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公开(公告)号:US20210336411A1
公开(公告)日:2021-10-28
申请号:US17239981
申请日:2021-04-26
Applicant: NICHIA CORPORATION
Inventor: Norihiro DEJIMA , Hidenori MATSUO , Masaki OMORI , Hideaki TAKEDA
IPC: H01S5/02325 , H01S5/0237
Abstract: A method of manufacturing a laser light source includes: providing a submount, the submount having a principal surface on which a laser diode chip is to be fixed, and comprising a pair of lens supports each including an end surface, the end surfaces located at opposite sides with respect to an emission end surface of the laser diode chip; providing a lens having a bonding surface; performing adjustment such that end surfaces of the pair of lens supports of the submount are parallel to a reference plane; performing adjustment such that the bonding surface of the lens is parallel to the reference plane; and while maintaining the end surfaces of the pair of lens supports and the bonding surface of the lens so as to be parallel to the reference plane, bonding the end surfaces with the bonding surface of the lens using an inorganic bonding member.
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公开(公告)号:US20200244037A1
公开(公告)日:2020-07-30
申请号:US16750503
申请日:2020-01-23
Applicant: NICHIA CORPORATION
Inventor: Masaki OMORI , Takashi MURAYAMA , Norihiro DEJIMA
Abstract: A light source unit includes: a sealed semiconductor laser package including a laser diode that includes an emitter region from which laser light is emitted, the emitter region located at a surface of the laser diode, and a window member configured to transmit the laser light; a first lens structure configured to receive the laser light transmitted through the window member and create an image of the emitter region on an image plane; and a second lens structure configured to convert the laser light having passed through the image plane into a collimated or converged beam, and to emit the collimated or converged beam.
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公开(公告)号:US20190305517A1
公开(公告)日:2019-10-03
申请号:US16367121
申请日:2019-03-27
Applicant: NICHIA CORPORATION
Inventor: Norihiro DEJIMA , Masaki OMORI
Abstract: A light source device includes: a plurality of laser sources; a plurality of collimating parts, each configured to collimate the light beam emitted from a corresponding one of the laser sources; a combining grating configured to diffract, at an identical diffraction angle, light beams that have passed through the collimating parts and are incident on the combining grating at different incident angles, to combine the diffracted light beams; and a plurality of plane transmission gratings, wherein each of the plane transmission gratings is disposed in an optical path between a corresponding one of the collimating parts and the combining grating, and wherein each of the plane transmission gratings is adjustable so as to allow selection of a wavelength of the light beam incident on the combining grating.
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公开(公告)号:US20230031544A1
公开(公告)日:2023-02-02
申请号:US17788808
申请日:2020-09-08
Applicant: NICHIA CORPORATION
Inventor: Norihiro DEJIMA , Hideaki TAKEDA , Hidenori MATSUO , Masaki OMORI
IPC: H01S5/02326 , H01S5/02253 , H01S5/02335 , H01S5/026
Abstract: A laser light source includes: a laser diode chip including an emission layer, a substrate supporting the emission layer, and an emission end surface; a submount that includes a principal surface on which the laser diode chip is fixed and a pair of lens supports located at opposite sides with respect to the emission end surface of the laser diode chip; a lens bonded to the end surfaces of the pair of lens supports; and a semiconductor laser package housing the aforementioned elements. The laser diode chip is fixed to the submount with the emission layer being closer to the submount than is the substrate. The emission end surface of the laser diode chip is located outward with respect to an edge of the principal surface. The end surfaces of the pair of lens supports are located outward with respect to the first end surface of the laser diode chip.
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公开(公告)号:US20190196122A1
公开(公告)日:2019-06-27
申请号:US16230789
申请日:2018-12-21
Applicant: NICHIA CORPORATION
Inventor: Masaki OMORI
IPC: G02B6/42
Abstract: A fastening member is configured to be removably attached to an optical fiber connector including a supporting member supporting an optical fiber and a flange part expanding outward in a radial direction. The fastening member includes a base portion and an engaging portion. The base portion defines a slit having a width smaller than a diameter of the flange part of the optical fiber connector and greater than a diameter of the supporting member of the optical fiber connector. The engaging portion extends from the base portion perpendicularly to the base portion. The engaging portion includes a spring portion at a tip portion of the engaging portion.
