告)日：2020-12-08
申请号：US15492037
申请日：2017-04-20
发明人： Koichiro Kawasaki
IPC分类号： H01L41/053 , H01L27/20 , H03H9/10 , H03H9/05 , H01L23/00 , H01L49/02 , H01L41/047 , H03H9/145
摘要： A circuit module includes a mounting substrate including a conductor wiring, an elastic wave element provided in or on a main surface of the mounting substrate, an electric element provided in or on the main surface, the electric element being different from the elastic wave element, and an insulating resin portion provided in or on the main surface to cover the elastic wave element and the electric element. The elastic wave element and the electric element are connected to each other by the conductor wiring. A height of the elastic wave element is about 0.28 mm or less, which is less than that of the electric element. The thickness of the resin portion in a region in which the resin portion covers the elastic wave element is greater than the thickness of the resin portion in a region in which the resin portion covers the electric element.
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