公开(公告)号：US20140319982A1

公开(公告)日：2014-10-30

申请号：US14360143

申请日：2012-12-20

Applicant: NGK Spark Plug Co., Ltd.

Inventor： Hiroaki Yamamoto ,  Yoshitaka Yoshida ,  Takatoshi Tojo ,  Naoki Kito ,  Kazushige Akita ,  Jun Suzuki

IPC: H01L23/10

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H03H9/1014 ,  H05K1/0306 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/10075 ,  H01L2924/00

Abstract: Provided is a ceramic package having a cavity in which an electronic component such as a crystal oscillator is mounted, and which realizes even joining of a metallic frame around the opening thereof, as well as reliable sealing of the opening. A ceramic package 1 includes a package main body 2 which is formed of a ceramic material, which has a front surface 3 and a back surface 4 having a rectangular shape in plan view, and which has a cavity 6 opening toward the front surface 3; a first metalized layer 11 which has a frame shape in plan view and is formed on the front surface 3; and a second metalized layer 12 which is formed on the front surface 10 of the first metalized layer 11 so as to assume a frame shape, and which has a width w2 smaller than the width w1 of the first metalized layer 11, the width w2 being measured in an inward/outward direction of the package main body 2, wherein the width w2, in the inward/outward direction, of the second metalized layer 12a at each corner portion C of the front surface 3 in plan view is smaller than the width w1, in the inward/outward direction, of the second metalized layer 12 in a region other than the corner portion C in plan view.

Abstract translation: 提供一种陶瓷封装，其具有安装有诸如晶体振荡器的电子部件的空腔，并且实现了金属框架围绕其开口的均匀接合以及可靠地密封开口。 陶瓷封装1包括由陶瓷材料形成的封装主体2，其具有前表面3和俯视图中具有矩形形状的背面4，并且具有朝向前表面3开口的空腔6; 第一金属化层11，其在平面图中具有框架形状并形成在前表面3上; 以及第二金属化层12，其形成在第一金属化层11的前表面10上以呈现框架形状，并且具有小于第一金属化层11的宽度w1的宽度w2，宽度w2为 在包装主体2的向内/向外方向上测量，其中在平面图中，前表面3的每个拐角部分C处的第二金属化层12a在向内/向外方向上的宽度w2小于宽度 在平面图中，在角部C以外的区域中的第二金属化层12的向内/向外方向w1。

公开(公告)号：US10034383B2

公开(公告)日：2018-07-24

申请号：US14597935

申请日：2015-01-15

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Kazushige Akita

IPC: H05K3/00 ,  H05K3/46 ,  H05K3/10 ,  H05K3/40 ,  H05K1/11 ,  H05K1/18

Abstract: A method of manufacturing a part-mounting package includes: forming a first through-hole in a first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in a second insulating sheet; forming a penetration conductor covering an inner surface of the second through-hole and forming a conductor layer on a surface of at least the second insulating sheet; laminating the first insulating sheet and the second insulating sheet where center positions of the first through-hole and the second through-hole are matched to each other; causing linear laser division grooves to pass through a center of the first through-hole and the second through-hole; and dividing the sheet laminated body along the laser division grooves, and causing the side surface recess part and the end face through-hole conductor to appear.

公开(公告)号：US09491867B2

公开(公告)日：2016-11-08

申请号：US14868547

申请日：2015-09-29

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takashi Kurauchi ,  Yoshitaka Yoshida ,  Kazushige Akita

IPC: H05K7/00 ,  H05K1/11 ,  H05K3/24 ,  H05K3/00 ,  H03H9/10

CPC classification number: H05K3/242 ,  H03H9/1014 ,  H05K1/113 ,  H05K3/0052 ,  H05K2203/175

Abstract: A wiring substrate includes: a substrate body made of ceramic and having a front surface and a rear surface, each having a rectangular shape in a plan view, a plurality of rear surface electrodes formed on the rear surface of the substrate body, a frame-shaped conductive portion provided on the front surface side of the substrate body, and a via conductor penetrating the substrate body and establishing electric connection between the plurality of rear surface electrodes and the frame-shaped conductive portion. A part of the rear surface is exposed between the plurality of rear surface electrodes and each side of the rear surface of the substrate body. On the rear surface of the substrate body, at least one projecting wiring is formed between each of the plurality of rear surface electrodes and each of a corresponding pair of the sides that intersect with each other.

Abstract translation: 布线基板包括：由陶瓷制成并具有前表面和后表面的基板主体，其平面图中具有矩形形状，形成在基板主体的后表面上的多个后表面电极， 设置在基板主体的前表面侧的导电部分，以及穿过基板主体并且在多个后表面电极和框状导电部分之间建立电连接的通孔导体。 后表面的一部分露出在多个后表面电极和基板主体的后表面的每一侧之间。 在基板主体的后表面上，在多个后表面电极中的每一个与彼此相交的相应的一对侧面中的每一个之间形成至少一个突出的布线。

公开(公告)号：US10448505B2

公开(公告)日：2019-10-15

申请号：US16108451

申请日：2018-08-22

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Kazushige Akita

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/20 ,  H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H01L23/15 ,  H05K3/00

Abstract: A wiring board includes recesses recessed to an inside of the wiring board, in a plan view, in portions connecting a far end surface to side surfaces, and an outer peripheral electroconductive layer disposed over a surface extending from the far end surface to the recesses. To electrically connect an electroconductive member to the outer peripheral electroconductive layer of the wiring board by, for example, joining such as soldering, the electroconductive member can be disposed in the recesses to be connected to the outer peripheral electroconductive layer. This structure prevents the electroconductive member from excessively protruding outward from the surface of the wiring board. Thus, a device having the wiring board installed therein can be made compact.

