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公开(公告)号:US20070023875A1
公开(公告)日:2007-02-01
申请号:US11490116
申请日:2006-07-21
申请人: Noboru Okane , Ryoji Matsushima , Kazuhiro Yamamori , Junya Sagara , Yoshio Iizuka , Kuniyuki Oonishi , Atsushi Yoshimura
发明人: Noboru Okane , Ryoji Matsushima , Kazuhiro Yamamori , Junya Sagara , Yoshio Iizuka , Kuniyuki Oonishi , Atsushi Yoshimura
IPC分类号: H01L23/495
CPC分类号: H01L23/49575 , H01L24/32 , H01L24/48 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package includes a lead frame having an element mounting part and a lead part. A first semiconductor element and a second semiconductor element are sequentially stacked on a principal surface at least on one side of the element mounting part. An insulating resin layer serving as a second adhesive layer is filled between the first semiconductor element and the second semiconductor element. An element-side end portion of a first bonding wire connected to the first semiconductor element is buried in the insulating resin layer.
摘要翻译: 半导体封装包括具有元件安装部分和引线部分的引线框架。 第一半导体元件和第二半导体元件依次堆叠在元件安装部的至少一侧的主表面上。 用作第二粘合剂层的绝缘树脂层填充在第一半导体元件和第二半导体元件之间。 连接到第一半导体元件的第一接合线的元件侧端部埋设在绝缘树脂层中。
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公开(公告)号:US20070023922A1
公开(公告)日:2007-02-01
申请号:US11490022
申请日:2006-07-21
申请人: Noboru Okane , Ryoji Matsushima , Kazuhiro Yamamori , Junya Sagara , Yoshio Iizuka , Kuniyuki Oonishi
发明人: Noboru Okane , Ryoji Matsushima , Kazuhiro Yamamori , Junya Sagara , Yoshio Iizuka , Kuniyuki Oonishi
IPC分类号: H01L23/48
CPC分类号: H01L25/0657 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06572 , H01L2225/06575 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package includes a circuit board having connection pads formed on a front and back surfaces, and a wiring network connected to these connection pads, as a package base. Metal bumps connected to at least part of the connection pads on the front and back surfaces via the wiring network are formed on the back surface of the circuit board as external connection terminals. One or a plurality of semiconductor elements electrically connected to the connection pad on the front surface side is or are mounted on a first element mounting part provided on the front surface side of the circuit board. One or plurality of semiconductor elements electrically connected to the connection pad on the back surface side is or are mounted on a second element mounting part provided on the back surface side of the circuit board.
摘要翻译: 半导体封装包括具有形成在前表面和后表面上的连接焊盘的电路板和连接到这些连接焊盘的布线网络作为封装基座。 通过布线网络连接到前表面和后表面上的连接焊盘的至少一部分的金属凸块形成在电路板的背面上作为外部连接端子。 电连接到前表面侧的连接焊盘的一个或多个半导体元件被安装在设置在电路板的前表面侧的第一元件安装部分上。 电连接到背面侧的连接焊盘的一个或多个半导体元件被安装在设置在电路板的背面侧的第二元件安装部上。
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公开(公告)号:US07569921B2
公开(公告)日:2009-08-04
申请号:US11398694
申请日:2006-04-06
申请人: Noboru Okane , Ryoji Matsushima , Kazuhiro Yamamori , Junya Sagara , Yoshio Iizuka , Kuniyuki Ohnishi
发明人: Noboru Okane , Ryoji Matsushima , Kazuhiro Yamamori , Junya Sagara , Yoshio Iizuka , Kuniyuki Ohnishi
IPC分类号: H01L23/02
CPC分类号: H01L23/49575 , H01L24/48 , H01L24/49 , H01L24/92 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48475 , H01L2224/49113 , H01L2224/73265 , H01L2224/85051 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A semiconductor device has a plurality of bare chips stacked on at least one of first and second main surfaces oppositely arranged on a support substrate, spacers arranged between two bare chips arranged adjacently in up and down direction among the plurality of bare chips, and inner leads which are arranged at both sides in a horizontal direction of the support substrate and are connected to pads of the bare chips via bonding wires, wherein the bonding wires which connect the pads of the bare chips at one end side of the spacers to the corresponding inner leads, are arranged not to contact the bare chip at the other end side of the same spacer.
