公开(公告)号：US20170358900A1

公开(公告)日：2017-12-14

申请号：US15498422

申请日：2017-04-26

Applicant: NLIGHT, INC.

Inventor： Manoj KANSKAR ,  Johannes BOELEN

IPC: H01S5/024 ,  H01S5/40 ,  H01S5/022

CPC classification number: H01S5/02423 ,  H01S3/094003 ,  H01S3/09415 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02438 ,  H01S5/02469 ,  H01S5/4012 ,  H01S5/4025

Abstract: A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount. The device further comprising a housing coupled to the LSLD assembly, the housing comprising a carrier structure having an aperture configured to support the LSLD assembly on a first side and having a plurality of channels on a second side, a bottom segment configured to couple to the carrier segment to create an enclosure around the channels between a top side of the bottom segment and the second side of the carrier structure, an inlet and outlet formed in the housing for transporting a coolant into and out of the channels in the enclosure, wherein the members are disposed within the enclosure so as to expose the members to the coolant.

公开(公告)号：US20190052050A1

公开(公告)日：2019-02-14

申请号：US16154510

申请日：2018-10-08

Applicant: NLIGHT, INC.

Inventor： Manoj KANSKAR ,  Johannes BOELEN

IPC: H01S5/024 ,  H01S5/40 ,  H01S5/022 ,  H01S3/0941 ,  H01S3/094

Abstract: A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount. The device further comprising a housing coupled to the LSLD assembly, the housing comprising a carrier structure having an aperture configured to support the LSLD assembly on a first side and having a plurality of channels on a second side, a bottom segment configured to couple to the carrier segment to create an enclosure around the channels between a top side of the bottom segment and the second side of the carrier structure, an inlet and outlet formed in the housing for transporting a coolant into and out of the channels in the enclosure, wherein the members are disposed within the enclosure so as to expose the members to the coolant.