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公开(公告)号:US20180328580A1
公开(公告)日:2018-11-15
申请号:US16062164
申请日:2016-12-12
Applicant: NITTO DENKO CORPORATION
Inventor: Teppei TEZUKA , Yuuzou MURAKI , Kazuhiro OMURA , Koji FURUUCHI
CPC classification number: F21V31/03 , B01D53/261 , B01D53/263 , B01D53/268 , B01D2251/402 , B01D2251/404 , B01D2251/60 , B01D2251/602 , B01D2253/106 , B01D2253/108 , B01D2253/11 , B01D2259/4508 , B60H1/00271 , F21S43/00 , F21S45/10 , F21S45/33 , F21S45/50 , F21V31/005 , H05K5/06
Abstract: A holding member mounted to the case including the internal space, a holding member including the ventilation hole that provides ventilation between the internal space and the external space; a humidity-conditioning member provided midway in the ventilation hole of the holding member and absorbing water vapor; and a ventilation filter provided to the holding member, a ventilation filter being closer to the external space than the humidity-conditioning member is, a ventilation filter being permeable to a gas and preventing a liquid and a sold from entering the internal space.
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公开(公告)号:US20220410519A1
公开(公告)日:2022-12-29
申请号:US17781131
申请日:2020-11-02
Applicant: NITTO DENKO CORPORATION
Inventor: Yuuzou MURAKI , Kurato AKIBA
Abstract: A provided heat-resistant cushioning sheet is a heat-resistant cushioning sheet configured to be disposed between a thermocompression face of a thermocompression apparatus and a target in thermocompression treatment of the target to prevent direct contact between the target and the thermocompression face, wherein a compression strain change amount ΔS250 being a difference S250−S25 between a compression strain S25 at 25° C. and a compression strain S250 at 250° C. is −5% or more. S25 and S250 are each a compression strain ST of the heat-resistant cushioning sheet evaluated by thermomechanical analysis (TMA), S25 is evaluated at an evaluation temperature of 25° C., and S250 is evaluated at an evaluation temperature of 250° C. The compression strain ST is determined by an equation ST=(t1−t0)/t0×100(%), where to is a thickness of the heat-resistant cushioning sheet at 25° C. and t1 is a thickness of the heat-resistant cushioning sheet.
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公开(公告)号:US20170292000A1
公开(公告)日:2017-10-12
申请号:US15513736
申请日:2015-09-24
Applicant: NITTO DENKO CORPORATION
Inventor: Satoru FURUYAMA , Masaaki MORI , Yozo NAGAI , Yuuzou MURAKI , Toshimitsu TACHIBANA , Hajime YAMAMOTO
IPC: C08J5/18 , C08J7/12 , C08J7/04 , B25J15/06 , H01G4/12 , H05K5/02 , G10K13/00 , B01D71/48 , C04B33/32
CPC classification number: C08J5/18 , B01D71/48 , B01D2325/022 , B01D2325/38 , B25J15/0691 , C04B33/32 , C04B2235/66 , C08J7/04 , C08J7/12 , C08J7/123 , C08J9/00 , C08J2367/02 , G10K13/00 , H01G4/12 , H05K5/0217 , H05K5/06
Abstract: The polymer film of the present invention has through holes extending from one principal surface of the polymer film to the other principal surface of the polymer film. The through holes are straight holes having a central axis extending straight, and have a shape in which the area of a cross-section perpendicular to the direction of the central axis increases from the one principal surface of the polymer film toward the other principal surface. This polymer film has passages in its thickness direction, has an unconventional structure, and can be used in various applications, such as in a waterproof sound-permeable membrane, in a waterproof gas-permeable membrane, and in a suction sheet. The ratio a/b of the opening diameter a of the through holes at the one principal surface to the opening diameter b of the through holes at the other principal surface is 80% or is less than 80%.
