Plasma etching method and storage medium
    1.
    发明授权
    Plasma etching method and storage medium 有权
    等离子体蚀刻方法和存储介质

    公开(公告)号:US09130018B2

    公开(公告)日:2015-09-08

    申请号:US13584327

    申请日:2012-08-13

    摘要: A plasma etching method that can increase the selection ratio of a stop layer to an interlayer insulation film. The plasma etching method is carried out on a substrate that has the interlayer insulation film formed of CwFx (x and w are predetermined natural numbers) and a stop layer that stops etching and is exposed at the bottom of a hole or a trench formed in the interlayer insulation film. The interlayer insulation film and the stop layer are exposed at the same time to plasma generated from CyFz (y and z are predetermined natural numbers) gas and hydrogen-containing gas.

    摘要翻译: 能够提高阻挡层与层间绝缘膜的选择比的等离子体蚀刻方法。 等离子体蚀刻方法是在具有由CwFx(x和w是预定的自然数)形成的层间绝缘膜的基板上进行的,停止层停止蚀刻并露出在形成于其中的孔或沟槽的底部 层间绝缘膜。 层间绝缘膜和停止层同时暴露于由CyFz(y和z是预定的自然数)产生的等离子体气体和含氢气体。

    PLASMA ETCHING METHOD AND STORAGE MEDIUM
    2.
    发明申请
    PLASMA ETCHING METHOD AND STORAGE MEDIUM 有权
    等离子体蚀刻方法和储存介质

    公开(公告)号:US20090111275A1

    公开(公告)日:2009-04-30

    申请号:US12254943

    申请日:2008-10-21

    IPC分类号: H01L21/3065

    摘要: A plasma etching method that can prevent residues from becoming attached to bottoms and sides of via holes and trenches. An interlayer insulation film formed of CwFx (x and w are predetermined natural numbers) and a metallic layer or a metal-containing layer formed on a substrate are exposed at the same time to plasma generated from a process gas. The process gas is a mixed gas including CyFz (y and z are predetermined natural numbers) gas and N2 gas, and the flow rate of the N2 gas in the process gas is higher than the flow rate of the CyFz gas.

    摘要翻译: 等离子体蚀刻方法,可以防止残留物附着到通孔和沟槽的底部和侧面。 由CwFx(x和w是预定的自然数)形成的层间绝缘膜和形成在基板上的金属层或含金属层同时暴露于由处理气体产生的等离子体。 处理气体是包括CyFz(y和z是预定的自然数)气体和N 2气体的混合气体,并且处理气体中的N 2气体的流量高于CyFz气体的流量。

    PLASMA ETCHING METHOD AND STORAGE MEDIUM
    3.
    发明申请
    PLASMA ETCHING METHOD AND STORAGE MEDIUM 审中-公开
    等离子体蚀刻方法和储存介质

    公开(公告)号:US20120309203A1

    公开(公告)日:2012-12-06

    申请号:US13584327

    申请日:2012-08-13

    IPC分类号: H01L21/3065

    摘要: A plasma etching method that can increase the selection ratio of a stop layer to an interlayer insulation film. The plasma etching method is carried out on a substrate that has the interlayer insulation film formed of CwFx (x and w are predetermined natural numbers) and a stop layer that stops etching and is exposed at the bottom of a hole or a trench formed in the interlayer insulation film. The interlayer insulation film and the stop layer are exposed at the same time to plasma generated from CyFz (y and z are predetermined natural numbers) gas and hydrogen-containing gas.

    摘要翻译: 能够提高阻挡层与层间绝缘膜的选择比的等离子体蚀刻方法。 等离子体蚀刻方法是在具有由CwFx(x和w是预定的自然数)形成的层间绝缘膜的基板上进行的,停止层停止蚀刻并露出在形成于其中的孔或沟槽的底部 层间绝缘膜。 层间绝缘膜和停止层同时暴露于由CyFz(y和z是预定的自然数)产生的等离子体气体和含氢气体。

    Plasma etching method and storage medium
    4.
    发明授权
    Plasma etching method and storage medium 有权
    等离子体蚀刻方法和存储介质

    公开(公告)号:US09384999B2

    公开(公告)日:2016-07-05

    申请号:US12254943

    申请日:2008-10-21

    摘要: A plasma etching method that can prevent residues from becoming attached to bottoms and sides of via holes and trenches. An interlayer insulation film formed of CwFx (x and w are predetermined natural numbers) and a metallic layer or a metal-containing layer formed on a substrate are exposed at the same time to plasma generated from a process gas. The process gas is a mixed gas including CyFz (y and z are predetermined natural numbers) gas and N2 gas, and the flow rate of the N2 gas in the process gas is higher than the flow rate of the CyFz gas.

