ALIGNING SUCCESSIVE IMPLANTS WITH A SOFT MASK
    1.
    发明申请
    ALIGNING SUCCESSIVE IMPLANTS WITH A SOFT MASK 有权
    用柔软的面罩对准后续的植入物

    公开(公告)号:US20110217810A1

    公开(公告)日:2011-09-08

    申请号:US13034354

    申请日:2011-02-24

    IPC分类号: H01L31/0248

    摘要: A first species selectively dopes a workpiece to form a first doped region. In one embodiment, a selective implant is performed using a mask with apertures. A soft mask is applied to the first doped region. A second species is implanted into the workpiece to form a second implanted region. The soft mask blocks a portion of the second species. Then the soft mask is removed. The first species and second species may be opposite conductivities such that one is p-type and the other is n-type.

    摘要翻译: 第一种类选择性地掺杂工件以形成第一掺杂区域。 在一个实施例中,使用具有孔的掩模进行选择性植入。 软掩模被施加到第一掺杂区域。 将第二物质植入工件以形成第二注入区域。 软掩模阻挡了第二种物质的一部分。 然后去除软面膜。 第一种和第二种可能是相反的电导率,一个是p型,另一个是n型。