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公开(公告)号:US20230173795A1
公开(公告)日:2023-06-08
申请号:US17924038
申请日:2021-04-30
Applicant: NITTO DENKO CORPORATION
Inventor: Yuuzou MURAKI , Kurato AKIBA
CPC classification number: B32B27/08 , B32B27/285 , B32B27/322 , B32B7/12 , B32B7/02 , B29C43/32 , C08J5/18 , C08J7/04 , B32B2307/306 , C08J2327/18
Abstract: A provided heat-resistant cushioning sheet is a sheet configured to be disposed between a thermocompression face of a thermocompression apparatus and a target in a thermocompression treatment of the target, and includes: a substrate including a fluorine resin; and a coating layer including a heat-resistant resin and disposed on a one principal surface side of the substrate. One exposed surface of the heat-resistant cushioning sheet is formed by the coating layer. The heat-resistant resin is a resin other than a fluorine resin and has a melting point of 280° C. or higher and/or a glass transition temperature of 210° C. or higher. The provided heat-resistant cushioning sheet is well adapted to expected further increases in treatment temperature and pressure.
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公开(公告)号:US20230158718A1
公开(公告)日:2023-05-25
申请号:US17916100
申请日:2021-03-23
Applicant: NITTO DENKO CORPORATION
Inventor: Yuuzou MURAKI , Masahiro ARAI , Kurato AKIBA , Toshimitsu TACHIBANA
CPC classification number: B29C39/26 , C08J5/18 , B29C43/34 , B29C55/005 , B29C55/04 , C08J2327/18
Abstract: A heat-resistant release sheet is configured to be disposed, when a resin or a target including a resin is used in a step involving heating and melting of the resin, between the resin or the target and a member to be brought into contact with the resin or the target to prevent direct contact between the resin or the target and the member. The sheet includes a skived sheet including polytetrafluoroethylene (PTFE) or a modified PTFE. A content of a tetrafluoroethylene (TFE) unit in the modified PTFE is 99 mass % or more. In each of two directions being in-plane directions of the heat-resistant release sheet and being perpendicular to each other, a rate of dimensional shrinkage induced by heating at 175° C. for 30 minutes is more than 0%. The sheet includes the skived sheet including the heat-resistant resin but prevents occurrence of problems attributable to inclusion of the skived sheet.
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公开(公告)号:US20160304679A1
公开(公告)日:2016-10-20
申请号:US14778482
申请日:2014-03-26
Applicant: NITTO DENKO CORPORATION
Inventor: Satoru FURUYAMA , Yuuzou MURAKI , Yozo NAGAI , Ichiro AMINO , Yosuke YURI , Takahiro YUYAMA , Tomohisa ISHIZAKA , Ikuo ISHIBORI , Ken-ichi YOSHIDA , Yasunari MAEKAWA , Hiroshi KOSHIKAWA , Tetsuya YAMAKI , Masaharu ASANO
CPC classification number: C08J5/18 , C08J7/123 , C08J2300/20
Abstract: The method of the present disclosure includes: (I) irradiating a polymer film (1) with an ion beam composed of ions (2) accelerated in a cyclotron so as to form a polymer film that has collided with the ions in the beam; and (II) chemically etching the polymer film formed in the irradiation (I) so as to form openings (4b) and/or through holes (4a) corresponding to tracks (3) left by the colliding ions in the polymer film. In the irradiation (I), a beam current value of the ion beam is detected upstream and/or downstream of the polymer film in a path of the ion beam, and an irradiation conditioning factor in the irradiation of the polymer film with the ion beam is controlled based on the detected beam current value so that the polymer film can be irradiated with the ions at a predetermined irradiation density. The method of the present disclosure is suitable for industrial production of porous polymer films.
Abstract translation: 本公开的方法包括:(I)用在回旋加速器中加速的离子(2)组成的离子束照射聚合物膜(1),以形成与梁中的离子相撞的聚合物膜; 和(II)化学蚀刻在照射(I)中形成的聚合物膜,从而形成与聚合物膜中的碰撞离子留下的轨道(3)相对应的开口(4b)和/或通孔(4a)。 在照射(I)中,在离子束的路径中在聚合物膜的上游和/或下游检测离子束的束电流值,并且在离子束照射聚合物膜时照射调节因子 基于检测到的光束电流值进行控制,使得聚合物膜可以以预定的照射密度照射离子。 本公开的方法适用于工业生产多孔聚合物膜。
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