公开(公告)号：US20220416500A1

公开(公告)日：2022-12-29

申请号：US17900544

申请日：2022-08-31

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI ,  Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: H01S5/0237 ,  B23K1/00 ,  H01S5/40 ,  H01S5/02255

Abstract: A laser package includes: a substrate having an upper surface; a first laser element disposed on the substrate and configured to emit light in a first direction; a first optical member having a lower surface bonded to the upper surface of the substrate, a reflecting surface inclined relative to the lower surface and configured to reflect the light, and an upper surface connected to the reflecting surface, the upper surface of the first optical member being located farther in the first direction than the reflecting surface; and a bonding material disposed on the upper surface of the substrate. The first optical member is bonded to the substrate via the bonding material. In a top view, a portion of the bonding material protrudes from three sides of the upper surface of the first optical member.

公开(公告)号：US20220344896A1

公开(公告)日：2022-10-27

申请号：US17727594

申请日：2022-04-22

Applicant: NICHIA CORPORATION

Inventor： Kazuya ETO ,  Soichiro MIURA ,  Takuya HASHIMOTO ,  Masatoshi NAKAGAKI

IPC: H01S5/02315 ,  H01S5/40

Abstract: A light-emitting device includes first and second light-emitting elements, upper submounts, and a lower submount. The upper submounts include a first submount having a first upper surface and a first lateral surface located on a same side as an emission end surface of the first light-emitting element, and a second submount having a second upper surface and a second lateral surface located on a same side as an emission end surface of the second light-emitting element. In a top plan view, the first lateral surface is located forward relative to the second lateral surface, and the emission end surface of the first light-emitting element is located forward relative to the emission end surface of the second light-emitting element. At least a portion of the first lateral surface is protruded forward relative to an edge along which an upper surface and a lateral surface of the lower submount meet.

公开(公告)号：US20220209497A1

公开(公告)日：2022-06-30

申请号：US17697897

申请日：2022-03-17

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI ,  Soichiro MIURA

IPC: H01S5/02355 ,  H01S5/40 ,  H01S5/0233

Abstract: A light emitting device includes first to third semiconductor laser elements. Each of the semiconductor laser elements includes at least two emitters, and configured to emit red-color light, green-color light, or blue-color light. The mount member includes first to third conduction parts, each including a plurality of metal films including mounting regions that are aligned in a predetermined direction. The first to third semiconductor laser elements are respectively mounted on the first to third conduction parts of the mount member in a junction-down configuration.

公开(公告)号：US20190006310A1

公开(公告)日：2019-01-03

申请号：US16018829

申请日：2018-06-26

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/14 ,  H01L21/52 ,  H01S5/02

CPC classification number: H01L24/31 ,  H01L21/52 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/5383 ,  H01L23/544 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0603 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01S5/0206 ,  H01S5/02212 ,  H01S5/02268 ,  H01S5/02276 ,  H01S5/02469

Abstract: A mounting component includes a main body and a metal layer. The main body has a first main surface and a second main surface. The metal layer is arranged on the first main sur face of the main body. The metal layer includes at least one concave recognition mark having an inclined surface that is inclined with respect to a main surface of the metal layer.

公开(公告)号：US20220376466A1

公开(公告)日：2022-11-24

申请号：US17750732

申请日：2022-05-23

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI ,  Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC: H01S5/02315 ,  H01S5/02355 ,  H01S5/02345

Abstract: A light emitting device includes: at least one semiconductor laser element; a submount; and a base portion having a mounting surface. The submount includes: a first lateral face being located at a side of an exiting lateral surface of the semiconductor laser element, the first lateral face intersecting the upper face of the submount, and the first lateral face being above and separated from the mounting surface; a lower face being set back inside of the submount relative to an edge at which the upper face and the first lateral face intersect in a top view; and a second lateral face being located at the same side as the first lateral face and intersecting the lower face. A portion of a bonding material protrudes from the lower face and extends outward of an edge at which the lower face and the second lateral face intersect.