摘要翻译: 半导体器件具有堆叠在与支撑基板相对布置的第一和第二主表面中的至少一个上的多个裸芯片,布置在多个裸芯片之间沿上下方向布置的两个裸芯片之间的间隔物和内引线 其布置在支撑基板的水平方向的两侧,并且通过接合线连接到裸芯片的焊盘,其中,将间隔件的一端侧的裸芯片的焊盘连接到相应的内部的接合线 引线被布置成不与相同间隔物的另一端侧的裸芯片接触。
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公开(公告)号:US20060232288A1
公开(公告)日:2006-10-19
申请号:US11398694
申请日:2006-04-06
申请人: Noboru Okane , Ryoji Matsushima , Kazuhiro Yamamori , Junya Sagara , Yoshio Iizuka , Kuniyuki Ohnishi
发明人: Noboru Okane , Ryoji Matsushima , Kazuhiro Yamamori , Junya Sagara , Yoshio Iizuka , Kuniyuki Ohnishi
IPC分类号: G01R31/02
CPC分类号: H01L23/49575 , H01L24/48 , H01L24/49 , H01L24/92 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48475 , H01L2224/49113 , H01L2224/73265 , H01L2224/85051 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A semiconductor device has a plurality of bare chips stacked on at least one of first and second main surfaces oppositely arranged on a support substrate, spacers arranged between two bare chips arranged adjacently in up and down direction among the plurality of bare chips, and inner leads which are arranged at both sides in a horizontal direction of the support substrate and are connected to pads of the bare chips via bonding wires, wherein the bonding wires which connect the pads of the bare chips at one end side of the spacers to the corresponding inner leads, are arranged not to contact the bare chip at the other end side of the same spacer.
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公开(公告)号:US10068056B2
公开(公告)日:2018-09-04
申请号:US12748324
申请日:2010-03-26
申请人: Kazuhiro Miyasa , Yoshio Iizuka , Akihiro Katayama , Ryo Ishikawa
发明人: Kazuhiro Miyasa , Yoshio Iizuka , Akihiro Katayama , Ryo Ishikawa
摘要: This invention provides a mechanism for making a doctor surely follow correct procedures in which the doctor confirms diagnosis information obtained by computer processing after he or she has completed interpretation. A medical diagnosis support apparatus executes diagnosis processing for acquiring medical diagnosis information from an image to be interpreted by computer processing. The medical diagnosis support apparatus accepts interpretation information as an interpretation result of the image to be interpreted, which information is input by, for example, a doctor. The medical diagnosis support apparatus calculates a degree of matching between the diagnosis information and interpretation information, and permits to present the diagnosis information acquired by the diagnosis processing when the calculated degree of matching exceeds a predetermined threshold.
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公开(公告)号:US20100189366A1
公开(公告)日:2010-07-29
申请号:US12748315
申请日:2010-03-26
CPC分类号: G06F17/30247 , G06F17/271 , G06F19/00 , G06F19/321 , G16H15/00 , G16H50/20 , G16H50/70 , G16H80/00
摘要: A diagnosis support apparatus includes a storage unit which stores pieces of image feature information and finding sentences as interpretation results in correspondence with each other. This apparatus acquires image feature information of a target area designated on an image to be interpreted, searches the storage unit for image feature information similar to the acquired image feature information, acquires a finding sentence stored in correspondence with the retrieved image feature information from the storage unit, and creates a finding sentence concerning interpretation of the designated target area by changing a description of the acquired finding sentence based on image feature information of the designated target area.
摘要翻译: 诊断支持装置包括存储单元,其存储图像特征信息并且将彼此对应的解释结果查找句子。 该装置获取在要解释的图像上指定的目标区域的图像特征信息,在存储单元中搜索与所获取的图像特征信息类似的图像特征信息,从存储器获取与检索到的图像特征信息相对应的发现语句 并通过基于所指定的目标区域的图像特征信息改变所获取的发现语句的描述来创建关于指定目标区域的解释的发现语句。
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公开(公告)号:US07595834B2
公开(公告)日:2009-09-29
申请号:US12145870
申请日:2008-06-25
申请人: Tomoaki Kawai , Yoshio Iizuka , Takashi Oya
发明人: Tomoaki Kawai , Yoshio Iizuka , Takashi Oya
IPC分类号: H04N5/222
CPC分类号: H04N5/23206 , H04N5/232 , H04N5/23216 , H04N7/18
摘要: A conversion apparatus is connected to a camera server delivering image information obtained by image sensing to a display operation terminal. When image information is received from the camera server, the conversion apparatus converts the received image information to a format for a portable display terminal, and delivers it to the portable display terminal.
