Abstract:
A conductive member includes: a conductive member main body portion that has Vickers hardness equal to or greater than 100Hv and is made of copper or a copper alloy; and a film layer that is formed on an end face of the conductive member main body portion and is made of aluminum or an aluminum alloy. The film layer is formed by accelerating a powder material of aluminum or an aluminum alloy together with a gas heated to a temperature lower than a melting point of the powder material, spraying the powder material still remaining in a solid phase onto an end face of the conductive member main body portion, and causing the powder material to be deposited thereon.
Abstract:
A space transformer includes: a ceramic substrate that contains enstatite and boron nitride as components; a through hole running through in a thickness direction with respect to a sintered body in which the boron nitride is oriented in one direction; conductive material provided inside the through hole; and a wiring pattern including a plurality of electrodes provided on each of two principal surfaces, wherein a wiring pitch in the wiring pattern on one principal surface is different from a wiring pitch in the wiring pattern on the other principal surface.
Abstract:
A lamination includes: a substrate made of a metal or an alloy; an intermediate layer formed on a surface of the substrate and made of nickel or an alloy including nickel; and a metal film formed by accelerating, towards a surface of the intermediate layer, a powder material of aluminum or an aluminum alloy together with a gas heated to a temperature lower than a melting point of the powder material and spraying the powder material in a solid phase to the intermediate layer and causing the powder material to be deposited on the intermediate layer.
Abstract:
A space transformer includes: a ceramic substrate that contains enstatite and boron nitride as components; a through hole running through in a thickness direction with respect to a sintered body in which the boron nitride is oriented in one direction; conductive material provided inside the through hole; and a wiring pattern including a plurality of electrodes provided on each of two principal surfaces, wherein a wiring pitch in the wiring pattern on one principal surface is different from a wiring pitch in the wiring pattern on the other principal surface.