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公开(公告)号：US12183645B2
公开(公告)日：2024-12-31
申请号：US17745022
申请日：2022-05-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazunori Inoue , Shintaro Otsuka , Koichiro Kawasaki , Hidefumi Nakanishi , Masakazu Atarashi , Masahiro Fukushima
Abstract: An electronic component includes a substrate, a functional element on the substrate, a support body, a covering portion, and a protective layer covering the covering portion. The support body is provided on the substrate and around a region in which the functional element is located. The covering portion faces the substrate and is supported by the support body. The substrate, the support body, and the covering portion define a hollow space. The functional element is located in the hollow space. In the support body, a surface opposite to a surface facing the substrate is a first surface, and a portion of the protective layer is in contact with the first surface of the support body without the covering portion being interposed.
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公开(公告)号：US11791797B2
公开(公告)日：2023-10-17
申请号：US17168329
申请日：2021-02-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Koichiro Kawasaki
CPC classification number: H03H9/1092 , H01L23/02 , H01L23/04 , H03H9/02897 , H03H9/02937 , H03H9/02984 , H03H9/059 , H03H9/1071 , H03H9/25 , H03H9/6483
Abstract: An electronic device includes an insulation material layer provided on a first main surface of a piezoelectric substrate and surrounding a functional element, and a protective layer provided on the insulation material layer. The piezoelectric substrate and the insulation material layer define a hollow portion accommodating the functional element. The protective layer includes a first portion above the hollow portion, a second portion adjacent to the first portion at one end of the second portion, and a third portion adjacent to the second portion at another end of the second portion. A distance between the first main surface and a surface of the protective layer in the thickness direction is greatest at a location where the second portion is adjacent to or in a vicinity of the first portion, and the distance is shortest at a location where the second portion is adjacent to or in a vicinity of the third portion.
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公开(公告)号：US10404226B2
公开(公告)日：2019-09-03
申请号：US15654219
申请日：2017-07-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi Kitahara , Hiroaki Nakayama , Tsunekazu Saimei , Hiroki Noto , Koichiro Kawasaki
IPC: H01L23/12 , H03F3/21 , H01L25/04 , H01L25/18 , H01L23/31 , H01L23/367 , H01L23/498
Abstract: A power amplifier module includes a substrate, a power amplifier having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces a principal surface of the substrate, a surface acoustic wave duplexer having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces the principal surface of the substrate, a heat dissipation unit defined on another principal surface of the substrate, a heat dissipation path that connects a connecting portion between the power amplifier and the principal surface to the heat dissipation unit, an insulating resin that covers the power amplifier and the surface acoustic wave duplexer, a conductive shield that covers the insulating resin, and a first conductive unit defined on the second surface of the surface acoustic wave duplexer and electrically connected to the conductive shield.
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公开(公告)号：US10128816B2
公开(公告)日：2018-11-13
申请号：US15205090
申请日：2016-07-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Morio Takeuchi , Koichiro Kawasaki , Yohei Konaka
Abstract: In a high frequency module, in addition to a main transmission path in which a high-frequency signal propagates in first filter elements, a sub transmission path is defined by inductive coupling or capacitive coupling between a first inductor and a matching element or by inductive coupling between the first inductor and a second inductor. The sub transmission path has different amplitude characteristics and phase characteristics from those of the main transmission path depending on a degree of the inductive coupling or capacitive coupling, and transmission characteristics as a high-frequency module are adjustable by adjusting the amplitude characteristics and the phase characteristics of the sub transmission path.
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公开(公告)号：US12231110B2
公开(公告)日：2025-02-18
申请号：US17745443
申请日：2022-05-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazunori Inoue , Shintaro Otsuka , Koichiro Kawasaki , Hidefumi Nakanishi , Masakazu Atarashi , Masahiro Fukushima , Yasuyuki Toyota
Abstract: An electronic component includes a substrate, a functional element on the substrate, a first electrode, a support body that is made of an insulator, a cover portion, a second electrode, and a projection. The first electrode is located on the substrate and connected to the functional element. The support body protrudes from the substrate and covers the first electrode. The cover portion opposes the substrate, and a hollow space is defined by the substrate, the support body, and the cover portion. The second electrode is located in a via hole extending through the support body and the cover portion and electrically connected to the first electrode. The projection is located on the first electrode in the via hole.
