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公开(公告)号：US11089680B2
公开(公告)日：2021-08-10
申请号：US16850174
申请日：2020-04-16
发明人： Hiromasa Koyama , Ryosuke Takada , Atsushi Kasuya
摘要： A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
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公开(公告)号：US11510315B2
公开(公告)日：2022-11-22
申请号：US17368912
申请日：2021-07-07
发明人： Hiromasa Koyama , Ryosuke Takada , Atsushi Kasuya
摘要： A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
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公开(公告)号：US11259401B2
公开(公告)日：2022-02-22
申请号：US16865457
申请日：2020-05-04
发明人： Hiromasa Koyama
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/14 , H05K1/16 , H05K1/18 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/20 , H05K3/22 , H05K3/26 , H05K3/28 , H05K3/32 , H05K3/40 , H05K3/42 , H05K3/44 , H05K3/46 , H01L23/00 , H01L23/02 , H01L23/12 , H01L23/14 , H01L23/48 , H01L23/50 , H01L23/66 , H01L23/498 , H01L23/552 , H01R12/57
摘要： A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the insulating resin base material layers. A plurality of openings are provided in the ground conductor, and an aperture ratio is higher in a zone far from the signal line than in a zone adjacent to or in a vicinity of the signal line in a direction perpendicular or substantially perpendicular to the laminating direction.
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公开(公告)号：US11145586B2
公开(公告)日：2021-10-12
申请号：US16861731
申请日：2020-04-29
发明人： Kanto Iida , Hiromasa Koyama
IPC分类号： H01L23/498
摘要： An interposer includes a stacked body including insulating base material layers that are stacked on one another, first and second electrodes, a conductor pattern, and an interlayer connection conductor. The stacked body includes a first mounting surface including a first electrode, and a second mounting surface facing the first mounting surface and including a second electrode. The first electrode is electrically connected to the second electrode through the conductor pattern and the interlayer connection conductor. A length of an electrical path including conductor patterns connecting the first electrode and the second electrode is larger than a total length of the interlayer connection conductor in a stacking direction.
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公开(公告)号：US11037701B2
公开(公告)日：2021-06-15
申请号：US16181717
申请日：2018-11-06
发明人： Takahiro Baba , Lijun Zhao , Chu Xu , Hiromasa Koyama , Satoshi Matsuura
摘要： A transmission line substrate includes a stacked body that includes insulating base materials, first and second signal lines, and first and second ground conductors. The second signal line is provided on a layer different from the layer of the first signal line and extends in parallel with the first signal line. The first ground conductor is provided on the same layer as the layer of the second signal line and overlapped with the first signal line when viewed in the Z-axis direction. The second ground conductor is provided on the same layer as the layer of the first signal line and overlapped with the second signal line when viewed in the Z-axis direction. A first transmission line includes the first signal line, the first ground conductor, and an insulating base material, and a second transmission line includes the second signal line, the second ground conductor, and the insulating base material.
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6.发明授权公开(公告)号：US11257779B2
公开(公告)日：2022-02-22
申请号：US16694053
申请日：2019-11-25
摘要： A multilayer wiring board includes a first insulating layer, a second insulating layer stacked on the first insulating layer, a via conductor inside each of the first insulating layer and the second insulating layer, and a conductive bonding layer that bonds the via conductors to each other. The first insulating layer is directly bonded to the second insulating layer, and a relationship a1>b1 is satisfied, where a1 is a maximum diameter of the bonding layer and b1 is a maximum diameter of the via conductor at an interface with the bonding layer.
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公开(公告)号：US09070490B2
公开(公告)日：2015-06-30
申请号：US13928720
申请日：2013-06-27
发明人： Koji Shiroki , Yoichi Saito , Hiromasa Koyama , Hirotaka Fujii , Noboru Kato
摘要： A transmission line portion of a flat cable that is bent at a position along the longitudinal direction includes a dielectric element body, a first ground conductor, and a second ground conductor. The dielectric element body includes a signal conductor at the middle position of the thickness direction. The first ground conductor includes elongated conductors and bridge conductors. The elongated conductors are spaced in the width direction of the dielectric element body, and extend in the longitudinal direction. The bridge conductors connect the elongated conductors at spacings along the longitudinal direction. The spacing of bridge conductors across the bending point in a bent portion is smaller than the spacing of adjacent bridge conductors located in a straight portion.
摘要翻译： 扁平电缆的沿着纵向位置弯曲的传输线部分包括电介质元件本体，第一接地导体和第二接地导体。 电介质元件主体包括在厚度方向的中间位置处的信号导体。 第一接地导体包括细长导体和桥导体。 细长导体沿电介质元件主体的宽度方向间隔开，并沿纵向方向延伸。 桥导体沿着纵向方向以间隔连接细长导体。 在弯曲部分中跨越弯曲点的桥导体的间隔小于位于直线部分中的相邻桥导体的间隔。
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公开(公告)号：US12046792B2
公开(公告)日：2024-07-23
申请号：US17514215
申请日：2021-10-29
发明人： Kosuke Ooi , Shingo Ito , Hiromasa Koyama , Genro Kato , Kotaro Mishima
CPC分类号： H01P3/088 , H01P3/003 , H01P3/10 , H05K1/0242 , H05K3/28 , H05K2201/0141
摘要： A transmission line substrate includes a line portion, a base including a first main surface and a second main surface opposite to the first main surface, first and second ground conductors, and a signal line. The first ground conductor is on the first main surface side. The second ground conductor is on the second main surface side. The first ground conductor includes first conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. The second ground conductor includes second conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. A total area of the second conductor-non-formed portions is less than a total area of the first conductor-non-formed portions.
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公开(公告)号：US11984637B2
公开(公告)日：2024-05-14
申请号：US17530504
申请日：2021-11-19
发明人： Yushi Soeta , Hiromasa Koyama
CPC分类号： H01P3/088 , H01P3/003 , H05K1/0242 , H05K3/28
摘要： A transmission line includes first, second, third, and fourth signal lines, and first, second, third, and fourth electrode pads respectively connected thereto. A first main surface of an external connection portion includes a first region in which the first electrode pad and the second electrode pad are provided, and a second region in which the third electrode pad and the fourth electrode pad are provided. Each of the first electrode pad and the second electrode pad, in a plan view, is surrounded by a ground electrode, and at least one of the third electrode pad and the fourth electrode pad, in the plan view, includes a portion that is not surrounded by the ground electrode.
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公开(公告)号：US11387016B2
公开(公告)日：2022-07-12
申请号：US17245093
申请日：2021-04-30
发明人： Takahiro Baba , Lijun Zhao , Chu Xu , Hiromasa Koyama , Satoshi Matsuura
摘要： A transmission line substrate includes a stacked body that includes insulating base materials, first and second signal lines, and first and second ground conductors. The second signal line is provided on a layer different from the layer of the first signal line and extends in parallel with the first signal line. The first ground conductor is provided on the same layer as the layer of the second signal line and overlapped with the first signal line when viewed in the Z-axis direction. The second ground conductor is provided on the same layer as the layer of the first signal line and overlapped with the second signal line when viewed in the Z-axis direction. A first transmission line includes the first signal line, the first ground conductor, and an insulating base material, and a second transmission line includes the second signal line, the second ground conductor, and the insulating base material.
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