WAVELENGTH CONVERSION MEMBER FOR SOLDERING, WAVELENGTH CONVERSION DEVICE, AND LIGHT SOURCE DEVICE

    公开(公告)号:US20220347781A1

    公开(公告)日:2022-11-03

    申请号:US17624001

    申请日:2020-07-09

    Abstract: A wavelength conversion member for soldering includes a ceramic fluorescent body for converting a wavelength of light entering from an incident surface of the ceramic fluorescent body, a reflection layer disposed on a back surface of the ceramic fluorescent body on a side opposite the incident surface and partially or entirely covering the back surface, and a junction layer composed of one or more films and covering at least the reflection layer selected from the back surface of the ceramic fluorescent body and the reflection layer. The junction layer has a projecting portion which projects, in relation to an outer circumferential portion of the junction layer, in a center portion of a surface on a side opposite a surface on a side where the junction layer covers at least the reflection layer selected from the back surface and the reflection layer.

    WAVELENGTH CONVERSION MEMBER, LIGHT SOURCE DEVICE, AND METHOD FOR MANUFACTURING WAVELENGTH CONVERSION MEMBER

    公开(公告)号:US20220357027A1

    公开(公告)日:2022-11-10

    申请号:US17624081

    申请日:2020-07-09

    Abstract: A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.

    JOINED BODY AND ELECTROSTATIC CHUCK
    4.
    发明公开

    公开(公告)号:US20230226630A1

    公开(公告)日:2023-07-20

    申请号:US17922539

    申请日:2021-06-11

    CPC classification number: B23K1/19 B23K2103/166

    Abstract: A joined body includes a first member, a second member, and a joining portion disposed therebetween and joining the first member and the second member. The joining portion includes a first joining layer on a side toward the first member and formed of a first joining material, a second joining layer on a side toward the second member and formed of a second joining material, and a metal layer therebetween and having a plurality of holes communicating with one another. The metal layer includes a first-joining-material-impregnated layer on a side toward the first joining layer and in which the plurality of holes are impregnated with the first joining material, a second-joining-material-impregnated layer on a side toward the second joining layer and in which the plurality of holes are impregnated with the second joining material, and an unfilled hole layer therebetween and in which the plurality of holes are void.

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