公开(公告)号：US20160064628A1

公开(公告)日：2016-03-03

申请号：US14888182

申请日：2014-05-01

Applicant: NITTO DENKO CORPORATION

Inventor： Hironaka FUJII ,  Akito NINOMIYA

IPC: H01L33/50 ,  H01L33/62 ,  H05K1/02

CPC classification number: H01L33/505 ,  H01L33/502 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/0274 ,  H05K1/0373 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A circuit board includes a phosphor-containing board for mounting an optical semiconductor element at one side thereof in a thickness direction and an electrode wire laminated at the one side in the thickness direction of the phosphor-containing board so as to be electrically connected to the optical semiconductor element.

Abstract translation: 电路板包括用于在厚度方向的一侧安装光学半导体元件的含磷光体板和层叠在含荧光体板的厚度方向上的一侧的电极线，以便电连接到 光学半导体元件。

公开(公告)号：US20160284951A1

公开(公告)日：2016-09-29

申请号：US14778196

申请日：2014-03-10

Applicant: NITTO DENKO CORPORATION

Inventor： Akito NINOMIYA ,  Hisataka ITO ,  Yasunari OOYABU ,  Shigehiro UMETANI ,  Munehisa MITANI

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2933/005 ,  H01S5/02228 ,  H01L2924/00014

Abstract: A method for producing an LED device 5 producing an LED device 5 by encapsulating an LED 4 by an encapsulating sheet 1 includes a sheet producing step of producing the encapsulating sheet 1 and an encapsulating step of encapsulating the LED 4 by the encapsulating sheet 1. Time T from producing the encapsulating sheet 1 in the sheet producing step to encapsulating the LED 4 by the encapsulating sheet 1 in the encapsulating step is 24 hours or less.

Abstract translation: 通过封装片1封装LED4来制造LED器件5的LED器件5的制造方法包括：制造密封片1的片材制造工序以及由密封片1封装LED 4的封装工序。时间 在封装工序中，通过密封片1将LED 4封装在片材制造工序中，制造密封片1的T为24小时以下。