中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.019 seconds)

    ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE
    1.
    发明申请
    ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE 有权

    公开(公告)号：US20220189838A1

    公开(公告)日：2022-06-16

    申请号：US17653703

    申请日：2022-03-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Ryohei OKABE

    IPC: H01L23/31 ,  H01L21/56 ,  H01L23/552 ,  H01L25/065 ,  H01L25/16 ,  H01L23/544 ,  H01L23/00

    Abstract: An electronic component module includes a substrate, a mounting-type electronic component, a mounting-type electronic component, an insulating resin, and an insulating resin. The mounting-type electronic component is mounted on a first main surface of the substrate. The mounting-type electronic component is mounted on a second main surface of the substrate. The insulating resin covers the first main surface and the first mounting-type electronic component. The insulating resin covers the second main surface and the second mounting-type electronic component. The first mounting-type electronic component is an electronic component including a semiconductor substrate. A top surface of the semiconductor substrate of the first mounting-type electronic component opposite to the first main surface is exposed from the insulating resin. Printing is applied to the top surface, which is an exposed surface of the semiconductor substrate.

    MODULE
    2.
    发明公开
    MODULE 审中-公开

    公开(公告)号：US20230200033A1

    公开(公告)日：2023-06-22

    申请号：US18169308

    申请日：2023-02-15

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Ryohei OKABE ,  Tadashi NOMURA

    IPC: H05K9/00

    CPC classification number: H05K9/0024 ,  H05K9/0088

    Abstract: It is to provide to a module and a method of manufacturing the module in which parasitic capacitance generated between two shield films is reduced without hindering reduction in height of a module. The module includes, a substrate, a component mounted on an upper surface that is one main surface of the substrate, a first shield film provided on an upper surface of the component, sealing resin provided on an upper surface of the substrate so as to seal the component, a second shield film provided on an upper surface or an upper side of the sealing resin, and a low dielectric member arranged between the first shield film and the second shield film and having a dielectric constant lower than a dielectric constant of the sealing resin.

    HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
    3.
    发明申请
    HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS 有权

    公开(公告)号：US20230066774A1

    公开(公告)日：2023-03-02

    申请号：US18047295

    申请日：2022-10-18

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Dai NAKAGAWA ,  Takanori UEJIMA ,  Yuji TAKEMATSU ,  Naoya MATSUMOTO ,  Ryohei OKABE ,  Hiromichi KITAJIMA

    IPC: H03H9/25 ,  H04B1/38 ,  H03H9/64

    Abstract: Heat dissipating characteristics of an acoustic wave filter is improved. A high frequency module includes a mounting substrate, an acoustic wave filter, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The acoustic wave filter is arranged near the first main surface of the mounting substrate. The resin layer is arranged on the first main surface of the mounting substrate and covers an outer peripheral surface of the acoustic wave filter. The shield layer covers the resin layer and the acoustic wave filter. The shield layer is in contact with a second main surface of the acoustic wave filter that is far from the mounting substrate.

    RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
    6.
    发明申请
    RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE 有权

    公开(公告)号：US20230006708A1

    公开(公告)日：2023-01-05

    申请号：US17930834

    申请日：2022-09-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Dai NAKAGAWA ,  Takanori UEJIMA ,  Yuji TAKEMATSU ,  Naoya MATSUMOTO ,  Ryohei OKABE ,  Hiromichi KITAJIMA

    IPC: H04B1/40

    Abstract: A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a shield layer. The resin layer covers outer peripheral surfaces of the first electronic component and the second electronic component. The first electronic component includes a first substrate having first and second main surfaces opposed to each other, and a first circuit section formed on the first main surface side of the first substrate. The second electronic component includes a second substrate having first and second main surfaces opposed to each other, and a second circuit section formed on the first main surface side of the second substrate. A material of the first substrate and a material of the second substrate are the same. The shield layer is in contact with the second main surface of the first substrate and the second main surface of the second substrate.

Patent Agency Ranking