Abstract:
A circuit board includes a phosphor-containing board for mounting an optical semiconductor element at one side thereof in a thickness direction and an electrode wire laminated at the one side in the thickness direction of the phosphor-containing board so as to be electrically connected to the optical semiconductor element.
Abstract:
A phosphor adhesive sheet includes a phosphor layer containing a phosphor and an adhesive layer laminated on one surface in a thickness direction of the phosphor layer. The adhesive layer is formed from a silicone pressure-sensitive adhesive composition. A percentage of the peel strength of the phosphor adhesive sheet is 30% or more.
Abstract:
A wavelength conversion bonding member includes a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element, wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, and the bonding layer has a reflectivity of 90% or more.
Abstract:
The present invention relates to a composite film including a wavelength conversion layer and a diffusive reflection resin layer in a laminated state and being used in a semiconductor light emitting device, in which the wavelength conversion layer contains a phosphor material which absorbs a part or all of excitation light and is excited to emit visible light in a wavelength region longer than a wavelength of the excitation light, the diffusive reflection resin layer is selectively formed with patterning on one surface of the wavelength conversion layer, and a region on the one surface of the wavelength conversion layer where the diffusive reflection resin layer is not formed with patterning is a path of the excitation light which excites the phosphor material in the wavelength conversion layer.
Abstract:
The method for producing a phosphor plate includes, in sequence, a step (1), in which a phosphor sheet is prepared, a step (2), in which through holes and penetration faces fronting the through holes are formed in the phosphor sheet, and a step (3), in which the phosphor sheet is cut to form a plurality of phosphor plates including the penetration faces.
Abstract:
The phosphor ceramic has pores with a pore diameter of 3.0 μm or more and 12.0 μm or less. In the phosphor ceramic, a pore volume percentage of pores with a pore diameter of 3.0 μm or more and 12.0 μm or less is 1.5% by volume or more and 9.5% by volume or less.
Abstract:
A method for producing a wavelength conversion member includes disposing a phosphor ceramic layer on a substrate; removing a portion of the phosphor ceramic layer so that a plurality of phosphor ceramic elements are disposed in a direction perpendicular to the thickness direction of the substrate in spaced-apart relation; forming a cover layer containing an inorganic substance on the substrate so as to cover the surface of the phosphor ceramic element; and cutting the cover layer and the substrate in the thickness direction so as to include at least one of the phosphor ceramic elements.
Abstract:
A ceramic plate having a flat plate shape includes a cut-out portion that is cut out inwardly from a peripheral end surface. An end surface defining the cut-put portion inclines in a thickness direction of the ceramic plate.
Abstract:
A method for producing a wavelength conversion member includes preparing an element-disposed substrate including a substrate, a plurality of phosphor ceramic elements disposed on the substrate in spaced-apart relation in a direction perpendicular to the thickness direction of the substrate; embedding the plurality of phosphor ceramic elements in a curable layer containing the inorganic substance; producing a cover layer by curing the curable layer; and cutting the cover layer and the substrate in the thickness direction so as to include at least one of the phosphor ceramic elements.
Abstract:
A phosphor layer attaching kit includes a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package. A percentage of the peel strength of the silicone pressure-sensitive adhesion composition is 30% or more.