摘要:
A method of manufacturing a semiconductor device having a p-type field effect transistor and an n-type field effect transistor includes the steps of: forming an interface insulating layer and a high-permittivity layer on a substrate in the stated order; forming a pattern of a sacrifice layer on the high-permittivity layer; forming a metal-containing film containing metal elements therein on the high-permittivity layer in a first region where the sacrifice layer is formed and a second region where no sacrifice layer is formed; introducing the metal elements into an interface between the interface insulating layer and the high-permittivity layer in the second region by conducting a heat treatment; and removing the sacrifice layer by wet etching, wherein in the removing step, the sacrifice layer is etched easily more than the high-permittivity layer. With this configuration, the semiconductor device excellent in reliability is obtained.
摘要:
A semiconductor device is provided which has a capacitor insulating film made up of zirconium aliminate being an amorphous film obtained by having crystalline dielectric contain amorphous aluminum oxide and having its composition of AlXZr(1-X)OY (0.05≦X≦0.3), hereby being capable of preventing, in a process of forming a capacitor of MIM (Metal Insulator Metal) structure, dielectric breakdown of a capacitor insulating film while a relative dielectric constant of a metal oxide film used as the capacitor insulating film is kept high.
摘要翻译:提供了一种半导体器件,其具有由锆合金制成的电容器绝缘膜,其是通过具有包含无定形氧化铝并且其组成为Al x Zr(1- (0.05 <= X <= 0.3),因此在形成MIM(金属绝缘体金属)结构的电容器的工艺中能够防止介电击穿 电容绝缘膜,而用作电容器绝缘膜的金属氧化物膜的相对介电常数保持较高。
摘要:
A motherboard can be installed commonly in each of a plurality of electronic devices of various types different in configuration without modifying the BIOS setting by comprising a setting information retaining section retaining setting information for a setting process for each electronic device; a specification information obtaining section obtaining specification information for specifying the type of each electronic device; a modifying information retaining section retaining modification information for modifying the setting information according to the type of each electronic device; a setting information modifying section modifying, on the basis of the specification information and the modification information retained, the setting information according to the type of the device in which the motherboard is installed; and a setting process performing section for performing the setting process for the device on the basis of the modified setting information.
摘要:
In order to suppress ammonia from flowing out during regeneration treatment of a filter carrying an SCR catalyst, the prevent invention provides an exhaust emission control system, of an internal combustion engine, including a first stage catalyst having an oxidation function, a fuel supply device configured to supply fuel to the first stage catalyst, a filter provided in the exhaust passage downstream of the first stage catalyst and carrying a selective redaction type NOx catalyst, an ammonia supply device configured to supply ammonia to the filter, a filter-regeneration-treatment executing unit configured to execute filter regeneration treatment, and a control unit configured to supply, when the filter regeneration treatment is not executed, the ammonia in an amount corresponding to an amount of the NOx emitted from the internal combustion engine, and to supply, when the filter regeneration treatment is executed, the ammonia in an amount corresponding to an amount of the NOx obtained by subtracting, from the amount of the NOx emitted from the internal combustion engine, an amount of the NOx reduced by the fuel which passes through the first stage catalyst.
摘要:
In an exhaust gas purification system for an internal combustion engine provided with a filter supporting an SCR catalyst, the present invention is intended to suppress HC and CO from being discharged to the outside at the time of the execution of filter regeneration processing, and to carry out the filter regeneration processing in an efficient manner. In the present invention, a post-catalyst having an oxidation function is arranged in an exhaust passage at the downstream side of the filter. Then, when the temperature of the post-catalyst is lower than a predetermined activation temperature at the time the execution of the filter regeneration processing is requested, the temperature of the post-catalyst is raised by carrying out control of raising the temperature of the exhaust gas discharged from the internal combustion engine, and control increasing the flow rate of the exhaust gas, before the execution of the filter regeneration processing.
摘要:
An object of the present invention is to suppress a reduction in a NOx purification ratio accompanying filter regeneration processing in an exhaust gas purification system for an internal combustion engine that includes a filter carrying an SCR catalyst. In the present invention, the temperature of the filter is increased following completion of the filter regeneration processing by increasing the temperature of exhaust gas discharged from the internal combustion engine, and in so doing, HC adhered to the filter is removed.
摘要:
Variation in the thickness of the deposited films depending on number of the processed product wafers in the deposition process employing a batch type CVD apparatus is inhibited to provide a manufacture of the film having a predetermined thickness with an improved reproducibility. The deposition apparatus 100 comprises a deposition reactor 101 that is capable of containing product wafers 107 and dummy wafers 109, boat 105, on which product wafer 107 or the dummy wafer 109 is mounted, and a heater 111 provided outside of the deposition reactor 101 along a reactor wall 103. Further, the deposition apparatus 100 comprises a gas supplying system including a high-k source material supplying line 113 and SiO2 source material supplying line 115, and a controller 121 that provides a control to the supply of a gas from the gas supplying system to the deposition reactor 101.