公开(公告)号：US20050081345A1

公开(公告)日：2005-04-21

申请号：US10688032

申请日：2003-10-15

申请人： Nancy Tolan ,  Mark Clarner ,  William MC Dougall ,  Normand Cote ,  Howard Kingsford ,  Paul Erickson ,  Clinton Dowd

发明人： Nancy Tolan ,  Mark Clarner ,  William MC Dougall ,  Normand Cote ,  Howard Kingsford ,  Paul Erickson ,  Clinton Dowd

IPC分类号： A44B18/00 ,  D04B21/04

CPC分类号： D04B21/04 ,  A44B18/0003 ,  A44B18/0034 ,  A44B18/0061 ,  B29C2043/465 ,  B29L2031/729 ,  D04B21/20 ,  D10B2501/0632 ,  Y10T24/2742 ,  Y10T24/2775 ,  Y10T24/2792

摘要： A releasable touch fastener includes a loop component and a hook component, with a particularly small overall engaged thickness in combination with a high fastening strength, both in peel and shear. The loop component is a woven material, while the hook component may be woven or molded. The molded hook component includes a scrim reinforcement for tear resistance and sewability. The fastener is useful for high cycle applications, such as on non-disposable garments, footwear and luggage.

摘要翻译： 可释放的接触紧固件包括环部件和钩部件，其具有特别小的整体接合厚度以及在剥离和剪切中的高紧固强度。 环组件是编织材料，而钩部件可以被编织或模制。 模制的钩部件包括用于抗撕裂性和缝合性的稀松布加强件。 紧固件可用于高周期应用，例如非一次性衣服，鞋类和行李箱。

公开(公告)号：US07964542B2

公开(公告)日：2011-06-21

申请号：US11330922

申请日：2006-01-12

申请人： Krishna G. Sachdev ,  Harbans Singh Sachdev, legal representative ,  Mark S. Chace ,  Normand Cote ,  David L. Gardell ,  Jeffrey D. Gelorme ,  Sushumna Iruvanti ,  G. John Lawson ,  Tuknekah M. Noble

发明人： Krishna G. Sachdev ,  Mark S. Chace ,  Normand Cote ,  David L. Gardell ,  Jeffrey D. Gelorme ,  Sushumna Iruvanti ,  G. John Lawson ,  Tuknekah M. Noble

IPC分类号： C10M141/10 ,  C10M137/04 ,  C10M129/68

CPC分类号： C10M129/10 ,  C09K5/10 ,  C10M137/02 ,  C10M2205/0285 ,  C10M2207/024 ,  C10M2207/026 ,  C10M2215/064 ,  C10M2223/049 ,  C10N2230/08 ,  C10N2230/10 ,  C10N2240/201

摘要： Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.

摘要翻译： 提供了含有特定受阻酚或受阻酚与芳族亚磷酸酯组合的液体组合物，其用于在电子部件的测试过程期间用作散热器和芯片之间的热界面，该组合物增强了散热器和 芯片，在测试程序之后容易地从散热器和芯片上移除而没有任何有害的残留物，并且允许在测试过程中长时间使用高温而没有组合物的任何显着降解。 还提供了一种在诸如老化程序的电子部件测试程序中使用组合物的方法。

公开(公告)号：US07259580B2

公开(公告)日：2007-08-21

申请号：US10906483

申请日：2005-02-22

申请人： Paul J. Aube ,  Normand Cote ,  Roger G. Gamache, Jr. ,  David L. Gardell ,  Paul M. Gaschke ,  Marc D. Knox ,  Denis Turcotte

发明人： Paul J. Aube ,  Normand Cote ,  Roger G. Gamache, Jr. ,  David L. Gardell ,  Paul M. Gaschke ,  Marc D. Knox ,  Denis Turcotte

IPC分类号： G01R31/26

CPC分类号： G01R31/2875 ,  G01R31/2867 ,  G01R31/2868

摘要： A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.