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Patent Agency Ranking
公开(公告)号：US11057015B2
公开(公告)日：2021-07-06
申请号：US16529877
申请日：2019-08-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Koichiro Kawasaki
Abstract: A surface acoustic wave device includes a piezoelectric substrate and functional elements on a first surface of the piezoelectric substrate. At least a portion of the functional elements includes an interdigital transducer (IDT) electrode, and a surface acoustic wave resonator is defined by the piezoelectric substrate and the IDT electrode. A portion of a wiring pattern connecting a first functional element and a second functional element is on a second surface different from the first surface of the piezoelectric substrate.
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公开(公告)号：US10177740B2
公开(公告)日：2019-01-08
申请号：US15468143
申请日：2017-03-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Akira Michigami , Koichiro Kawasaki , Takuma Kuzushita
Abstract: A ladder filter includes a piezoelectric substrate, an insulating film on the piezoelectric substrate, first and second electrodes provided on the piezoelectric substrate and including a pair of busbars and plurality of electrode fingers, a first line electrode at least a portion of which is defined by the busbar at one side of the first electrode, a second line electrode at least a portion of which is defined by the busbar at one side of the second electrode, and a third line electrode laminated on the second line electrode. The first line electrode and the second line electrode are electrically connected to different electric potentials. The first line electrode is separated from the second line electrode by a predetermined distance. At least a portion of the third line electrode is overlapped with at least a portion of the first line electrode with the insulating film interposed therebetween in a laminating direction.
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公开(公告)号：US20170317002A1
公开(公告)日：2017-11-02
申请号：US15654219
申请日：2017-07-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi Kitahara , Hiroaki Nakayama , Tsunekazu Saimei , Hiroki Noto , Koichiro Kawasaki
CPC classification number: H03F3/21 , H01L23/12 , H01L23/3121 , H01L23/3677 , H01L23/49827 , H01L25/04 , H01L25/18 , H01L2224/14 , H01L2224/16225 , H01L2224/73253 , H01L2924/15313 , H01L2924/181 , H01L2924/3025 , H01L2924/00012
Abstract: A power amplifier module includes a substrate, a power amplifier having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces a principal surface of the substrate, a surface acoustic wave duplexer having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces the principal surface of the substrate, a heat dissipation unit defined on another principal surface of the substrate, a heat dissipation path that connects a connecting portion between the power amplifier and the principal surface to the heat dissipation unit, an insulating resin that covers the power amplifier and the surface acoustic wave duplexer, a conductive shield that covers the insulating resin, and a first conductive unit defined on the second surface of the surface acoustic wave duplexer and electrically connected to the conductive shield.
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公开(公告)号：US11700491B2
公开(公告)日：2023-07-11
申请号：US17980614
申请日：2022-11-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Koichiro Kawasaki
CPC classification number: H04R17/00 , H04R1/025 , H04R7/04 , H04R2400/11
Abstract: An acoustic wave device includes a substrate, functional elements on a first main surface of the substrate, an outer support portion on the substrate around a region where the functional elements are disposed, a cover portion opposed to the first main surface of the substrate with the outer support portion interposed therebetween, a support portion in a hollow space defined by the substrate, the outer support portion, and the cover portion, a wiring pattern electrically connected to the functional elements, and a through electrode extending through the substrate and electrically connected to the wiring pattern. A gap is provided between the support portion and the cover portion. A distance from the first main surface of the substrate to an upper surface of the support portion is greater than a distance from the first main surface of the substrate to an upper surface of the functional elements.
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公开(公告)号：US11159143B2
公开(公告)日：2021-10-26
申请号：US16574251
申请日：2019-09-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Koichiro Kawasaki
Abstract: A filter device includes a piezoelectric substrate, first and second functional elements provided on a surface of the piezoelectric substrate, a first conductive layer provided on the surface of the piezoelectric substrate, the first conductive layer connecting the first and second functional elements to each other, an insulating layer provided at least on the first conductive layer, a cover that faces the surface of the piezoelectric substrate, a support layer located between the surface of the piezoelectric substrate and the cover, the support layer defining hollow portions, in which the first and second functional elements are provided, between the piezoelectric substrate and the cover, and a first conductor that connects the insulating layer to the cover.
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