公开(公告)号：US11008451B2

公开(公告)日：2021-05-18

申请号：US16202165

申请日：2018-11-28

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Ying-Te Huang ,  Chih-Kai Chang ,  Hung-Yi Chang ,  Hao-Sheng Chen ,  Chia-Lin Liu

IPC: C08L27/18 ,  C08J5/24 ,  H05K1/03 ,  H05K1/02

Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.

公开(公告)号：US11903127B2

公开(公告)日：2024-02-13

申请号：US17381201

申请日：2021-07-21

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: H05K1/03 ,  B32B27/20 ,  B32B27/12 ,  B32B27/32

CPC classification number: H05K1/0366 ,  B32B27/12 ,  B32B27/20 ,  B32B27/322 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2264/101 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2264/301 ,  B32B2457/08 ,  H05K2201/015 ,  H05K2201/0275

Abstract: A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

公开(公告)号：US11051402B2

公开(公告)日：2021-06-29

申请号：US16664075

申请日：2019-10-25

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: H05K1/05 ,  H05K1/03

Abstract: A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 μm to 1 μm. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 μm and 100 μm.

公开(公告)号：US11890832B2

公开(公告)日：2024-02-06

申请号：US17316677

申请日：2021-05-10

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chih-Kai Chang ,  Chia-Lin Liu

IPC: B32B15/16 ,  B32B15/08 ,  B32B15/14 ,  B32B5/16

CPC classification number: B32B15/16 ,  B32B5/16 ,  B32B15/08 ,  B32B15/14 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2264/1021 ,  B32B2264/1023 ,  B32B2264/12 ,  B32B2264/201 ,  B32B2264/202 ,  B32B2307/204 ,  B32B2307/302

Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.

公开(公告)号：US10889741B2

公开(公告)日：2021-01-12

申请号：US16202173

申请日：2018-11-28

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  C08L27/18 ,  H05K1/03 ,  C09K5/14 ,  C08J5/24 ,  H05K1/02 ,  H05K3/02 ,  B32B15/082

Abstract: A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.