摘要翻译： 一种用于测试电子设备的方法，系统和装置。 该方法包括：（a）在电子设备的表面上形成临时液体传热层; 在步骤（a）之后，（b）将散热片的表面与传热层的表面物理接触; 在步骤（b）之后，（c）电测试电子设备; 在步骤（c）之后，（d）去除散热片与传热层的接触; 并且在步骤（d）之后，（e）从电子设备的表面去除残留在电子设备上的任何传热层。

公开(公告)号：US20050081341A1

公开(公告)日：2005-04-21

申请号：US10688033

申请日：2003-10-15

申请人： William McDougall ,  Normand Cote

发明人： William McDougall ,  Normand Cote

IPC分类号： A44B18/00

CPC分类号： A44B18/0034 ,  Y10T24/2733

摘要： A woven loop fastener product including a fabric base having ground yarns including interwoven warp yarns and filling yarns extending respectively in warp and filling directions, and pile yarns interwoven with the fabric base and forming engageable loops extending from one side of the fabric base for engagement with hooks. The pile yarns include filaments having a nominal diameter and the pile yarn filaments extend from a near side of the fabric base to a mean loop height less than about 30 times the nominal pile yarn filament diameter.

摘要翻译： 一种编织环紧固件产品，其包括具有研磨纱线的织物基底，所述基底纱线包括分别在经纱和填充方向上延伸的交织经纱和填充纱线，以及与织物基底交织的绒头纱线，并且形成从织物基底的一侧延伸的可接合的环， 钩子 绒头纱线包括具有公称直径的长丝，并且绒头纱细丝从织物基底的近侧延伸到小于标称绒毛丝线直径的约30倍的平均环高度。

公开(公告)号：US20080116921A1

公开(公告)日：2008-05-22

申请号：US11551735

申请日：2006-10-23

申请人： Normand Cote ,  Peter J. Demko ,  David L. Gardell ,  Jeffrey D. Gelorme ,  Marco D. Knox ,  George J. Lawson ,  Kathryn C. Rivera

发明人： Normand Cote ,  Peter J. Demko ,  David L. Gardell ,  Jeffrey D. Gelorme ,  Marco D. Knox ,  George J. Lawson ,  Kathryn C. Rivera

IPC分类号： G01R31/02

CPC分类号： G01R31/2877

摘要： A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.

摘要翻译： 用于I / C芯片老化的散热器，该芯片具有通常“平坦”的表面。 散热器具有在其中具有微通道的“平坦”表面，定位成打开和关闭与被烧入的I / C芯片的平坦表面的接触和接触。 至少一个液体开口与散热器上的所述基本平坦的表面连通，以在散热器和芯片之间连续地施加液体。 提供液体入口以将液体供应到所述至少一个液体开口。 定位回收通道以从散热器和芯片之间回收液体，并且提供排气构件以将液体从所述回收通道运送到散热器的外部。 本发明还包括一种烧入芯片的方法。

公开(公告)号：US07332927B2

公开(公告)日：2008-02-19

申请号：US11743899

申请日：2007-05-03

申请人： Paul J. Aube ,  Normand Cote ,  Roger G. Gamache, Jr. ,  David L. Gardell ,  Paul M. Gaschke ,  Marc D. Knox ,  Denis D. Turcotte

发明人： Paul J. Aube ,  Normand Cote ,  Roger G. Gamache, Jr. ,  David L. Gardell ,  Paul M. Gaschke ,  Marc D. Knox ,  Denis D. Turcotte

IPC分类号： G01R31/26

CPC分类号： G01R31/2875 ,  G01R31/2867 ,  G01R31/2868

摘要： A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.

摘要翻译： 一种用于测试集成电路芯片的方法，系统和装置。 该系统包括：用于在集成电路芯片的底表面上形成液体聚α-烯烃层的装置，集成电路芯片的顶表面和没有信号和功率垫的底表面; 用于将散热器的表面放置成与聚α-烯烃精细层的底表面物理接触的装置; 用于将集成电路芯片电耦合到测试器的装置; 用于电测试集成电路芯片的装置; 用于将集成电路芯片与测试器电耦合的装置; 用于去除所述散热器与所述聚α-烯烃精氢层接触的装置，所述或部分所述聚α-烯烃精矿层残留在所述集成电路芯片的底表面上; 以及用于从集成电路芯片的底表面去除聚α-烯烃精细层的装置。

公开(公告)号：US07567090B2

公开(公告)日：2009-07-28

申请号：US11551735

申请日：2006-10-23

申请人： Normand Cote ,  Peter J. Demko ,  David L. Gardell ,  Jeffrey D. Gelorme ,  Marc D. Knox ,  George J. Lawson ,  Kathryn C. Rivera

发明人： Normand Cote ,  Peter J. Demko ,  David L. Gardell ,  Jeffrey D. Gelorme ,  Marc D. Knox ,  George J. Lawson ,  Kathryn C. Rivera

IPC分类号： G01R31/02

CPC分类号： G01R31/2877

摘要： A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.