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公开(公告)号:US20240399496A1
公开(公告)日:2024-12-05
申请号:US18670903
申请日:2024-05-22
Applicant: NICHIA CORPORATION
Inventor: Norihiro DEJIMA , Shingo MIZUNO , Masaki OMORI
IPC: B23K26/06
Abstract: A wavelength beam combining device configured to combine collimated beams of different peak wavelengths whose central axes emitted in a first direction are arranged in a second direction intersecting the first direction, includes: an optical element configured to reduce a distance between beam central axes of the collimated beams and to cause the collimated beams with the reduced distance therebetween to exit; and first and second diffraction gratings. The first diffraction grating is disposed at a position where the collimated beams exiting from the optical element are received and to diffract the collimated beams in different directions depending on wavelengths to allow the collimated beams to enter the second diffraction grating. The second diffraction grating is configured to further diffract the collimated beams diffracted by the first diffraction grating to form a wavelength-combined beam and is configured to cause the wavelength-combined beam to exit.
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公开(公告)号:US20240047943A1
公开(公告)日:2024-02-08
申请号:US18363891
申请日:2023-08-02
Applicant: NICHIA CORPORATION
Inventor: Hisashi OGAWA , Masaki OMORI
CPC classification number: H01S5/1014 , H01S5/20 , H01S5/12 , H01S5/34346
Abstract: A semiconductor laser element includes a substrate, and a semiconductor layer portion disposed on the substrate and including a waveguide including an active layer. The waveguide includes a wide portion including a first diffraction grating, and a narrow portion that has a narrower waveguide width than the wide portion and through which light generated in the active layer propagates in a transverse multimode. The waveguide includes a first end surface including an end surface of the narrow portion, and a second end surface located on a side opposite to the first end surface. The wide portion is continuously connected to the narrow portion, and includes a first region having a waveguide width increasing from the first end surface side toward the second end surface side.
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公开(公告)号:US20220416502A1
公开(公告)日:2022-12-29
申请号:US17844474
申请日:2022-06-20
Applicant: NICHIA CORPORATION
Inventor: Hidenori MATSUO , Masaki OMORI
IPC: H01S5/02326 , H01S5/02315 , H01S5/40 , H01S5/02255
Abstract: A semiconductor laser device includes: a support base having a plurality of mounting surfaces arranged in a first direction, wherein heights of the mounting surfaces from a reference plane that is parallel to the first direction decrease stepwise or gradually along the first direction; a first semiconductor laser element secured to a first mounting surface; a second semiconductor laser element secured to a second mounting surface; a first slow-axis collimator lens secured to the first mounting surface, the first slow-axis collimator lens being located at a position at which the first laser light is incident; a second slow-axis collimator lens directly or indirectly secured to the second mounting surface, the second slow-axis collimator lens being located at a position at which the second laser light is incident; and a first sealing cover that defines an inner space in which the first and second semiconductor laser elements are held.
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公开(公告)号:US20220416501A1
公开(公告)日:2022-12-29
申请号:US17847442
申请日:2022-06-23
Applicant: NICHIA CORPORATION
Inventor: Hidenori MATSUO , Masatoshi NAKAGAKI , Masaki OMORI
IPC: H01S5/02315 , H01S5/02325 , H01S5/02345
Abstract: A laser light source includes: a submount having an upper surface; a semiconductor laser element located on the upper surface of the submount and having an end surface from which a laser beam is emitted; a lens facing the end surface of the semiconductor laser element; and a support member located on the upper surface of the submount and supporting the lens. The lens includes a collimating portion configured to collimate the laser beam emitted from the semiconductor laser element. The support member includes: a first portion and a second portion arranged at a lateral side of the submount; and a third portion that connects the first portion and the second portion and overlaps a portion of the semiconductor laser element in a plan view. The lens is supported by the first portion and the second portion via a bonding member.
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公开(公告)号:US20210265817A1
公开(公告)日:2021-08-26
申请号:US17306417
申请日:2021-05-03
Applicant: NICHIA CORPORATION
Inventor: Norihiro DEJIMA , Masaki OMORI
Abstract: A light source device includes: a plurality of laser sources; a plurality of collimating parts, each configured to collimate the light beam emitted from a corresponding one of the laser sources; a combining grating configured to diffract, at an identical diffraction angle, light beams that have passed through the collimating parts and are incident on the combining grating at different incident angles to combine the diffracted light beams; and a plurality of volume holographic gratings, wherein each of the volume holographic gratings is disposed in an optical path between a corresponding one of the laser sources and the combining grating, wherein each of the volume holographic gratings determines a wavelength of the light beam incident on the combining grating, and wherein each of the volume holographic gratings is configured to diffract a portion of the light beam emitted from a corresponding laser source back to the laser source.
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