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公开(公告)号:US20180309036A1
公开(公告)日:2018-10-25
申请号:US15958445
申请日:2018-04-20
Applicant: NICHIA CORPORATION
Inventor: Takeshi AKI , Ryosuke WAKAKI
CPC classification number: H01L33/62 , H01L33/08 , H01L33/38 , H01L33/40 , H01L33/486 , H01L2933/0066
Abstract: A light source device includes an electronic component and a substrate. The electronic component includes first and second electrodes exposed at a lower surface. The first electrode includes first and second parts separated from each other by a separation region on the lower surface of the electronic component. The substrate includes a basal member and a first and second wiring layers disposed on an upper surface of the basal member. The electronic component is mounted to the substrate so that upper surfaces of the first and second wiring layers respectively face the first and second electrodes. The substrate includes a first region at a position overlapping the separation region as seen in a top view. Solder wettability of the substrate in the first region is lower than solder wettability of the substrate in at least regions of the first wiring layer facing the first and second parts of the first electrode.
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2.
公开(公告)号:US20160247978A1
公开(公告)日:2016-08-25
申请号:US15050713
申请日:2016-02-23
Applicant: NICHIA CORPORATION
Inventor: Masashi ISHIDA , Yoshiyuki IDE , Tatsuya HAYASHI , Tadayuki KITAJIMA , Takeshi AKI
CPC classification number: H01L33/486 , H01L23/49838 , H01L33/62 , H01L2224/48227 , H01L2224/73204 , H01L2224/83192 , H01L2924/12041 , H05K1/111 , H05K1/115 , H05K3/3431 , H05K2201/09663 , H05K2201/0969 , H05K2201/10106 , Y02P70/611
Abstract: A mounting substrate includes: a base; and at least one pair of wiring patterns disposed apart from each other on the base. At least one of the wiring patterns has a mounting portion, which is configured to support an electronic part thereon and which is rectangular in a plan view. The at least one of the wiring patterns defines a hole, which exposes a part of the base and which is disposed in at least a part of an outer edge of the mounting portion.
Abstract translation: 安装基板包括:基座; 以及在基座上彼此分开布置的至少一对布线图案。 布线图案中的至少一个具有安装部,其被构造成在其上支撑电子部件,并且在俯视图中为矩形。 所述布线图案中的至少一个限定了孔,所述孔露出所述基部的一部分并且设置在所述安装部的外边缘的至少一部分中。
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