摘要翻译： 用于I / C芯片老化的散热器，该芯片具有通常“平坦”的表面。 散热器具有在其中具有微通道的“平坦”表面，定位成打开和关闭与被烧入的I / C芯片的平坦表面的接触和接触。 至少一个液体开口与散热器上的所述基本平坦的表面连通，以在散热器和芯片之间连续地施加液体。 提供液体入口以将液体供应到所述至少一个液体开口。 定位回收通道以从散热器和芯片之间回收液体，并且提供排气构件以将液体从所述回收通道运送到散热器的外部。 本发明还包括一种烧入芯片的方法。

公开(公告)号：US20070285116A1

公开(公告)日：2007-12-13

申请号：US11743899

申请日：2007-05-03

申请人： Paul Aube ,  Normand Cote ,  Roger Gamache ,  David Gardell ,  Paul Gaschke ,  Marc Knox ,  Denis Turcotte

发明人： Paul Aube ,  Normand Cote ,  Roger Gamache ,  David Gardell ,  Paul Gaschke ,  Marc Knox ,  Denis Turcotte

IPC分类号： G01R31/02

CPC分类号： G01R31/2875 ,  G01R31/2867 ,  G01R31/2868

摘要： A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.

摘要翻译： 一种用于测试集成电路芯片的方法，系统和装置。 该系统包括：用于在集成电路芯片的底表面上形成液体聚α-烯烃层的装置，集成电路芯片的顶表面和没有信号和功率垫的底表面; 用于将散热器的表面放置成与聚α-烯烃精细层的底表面物理接触的装置; 用于将集成电路芯片电耦合到测试器的装置; 用于电测试集成电路芯片的装置; 用于将集成电路芯片与测试器电耦合的装置; 用于去除所述散热器与所述聚α-烯烃精氢层接触的装置，所述或部分所述聚α-烯烃精矿层残留在所述集成电路芯片的底表面上; 以及用于从集成电路芯片的底表面去除聚α-烯烃精细层的装置。

公开(公告)号：US20070161521A1

公开(公告)日：2007-07-12

申请号：US11330922

申请日：2006-01-12

申请人： Krishna Sachdev ,  Mark Chace ,  Normand Cote ,  David Gardell ,  Jeffrey Gelorme ,  Sushumna Iruvanti ,  G. Lawson ,  Tuknekah Noble ,  Harbans Sachdev

发明人： Krishna Sachdev ,  Mark Chace ,  Normand Cote ,  David Gardell ,  Jeffrey Gelorme ,  Sushumna Iruvanti ,  G. Lawson ,  Tuknekah Noble ,  Harbans Sachdev

IPC分类号： C10M129/10 ,  C10M137/02

CPC分类号： C10M129/10 ,  C09K5/10 ,  C10M137/02 ,  C10M2205/0285 ,  C10M2207/024 ,  C10M2207/026 ,  C10M2215/064 ,  C10M2223/049 ,  C10N2230/08 ,  C10N2230/10 ,  C10N2240/201

摘要： Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.

摘要翻译： 提供了含有特定受阻酚或受阻酚与芳族亚磷酸酯组合的液体组合物，其用于在电子部件的测试过程期间用作散热器和芯片之间的热界面，该组合物增强了散热器和 芯片，在测试程序之后容易地从散热器和芯片上移除而没有任何有害的残留物，并且允许在测试过程中长时间使用高温而没有组合物的任何显着降解。 还提供了一种在诸如老化程序的电子部件测试程序中使用组合物的方法。

公开(公告)号：US20060186909A1

公开(公告)日：2006-08-24

申请号：US10906483

申请日：2005-02-22

申请人： Paul Aube ,  Normand Cote ,  Roger Gamache ,  David Gardell ,  Paul Gaschke ,  Marc Knox ,  Denis Turcotte

发明人： Paul Aube ,  Normand Cote ,  Roger Gamache ,  David Gardell ,  Paul Gaschke ,  Marc Knox ,  Denis Turcotte

IPC分类号： G01R31/02

CPC分类号： G01R31/2875 ,  G01R31/2867 ,  G01R31/2868

摘要： A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.

摘要翻译： 一种用于测试电子设备的方法，系统和装置。 该方法包括：（a）在电子设备的表面上形成临时液体传热层; 在步骤（a）之后，（b）将散热片的表面与传热层的表面物理接触; 在步骤（b）之后，（c）电测试电子设备; 在步骤（c）之后，（d）去除散热片与传热层的接触; 并且在步骤（d）之后，（e）从电子设备的表面去除残留在电子设备上的任何传热层。