    摘要翻译: 等离子体蚀刻方法,可以防止残留物附着到通孔和沟槽的底部和侧面。 由CwFx(x和w是预定的自然数)形成的层间绝缘膜和形成在基板上的金属层或含金属层同时暴露于由处理气体产生的等离子体。 处理气体是包括CyFz(y和z是预定的自然数)气体和N 2气体的混合气体,并且处理气体中的N 2气体的流量高于CyFz气体的流量。

    Plasma etching method and storage medium
    5.
    发明授权
    Plasma etching method and storage medium 有权
    等离子体蚀刻方法和存储介质

    公开(公告)号:US08252694B2

    公开(公告)日:2012-08-28

    申请号:US12273209

    申请日:2008-11-18

    IPC分类号: H01L21/302

    摘要: A plasma etching method that can increase the selection ratio of a stop layer to an interlayer insulation film. The plasma etching method is carried out on a substrate that has the interlayer insulation film formed of CwFx (x and w are predetermined natural numbers) and a stop layer that stops etching and is exposed at the bottom of a hole or a trench formed in the interlayer insulation film. The interlayer insulation film and the stop layer are exposed at the same time to plasma generated from CyFz (y and z are predetermined natural numbers) gas and hydrogen-containing gas.

    摘要翻译: 能够提高阻挡层与层间绝缘膜的选择比的等离子体蚀刻方法。 等离子体蚀刻方法是在具有由CwFx(x和w是预定的自然数)形成的层间绝缘膜的基板上进行的,停止层停止蚀刻并露出在形成于其中的孔或沟槽的底部 层间绝缘膜。 层间绝缘膜和停止层同时暴露于由CyFz(y和z是预定的自然数)产生的等离子体气体和含氢气体。

    PLASMA ETCHING METHOD AND STORAGE MEDIUM
    6.
    发明申请
    PLASMA ETCHING METHOD AND STORAGE MEDIUM 有权
    等离子体蚀刻方法和储存介质

    公开(公告)号:US20090137127A1

    公开(公告)日:2009-05-28

    申请号:US12273209

    申请日:2008-11-18

    IPC分类号: H01L21/467 G06F19/00

    摘要: A plasma etching method that can increase the selection ratio of a stop layer to an interlayer insulation film. The plasma etching method is carried out on a substrate that has the interlayer insulation film formed of CwFx (x and w are predetermined natural numbers) and a stop layer that stops etching and is exposed at the bottom of a hole or a trench formed in the interlayer insulation film. The interlayer insulation film and the stop layer are exposed at the same time to plasma generated from CyFz (y and z are predetermined natural numbers) gas and hydrogen-containing gas.

    摘要翻译: 能够提高阻挡层与层间绝缘膜的选择比的等离子体蚀刻方法。 等离子体蚀刻方法是在具有由CwFx(x和w是预定的自然数)形成的层间绝缘膜的基板上进行的,停止层停止蚀刻并露出在形成于其中的孔或沟槽的底部 层间绝缘膜。 层间绝缘膜和停止层同时暴露于由CyFz(y和z是预定的自然数)产生的等离子体气体和含氢气体。

    Lens drive device, camera module, and camera mounting device

    公开(公告)号:US10551589B2

    公开(公告)日:2020-02-04

    申请号:US15551765

    申请日:2016-02-17

    摘要: Using drive force from a voice coil motor constituted of an autofocus coil unit and an autofocus magnet unit, a lens drive device automatically carries out focusing by moving an autofocus movable unit, which includes the autofocus coil unit, with respect to an autofocus fixed unit, which includes the autofocus magnet unit, in the direction of an optical axis. The autofocus movable unit has a lens holder that holds the autofocus coil unit. The lens holder has a cut-out part recessed on the inside in the radial direction from the outer periphery of the holder, and a binding part that protrudes to the outside in the radial direction from the cut-out part and binds an end part of the autofocus coil unit. The tip of the binding part is positioned to the inside of the outer periphery of the holder in the radial direction.