利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

34 条记录 (耗时 0.032 秒)

    System and Method for Aligning Substrates for Multiple Implants
    1.
    发明申请
    System and Method for Aligning Substrates for Multiple Implants 有权
    用于对准多个植入物的基板的系统和方法

    公开(公告)号：US20130288400A1

    公开(公告)日：2013-10-31

    申请号：US13458441

    申请日：2012-04-27

    申请人： John W. Graff ,  Benjamin B. Riordon ,  Nicholas P.T. Bateman

    发明人： John W. Graff ,  Benjamin B. Riordon ,  Nicholas P.T. Bateman

    IPC分类号： H01L21/66 ,  C23C14/48 ,  C23C14/54 ,  H01L31/02

    CPC分类号： H01J37/3171 ,  H01J37/3045 ,  H01J2237/31711 ,  H01L21/266

    摘要： A system and method are disclosed for aligning substrates during successive process steps, such as ion implantation steps, is disclosed. Implanted regions are created on a substrate. After implantation, an image is obtained of the implanted regions, and a fiducial is provided on the substrate in known relation to at least one of the implanted regions. A thermal anneal process is performed on the substrate such that the implanted regions are no longer visible but the fiducial remains visible. The position of the fiducial may be used in downstream process steps to properly align pattern masks over the implanted regions. The fiducial also may be applied to the substrate before any ion implanting of the substrate is performed. The position of the fiducial with respect to an edge or a corner of the substrate may be used for aligning during downstream process steps. Other embodiments are described and claimed.

    摘要翻译： 公开了用于在连续工艺步骤期间对准衬底的系统和方法，例如离子注入步骤。 在衬底上形成植入区域。 在植入之后，获得植入区域的图像，并且已知关系到至少一个植入区域的基底上提供了基准。 在基板上进行热退火处理，使得注入区域不再可见，但基准仍然可见。 基准的位置可以用于下游处理步骤，以便在注入区域上正确对准图案掩模。 在进行基板的任何离子注入之前，基准也可以应用于基板。 基准面相对于衬底的边缘或拐角的位置可用于在下游工艺步骤期间对准。 描述和要求保护其他实施例。

    Electronic device contact structures
    9.
    发明授权
    Electronic device contact structures 有权
    电子设备接触结构

    公开(公告)号：US07598531B2

    公开(公告)日：2009-10-06

    申请号：US11357743

    申请日：2006-02-17

    申请人： Alexei A. Erchak ,  Elefterios Lidorikis ,  John W. Graff ,  Milan Singh Minsky ,  Scott W. Duncan

    发明人： Alexei A. Erchak ,  Elefterios Lidorikis ,  John W. Graff ,  Milan Singh Minsky ,  Scott W. Duncan

    IPC分类号： H01L29/205

    CPC分类号： H01L33/38 ,  H01L51/5203

    摘要： Electronic devices involving contact structures, and related components, systems and methods associated therewith are described. Contact structures (also referred to as electrical contact structures or electrodes) are features on a device that are electrically connected to a power source. The power source can provide current to the device via the contact structures. The contact structures can be designed to improve current distribution in electronic devices. For example, the contact resistance of the contacts may be modified to improve current distribution (e.g., by controlling the shape and/or structure and/or composition of the contacts). The contact structures may include an intervening layer (e.g., a non-ohmic layer) positioned between a surface of the device and a conductive portion extending from a conductive pad. The intervening layer and/or conductive portions may be designed to have certain shapes (e.g., non-linear shapes) that promote current flow from the conductive pad towards the ends of the contacts to increase current spreading. The intervening layer can also reduce light generation underneath the light absorbing contacts to allow a greater percentage of the generated light to emerge from the surface of the device. Advantageously, devices including contact structures of the invention can increase uniformity of light emission and/or otherwise improve performance. As such, these contact structures are particularly suitable for use in a variety of light-emitting devices, including LEDs.

    摘要翻译： 描述了涉及接触结构的电子设备以及与之相关的组件，系统和方法。 接触结构（也称为电接触结构或电极）是电连接到电源的器件上的特征。 电源可以通过接触结构向器件提供电流。 接触结构可以设计成改善电子设备中的电流分布。 例如，可以修改触点的接触电阻以改善电流分布（例如，通过控制触点的形状和/或结构和/或组成）。 接触结构可以包括位于器件的表面和从导电焊盘延伸的导电部分之间的中间层（例如，非欧姆层）。 中间层和/或导电部分可以被设计成具有促进电流从导电焊盘朝向接触端部的流动的某些形状（例如，非线性形状），以增加电流扩散。 中间层还可以减少光吸收触点下方的光产生，从而允许更大百分比的所产生的光从装置的表面露出。 有利地，包括本发明的接触结构的装置可以增加发光的均匀性和/或以其它方式提高性能。 因此，这些接触结构特别适用于包括LED在内的各种发光装置。