公开(公告)号：US20190265400A1

公开(公告)日：2019-08-29

申请号：US16406421

申请日：2019-05-08

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Akira GOTO

IPC: F21V8/00 ,  H01L33/50 ,  H01L33/60

Abstract: A light-emitting device includes a light-emitting element, first and second light-transmissive members disposed on the light-emitting element, a light-guiding member, and a light-reflective member. A perimeter of a lower surface of the first light-transmissive member is disposed inwardly of a perimeter of an upper surface of the light-emitting element in a plan view. The light-guiding member is in contact with a portion of lateral surfaces of the second light-transmissive member and covers the upper surface of the light-emitting element and the lower surface and lateral surfaces of the first light-transmissive member. The light-guiding member contains a resin material, and has convex lateral surfaces. The light-reflective member covers the lateral surfaces of the light-guiding member and at least the portion of the lateral surfaces of the second light-transmissive member exposed from the light-guiding member. The light-reflective member does not cover the upper surface of the second light-transmissive member.

公开(公告)号：US20180182929A1

公开(公告)日：2018-06-28

申请号：US15841769

申请日：2017-12-14

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Akira GOTO

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/00 ,  H01L23/00

CPC classification number: H01L33/38 ,  H01L24/14 ,  H01L33/005 ,  H01L33/36 ,  H01L33/382 ,  H01L33/387 ,  H01L33/486 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/1403 ,  H01L2224/1415

Abstract: A light emitting device includes a substrate, a light emitting element, a plurality of bumps and a cover member. The bumps are disposed between the substrate and the light emitting element to mount the light emitting element on the substrate. The bumps include a plurality of first bumps bonded to a first electrode of the light emitting element, and a plurality of second bumps bonded to a second electrode of the light emitting element. The first bumps are spaced apart from exposed portions of a first semiconductor layer of the light emitting element. The first bumps include a plurality of large bumps and a plurality of small bumps each having a smaller surface area than each of the large bumps in a plan view. The cover member covers the light emitting element, the bumps, and the substrate.

公开(公告)号：US20190172976A1

公开(公告)日：2019-06-06

申请号：US16268158

申请日：2019-02-05

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Akira GOTO

IPC: H01L33/38 ,  H01L23/00 ,  H01L33/60 ,  H01L33/00 ,  H01L33/50 ,  H01L33/48 ,  H01L33/36

Abstract: A light emitting device includes a substrate, a light emitting element, and a plurality of bumps. The light emitting element is mounted on the substrate. The bumps connect the substrate and the light emitting element. The bumps are arranged in a plurality of columns extending parallel to one side of an outer edge of the light emitting element. A distance between adjacent ones of the bumps in one of the columns arranged closest to the outer edge of the light emitting element is smaller than a distance between adjacent ones of the bumps arranged on an inner side of the light emitting element in a plan view.