Coplanar electrode photodiode array and manufacturing method thereof

    公开(公告)号:US10411051B2

    公开(公告)日:2019-09-10

    申请号:US15580848

    申请日:2016-08-31

    摘要: A coplanar electrode photodiode array and a manufacturing method thereof are disclosed. On a top side of a low resistance rate substrate, a high resistance epitaxial silicon wafer, a first conductive type heavily doped region and a second conductive type doped region are formed, which are a cathode and an anode of a photodiode respectively. The structure includes a trench structure formed between the anode and the cathode, the trench structure may be form by a gap, an insulating material, a conductive structure, a reflective material, and ion implantation, and also includes a first conductive type heavily doped region, an insulating isolation layer or a conductive structure with an insulating layer, and the like formed under the anode and the cathode.

    Photodiode device, photodiode detector and methods of fabricating the same

    公开(公告)号:US11189741B2

    公开(公告)日:2021-11-30

    申请号:US16343983

    申请日:2017-09-12

    摘要: According to an embodiment, a method of fabricating a photodiode device may include: growing an epitaxial layer on a first surface of a substrate, wherein the epitaxial layer is first type lightly doped; forming, in the substrate, a first type heavily doped region in contact with the first type lightly doped epitaxial layer; thinning the substrate from a second surface of the substrate opposite to the first surface to expose the first type heavily doped region; patterning the first type heavily doped region from the second surface side of the substrate to form a trench therein, that penetrates through the first type heavily doped region and extends into the epitaxial layer, to serve as a first electrode region of the photodiode device; and forming a second type heavily doped region at bottom of the trench, to serve as a second electrode region of the photodiode device.

    Photodiode device and photodiode detector

    公开(公告)号:US11011656B2

    公开(公告)日:2021-05-18

    申请号:US16467623

    申请日:2017-08-08

    摘要: A photodiode device and a photodiode detector are provided. According to an embodiment, the photodiode device may include a first type lightly doped semiconductor base including a first surface and a second surfaces opposite to each other, a first electrode region being first type heavily doped and disposed on the first surface of the semiconductor base, a second electrode region being second type heavily doped and disposed on the second surface of the semiconductor base, wherein the first surface is a light incident surface.

    Semiconductor detector
    6.
    发明授权

    公开(公告)号:US10101473B2

    公开(公告)日:2018-10-16

    申请号:US15606071

    申请日:2017-05-26

    摘要: The present disclosure provides a semiconductor detector. The semiconductor detector comprises: a detector crystal including a crystal body, an anode and a cathode; a field enhance electrode for applying a voltage to the detector crystal; an insulating material disposed between the field enhanced electrode and a surface of the detector crystal. The semiconductor detector further comprises a field enhanced electrode circuit board having a bottom connection layer in contact with the surface of the detector crystal and a top layer opposite to the bottom connection layer, wherein the top layer is connected to a high voltage input terminal of the semiconductor detector, and an insulating material is provided between the bottom connection layer and the detector surface of the detector crystal.

    Terahertz detector
    7.
    发明授权

    公开(公告)号:US10775302B2

    公开(公告)日:2020-09-15

    申请号:US16232318

    申请日:2018-12-26

    摘要: The present disclosure provides a terahertz detector. The terahertz detector includes a planar array structure that is constituted by a plurality of pixel units, the plurality of pixel units each include N sub pixels and each of the sub pixels includes no more than one signal trigger configured to transform a terahertz signal to an electrical current pulsing signal, and each of the plurality of pixel units detects a signal that is a sum of the electrical current pulsing signals of the N sub pixels, where N is an integer greater than 1.

    Semiconductor detector
    9.
    发明授权

    公开(公告)号:US10388818B2

    公开(公告)日:2019-08-20

    申请号:US15625473

    申请日:2017-06-16

    摘要: There is provided a semiconductor detector. According to an embodiment, the semiconductor detector may include a semiconductor detection material including a first side and a second side opposite to each other. One of the first side and the second side is a ray incident side that receives incident rays. The detector may further include a plurality of pixel cathodes disposed on the first side and a plurality of pixel anodes disposed on the second side. The pixel anodes and the pixel cathodes correspond to each other one by one. The detector may further include a barrier electrode disposed on a periphery of respective one of the pixel cathodes or pixel anodes on the ray incident side. According to the embodiment of the present disclosure, it is possible to effectively suppress charge sharing between the pixels and thus to improve an imaging resolution of the detector.

    TERAHERTZ DETECTOR
    10.
    发明申请
    TERAHERTZ DETECTOR 审中-公开

    公开(公告)号:US20190234870A1

    公开(公告)日:2019-08-01

    申请号:US16232318

    申请日:2018-12-26

    IPC分类号: G01N21/3581 G01J1/44

    摘要: The present disclosure provides a terahertz detector. The terahertz detector includes a planar array structure that is constituted by a plurality of pixel units, the plurality of pixel units each include N sub pixels and each of the sub pixels includes no more than one signal trigger configured to transform a terahertz signal to an electrical current pulsing signal, and each of the plurality of pixel units detects a signal that is a sum of the electrical current pulsing signals of the N sub pixels, where N is an integer greater than 1.