Abstract:
Methods and devices are disclosed for aligning a beam-propagation axis with the center of an aperture, especially an aperture configured to limit the aperture angle of the charged particle beam. In an exemplary method, an alignment-measurement aperture is provided at an imaging plane of a charged-particle-beam (CPB) optical system, and a beam detector is downstream of the alignment-measurement aperture. A scanning deflector is energized to cause the beam to be scanned in two dimensions, transverse to an optical axis, over the aperture. Meanwhile, the beam detector obtains an image of beam intensity in the two dimensions. In the image a maximum-intensity point is identified, corresponding to the propagation axis. Based on the two-dimensional image, the beam is deflected as required to align the propagation axis with the aperture center.
Abstract:
Charged-particle-beam (CPB) microlithography apparatus and methods are disclosed that produce reduced blur resulting from the Coulomb effect, without having to reduce exposure current, exposure accuracy, or throughput. An exemplary apparatus is configured to expose regions (nullexposure unitsnull or nullsubfieldsnull) each having a maximal lateral dimension of at least 1 mm. The beam half-angle (half width at half maximum of the distribution of beam intensity) is 1 mrad or less.
Abstract:
Exposure methods are disclosed for use in charged-particle-beam microlithography and that yield decreased blur and variation in blur within individual exposure fields (subfields) of a pattern. Blur at a location on the optical axis increases monotonically with increased shift in the focal point of a subfield image on the substrate. In contrast, blur at a subfield edge exhibits comparatively little change over a limited range in focal-point shift, and exhibits sharply increased change as the shift in focal point exceeds a threshold. Variation in blur within individual subfields decreases monotonically with increased shift in the focal point. Consequently, by changing the focal point during exposure, within a range in which maximum blur within the subfield is within an acceptable range, nullblur is decreased more than conventionally, thereby increasing the uniformity of blur within the projected subfield.
Abstract:
Electron-beam sources are disclosed that exhibit substantially reduced spherical aberration compared to conventional sources. In a beam produced by the cathode of such a source, axially propagating electrons are subjected to a lens action by voltage applied to a Wehnelt electrode and an extraction electrode. The cathode includes a peripheral portion that is nulldrawn backnull (displaced along the axis of the source away from the beam-propagation direction) relative to a center portion of the cathode. With such a cathode, the percentage of dimensions of the crossover involved in spherical aberration of the crossover is reduced. This improves the uniformity of beam current at a lithographic substrate and minimizes location-dependency of the aperture angle. Since the Wehnelt voltage can be reduced, positional changes in the electrical field at the cathode surface are reduced, and the distribution of electrons in the beam propagating from the cathode surface is made more uniform than conventionally.
Abstract:
Charged-particle-beam (CPB) optical systems (especially projection-lens systems for use in CPB microlithography apparatus) are disclosed that exhibit excellent control of geometric aberration and the Coulomb effect while exhibiting low combined aberration and blur. As the column length of the projection-lens system is increased, geometric aberration is reduced but the Coulomb effect increases, which degrades overall optical characteristics. Conversely, as the column length is decreased, the Coulomb effect is reduced but geometric aberration increases, which degrades overall optical characteristics. Hence, the projection-lens system, exhibiting a magnification of 1/M and having a column length (distance in mm between reticle and wafer) of 250nullM0.63null110% (wherein 0