PIEZOELECTRIC THIN FILM AND METHOD FOR PRODUCING THE SAME
    3.
    发明申请
    PIEZOELECTRIC THIN FILM AND METHOD FOR PRODUCING THE SAME 有权
    压电薄膜及其制造方法

    公开(公告)号:US20160064645A1

    公开(公告)日:2016-03-03

    申请号:US14888278

    申请日:2014-05-22

    Abstract: A piezoelectric thin film is formed through sputtering and consists essentially of scandium aluminum nitride. The carbon atomic content is 2.5 at % or less. When producing the piezoelectric thin film, scandium and aluminum are sputtered simultaneously on a substrate from a scandium aluminum alloy target material having a carbon atomic content of 5 at % or less in an atmosphere where at least nitrogen gas exists. The sputtering may be conducted also by applying an ion beam on an opposing surface of the alloy target material at an oblique angle. Moreover, aluminum and scandium may be also sputtered simultaneously on the substrate from an Sc target material and an Al target material. As a result, a piezoelectric thin film which exhibits excellent piezoelectric properties and a method for the same can be provided.

    Abstract translation: 通过溅射形成压电薄膜,其基本上由氮化钪组成。 碳原子含量为2.5原子%以下。 当制造压电薄膜时,在至少存在氮气的气氛中,从碳原子含量为5at%以下的钪铝合金靶材同时在基板上溅射钪和铝。 也可以通过在合金靶材的相对表面上以倾斜角施加离子束来进行溅射。 此外,铝和钪也可以从Sc靶材料和Al靶材料在基板上同时溅射。 结果,可以提供表现出优异的压电性能的压电薄膜及其方法。

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