公开(公告)号：US09526172B2

公开(公告)日：2016-12-20

申请号：US14818048

申请日：2015-08-04

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Kazushige Akita

IPC: H05K1/11 ,  H01L23/12

CPC classification number: H05K1/113 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49827 ,  H05K2201/09563 ,  H05K2201/2018

Abstract: A wiring substrate includes an insulating substrate having a quadrangular planar outline; a quadrangular frame positioned on the surface of the insulating substrate along the periphery, and including an upper surface, a corner portion, and an adjacent portion, the corner portion including a width-expanded portion defining a via hole extending through the frame, the width-expanded portion including an inner wall surface having a rectilinear edge in a plan view, the adjacent portion including an inner wall surface, the inner wall surface of the width-expanded portion forming an obtuse angle with the inner wall surface of the adjacent portion; a via conductor filling the via hole and not exposed from the inner wall surface of the width-expanded portion; and a sealing metallization layer formed on the upper surface of the frame and electrically connected to the via conductor.

Abstract translation: 布线基板包括具有四边形平面轮廓的绝缘基板; 所述四边形框架沿着所述周边定位在所述绝缘基板的表面上，并且包括上表面，角部和相邻部分，所述角部包括限定穿过所述框架的通孔的宽度扩展部，所述宽度 其包括在俯视图中具有直线边缘的内壁面，相邻部分包括内壁面，宽度扩大部分的内壁面与相邻部分的内壁面形成钝角; 通孔导体，其填充所述通孔并且不从所述宽度扩展部的内壁表面露出; 以及形成在框架的上表面上并且电连接到通孔导体的密封金属化层。

公开(公告)号：US09412676B2

公开(公告)日：2016-08-09

申请号：US14360143

申请日：2012-12-20

Applicant: NGK Spark Plug Co., Ltd.

Inventor： Hiroaki Yamamoto ,  Yoshitaka Yoshida ,  Takatoshi Tojo ,  Naoki Kito ,  Kazushige Akita ,  Jun Suzuki

IPC: H05K1/03 ,  H05K1/18 ,  H01L23/10 ,  H01L21/50 ,  H03H9/10

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H03H9/1014 ,  H05K1/0306 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/10075 ,  H01L2924/00

Abstract: A ceramic package includes a package main body which is formed of a ceramic material, which has a front surface and a back surface having a rectangular shape in plan view, and which has a cavity opening toward the front surface; a first metalized layer which has a frame shape in plan view and is formed on the front surface; and a second metalized layer which is formed on the front surface of the first metalized layer so as to assume a frame shape, and which has a width smaller than the width of the first metalized layer, wherein the width of the second metalized layer at each corner portion of the front surface in plan view is smaller than the width of the second metalized layer in a region other than the corner portion in plan view.

Abstract translation: 陶瓷封装包括：由陶瓷材料形成的封装主体，其具有前表面和在俯视图中具有矩形形状的后表面，并且具有朝向前表面的开口; 第一金属化层，其平面图具有框架形状，并形成在前表面上; 以及第二金属化层，其形成在第一金属化层的前表面上以呈现框架形状，并且其宽度小于第一金属化层的宽度，其中第二金属化层的宽度 平面图中的前表面的角部比平面图中角部以外的区域的第二金属化层的宽度小。

公开(公告)号：US09313888B2

公开(公告)日：2016-04-12

申请号：US14459596

申请日：2014-08-14

Applicant: NGK Spark Plug Co., Ltd.

Inventor： Kazushige Akita

IPC: H05K1/16 ,  H05K1/11 ,  H01L23/053 ,  H03H9/10

CPC classification number: H05K1/111 ,  H01L23/053 ,  H01L2224/16225 ,  H01L2924/0002 ,  H03H9/1014 ,  H03H9/1071 ,  H01L2924/00

Abstract: Embodiments of the present packages comprise a package body that is made of an insulating material, has a front surface and a back surface, and has a rectangular shape in plan view, a metal layer that is formed along a peripheral portion of the front surface of the package body and that has a frame shape in plan view, a metal frame that is joined to the metal layer with a brazing material and has a frame shape in plan view. a pair of electrode pads that are formed on the front surface of the package body surrounded by the metal layer and configured to mount a crystal oscillator, and an opening portion of a cavity opened in a position that excludes the pair of electrode pads, wherein the metal layer, the pair of electrode pads, and the opening portion of the cavity are positioned in the same plane.

Abstract translation: 本发明的实施例包括由绝缘材料制成的封装主体，具有前表面和后表面，并且在平面图中具有矩形形状，金属层沿着前表面和后表面的周边部分形成 该封装体在平面图中具有框架形状，金属框架通过钎焊材料接合到金属层并且具有平面图中的框架形状。 一对电极焊盘，其形成在由所述金属层包围并被构造成安装晶体振荡器的所述封装体的前表面上，以及在不包括所述一对电极焊盘的位置处开放的空腔的开口部分，其中， 金属层，一对电极焊盘和空腔的开口部分位于同一平面内。