公开(公告)号：US20220102332A1

公开(公告)日：2022-03-31

申请号：US17489676

申请日：2021-09-29

Applicant: NICHIA CORPORATION

Inventor： Takeshi IMAI ,  Masatoshi NAKAGAKI

IPC: H01L25/16 ,  H01L33/62

Abstract: A light-emitting device includes first and second light-emitting elements, first and second support members bonded to the first and second light-emitting elements, respectively, first and second protective elements, and a plurality of wirings including: a first wiring with one end being bonded to the first light-emitting element or the first support member; a second wiring with one end being bonded to the first light-emitting element or the first support member and the other end being bonded to the second light-emitting element or the second support member; a third wiring with one end being bonded to the first protective element or a support member equipped with the first protective element; and a fourth wiring with one end being bonded to the second protective element or a support member equipped with the second protective element.

公开(公告)号：US20200251881A1

公开(公告)日：2020-08-06

申请号：US16774516

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI ,  Soichiro MIURA

IPC: H01S5/022 ,  H01S5/40

Abstract: A mount member includes first and second conduction parts. In the first conduction part, as seen in a top view, a length in a first direction parallel to an emission end surface of a first semiconductor laser element is smaller than a length in a second direction perpendicular to the emission end surface, and, in relation to the second direction, a first wiring region extends from a first mounting region in a direction from the light emission end surface to an opposite end surface. In relation to the second direction, a second conduction part extends further than the first conduction part in a direction from an emission end surface to an opposite end surface of a second semiconductor laser element, and from a region where the second conduction part extends further than the first conduction part, the second conduction part extends toward the first conduction part in the first direction.

公开(公告)号：US20180183205A1

公开(公告)日：2018-06-28

申请号：US15854528

申请日：2017-12-26

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI ,  Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: H01S5/022 ,  H01S5/40 ,  B23K1/00

CPC classification number: H01S5/02272 ,  B23K1/0016 ,  H01S5/02292 ,  H01S5/4025 ,  H01S5/4031

Abstract: A method of manufacturing a laser package includes: providing a plurality of laser devices, each including: a submount, and an edge-emitting semiconductor laser element disposed on the submount; providing one or more optical members; providing a substrate; disposing a first bonding material and a second bonding material on the substrate; placing the plurality of laser devices on the upper surface of the substrate via the first bonding material, and placing the one or more optical members on the upper surface of the substrate via the second bonding material; and collectively heating the plurality of laser devices and the one or more optical members on the substrate without pressing the plurality of laser devices and the one or more optical members onto the substrate, so as to bond the laser devices and the one or more optical members to the substrate via the first and second bonding materials.

公开(公告)号：US20240250081A1

公开(公告)日：2024-07-25

申请号：US18627932

申请日：2024-04-05

Applicant: NICHIA CORPORATION

Inventor： Takeshi IMAI ,  Masatoshi NAKAGAKI

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L25/162 ,  H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48155 ,  H01L2224/49175 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/12041

Abstract: A light-emitting device includes first and second light-emitting elements, first and second support members, first and second protective elements, a first wiring with one end bonded to the first light-emitting element or the first support member, a second wiring with one end bonded to the first light-emitting element or the first support member and the other end bonded to the second light-emitting element or the second support member, a third wiring with one end bonded to the first protective element or the first support member and the other of end bonded to the second protective element or the second support member; and a fourth wiring with one end bonded to the first protective element or the first support member. The first and second light-emitting elements and the first and second protective elements are aligned. The third and fourth wiring do not pass directly above the first and second light-emitting elements.

公开(公告)号：US20240186207A1

公开(公告)日：2024-06-06

申请号：US18441658

申请日：2024-02-14

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA ,  Masatoshi NAKAGAKI

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/498

CPC classification number: H01L23/367 ,  H01L23/3736 ,  H01L23/49811 ,  H01L23/49838

Abstract: A method for manufacturing a semiconductor device include: providing a submount that has a first surface, a second surface located on a side opposite the first surface, and at least one lateral surface located between the first surface and the second surface, the submount including: a groove located at the second surface, a heat dissipation portion located at the second surface, at least one end face through channel located at the at least one lateral surface, and an electrode pattern on the first surface; physically joining the heat dissipation portion to a package substrate by a first joint material; and after the step of physically joining the heat dissipation portion to the package substrate, disposing a second joint material inside the at least one end face through channel to electrically connect the electrode pattern and the package substrate.