摘要翻译: 将转换装置连接到相机服务器,将通过图像感测获得的图像信息传送到显示操作终端。 当从相机服务器接收到图像信息时,转换装置将接收到的图像信息转换为便携式显示终端的格式,并将其传送到便携式显示终端。
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公开(公告)号:US20070204029A1
公开(公告)日:2007-08-30
申请号:US11699503
申请日:2007-01-30
申请人: Toshiaki Igarashi , Akira Sugiyama , Yoshio Iizuka , Minoru Torii
发明人: Toshiaki Igarashi , Akira Sugiyama , Yoshio Iizuka , Minoru Torii
IPC分类号: G06F15/173
CPC分类号: H04L41/0213 , H04L29/12009 , H04L41/22 , H04L61/00
摘要: A network device control unit and method are provided in which, not all MIB objects under the control of the network management software are simultaneously acquired during startup of the network management software so the almost simultaneous flow of a large volume of SNMP packets in the LAN will not occur and along with a simultaneous reduction in the load on communications lines, the load on devices such as the printer and network board processing their SNMP packets will also become small. To accomplish this, windows allocated to individual network peripheral devices on a one to one basis and controlling the network device are utilized as device windows, and information to be displayed on the initial screen of the device window is acquired as the initial sheet and displayed. Device windows also acquire and display different sheet information on the device window when determined an entry has been made by the user requesting display of a different type of sheet information.
摘要翻译: 提供一种网络设备控制单元和方法,其中在网络管理软件启动期间并非同时获取在网络管理软件的控制下的所有MIB对象,所以LAN中大量SNMP包几乎同时流动将会 不会发生,同时减少通信线路上的负载,因此打印机和网络板等设备上的负载处理其SNMP数据包也将变小。 为了实现这一点,将一个一个地分配给各个网络外围设备的窗口和控制网络设备用作设备窗口,并且获取要在设备窗口的初始屏幕上显示的信息作为初始页面并显示。 当确定用户请求显示不同类型的纸张信息的用户时,设备窗口还获取并显示设备窗口上的不同的纸张信息。
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公开(公告)号:US20060050559A1
公开(公告)日:2006-03-09
申请号:US11218598
申请日:2005-09-06
申请人: Koji Sakui , Yoshio Iizuka
发明人: Koji Sakui , Yoshio Iizuka
IPC分类号: G11C16/04
CPC分类号: H01L27/11568 , G11C16/0483 , H01L27/115 , H01L29/42336 , H01L29/42352
摘要: The nonvolatile semiconductor memory device of this invention has a trench region in a semiconductor substrate and has a NAND type memory cell unit in three dimensions in both sides of a side wall of one trench region, respectively. And these NAND memory cell units are connected to one bit line. In each NAND type memory cell unit, a plurality of the memory cell transistors and the selective gate transistors are connected in series. These pluralities of the memory cell transistors and the selective gate transistors are provided in the same trench region. Moreover, in the nonvolatile semiconductor memory device of this invention, an insulating layer containing a lamination structure of a silicon oxide film, a silicon nitride film and a silicon oxide film, or silicon, or metal or other nano crystals of conductivity substance is used for an electric charge accumulation layer of the memory cell transistor instead of a conventional floating gate.
摘要翻译: 本发明的非易失性半导体存储器件在半导体衬底中具有沟槽区域,并且在一个沟槽区域的侧壁的两侧分别具有三维的NAND型存储单元单元。 并且这些NAND存储单元单元连接到一个位线。 在每个NAND型存储单元单元中,多个存储单元晶体管和选择栅晶体管串联连接。 这些多个存储单元晶体管和选择栅晶体管设置在相同的沟槽区域中。 此外,在本发明的非易失性半导体存储器件中,使用包含氧化硅膜,氮化硅膜和氧化硅膜的层叠结构的绝缘层,或硅或导电性物质的金属或其他纳米晶体, 存储单元晶体管的电荷累积层,而不是传统的浮动栅极。
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公开(公告)号:US06911975B2
公开(公告)日:2005-06-28
申请号:US09949967
申请日:2001-09-10
申请人: Yoshio Iizuka , Tomoaki Kawai
发明人: Yoshio Iizuka , Tomoaki Kawai
CPC分类号: G09G5/00 , G09G3/003 , H04N13/15 , H04N13/167 , H04N13/189 , H04N13/194 , H04N13/279 , H04N13/289 , H04N13/296 , H04N13/305 , H04N13/31 , H04N13/337 , H04N13/341 , H04N13/361 , H04N19/597
摘要: There is provided a stereo image display apparatus in which a CPU 201 of a PC 101 carries out control in accordance with a stereo image display program such that a suitable viewing position verification image appears different when a glasses-free type display 102 is viewed from a suitable viewing position to when the glasses-free type display 102 is viewed from elsewhere is displayed on the glasses-free type display 102 in accordance with a user's instructions.
摘要翻译: 提供了一种立体图像显示装置,其中PC 101的CPU 201根据立体图像显示程序进行控制,使得当从一个眼镜型显示器102被观看时,适当的观看位置验证图像看起来不同 根据用户的指示,在无眼睛型显示器102上显示从其他地方观看无眼睛型显示器102时的适当观看位置。
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