摘要:
An antireflection film wherein, even where exposure light enters obliquely in a liquid immersion lithography technique, a sufficiently reduced reflectance can be achieved at the interface between a resist layer and a silicon substrate. A two-layer antireflection film is used in exposure by an exposure system having a wavelength of 190 to 195 nm and a numerical aperture of 1.0 or less and formed between the resist layer and the silicon substrate. Where complex refractive indices N1 and N2 and film thicknesses of upper and lower layers of the antireflection film are represented by n1-k1i, n2-k2i and d1, d2, respectively, and a predetermined combination of values of [n10, k10, d10, n20, k20, d20] is selected, n1, k1, d1, n2, k2 and d2 satisfy {(n1-n10)/(n1m-n10)}2+{(k1-k10)/(k1m-k10)}2+{(d1-d10)/(d1m-d10)}2+{(n2-n20)/(n2m-n20)}2+{(k2-k20)/(k2m-k20)}2+{(d2-d20)/(d2m-d20)}2≦1.
摘要:
An antireflection film wherein, even where exposure light enters obliquely in a liquid immersion lithography technique, a sufficiently reduced reflectance can be achieved at the interface between a resist layer and a silicon substrate. A two-layer antireflection film is used in exposure by an exposure system having a wavelength of 190 to 195 nm and a numerical aperture of 1.0 or less and formed between the resist layer and the silicon substrate. Where complex refractive indices N1 and N2 and film thicknesses of upper and lower layers of the antireflection film are represented by n1-k1i, n2-k2i and d1, d2, respectively, and a predetermined combination of values of [n10, k10, d10, n20, k20, d20] is selected, n1, k1, d1, n2, k2 and d2 satisfy {(n1-n10)/(n1m-n10)}2+{(k1-k10)/(k1m-k10)}2+{(d1-d10)/(d1m-d10)}2+{(n2-n20)/(n2m-n20)}2+{(k2-k20)/(k2m-k20)}2+{(d2-d20)/(d2m-d20)}2≦1.
摘要:
An antireflective film is provided between a resist layer and a silicon oxide layer formed on a surface of a silicon substrate, for exposure of the resist layer in an exposure system having a wavelength of 190 nm to 195 nm and a numerical aperture NA of 0.93 to 1.2. Assuming that the complex refractive indexes of upper and lower layers constituting the antireflective film are N1 (=n1−k1i) and N2 (=n2−k2i), respectively, and the thicknesses of both layers are d1 and d2, when a predetermined combination of values of [n10, k10, d10, n20, k20, d20] is selected, n1, k1, d1, n2, k2, and d2 satisfy the relational expression {(n1−n10)/(n1m−n10)}2+{(k1−k10)/(k1m−k10)}2+{(d1−d10)/(d1m−d10)}2+{(n2−n20)/(n2m−n20)}2+{(k2−k20)/(k2m−k20)}2+{(d2−d20)/(d2m−d20)}2≦1.
摘要:
An antireflective film is provided between a resist layer and a silicon oxide layer formed on a surface of a silicon substrate, for exposure of the resist layer in an exposure system having a wavelength of 190 nm to 195 nm and a numerical aperture NA of 0.93 to 1.2. Assuming that the complex refractive indexes of upper and lower layers constituting the antireflective film are N1 (=n1−k1i) and N2 (=n2−k2i), respectively, and the thicknesses of both layers are d1 and d2, when a predetermined combination of values of [n10, k10, d10, n20, k20, d20] is selected, n1, k1, d1, n2, k2, and d2 satisfy the relational expression {(n1−n10)/(n1m−n10)}2+{(k1−k10)/(k1m−k10)}2+{(d1− d10)/(d1m−d10)}2+{(n2−n20)/(n2m−n20)}2+{(k2−k20)/(k2m− k20)}2+{(d2−d20)/(d2m−d20)}2≦1.
摘要:
A stereoscopic imaging method where a pixel matrix is divided into groups such that parallax information is received by one pixel group and original information is received by another pixel group. The parallax information may, specifically, be based on polarized information received by subgroups of the one pixel, group and by processing all of the information received multiple images are rendered by the method.
摘要:
The present invention relates to a solid-state imaging element which is able to provide the solid-state imaging element having a polarizing element having a simple configuration and structure based on a wire grid polarizer technique, a solid-state imaging device, an imaging apparatus, and a method of manufacturing a polarizing element. The solid-state imaging device includes a plurality of solid-state imaging elements 41 each including a photoelectric conversion element 61 and a polarizing element 70 formed on the light incident side of the photoelectric conversion element 61. The solid-state imaging device includes two or more kinds of polarizing elements 70 having different polarization orientations. Each polarizing element has a stacked structure in which a stripe-shaped reflecting layer 71, an insulating layer 72 formed on the reflecting layer 71, and a light absorption layer 73 made up of a plurality of segments 73′ formed on the insulating layer 72 in a separated state are stacked in that order from the photoelectric conversion element side.
摘要:
An exposure mask in the form of a binary mask for intensity modulating 0th order diffracted light and a mask pattern production method using the exposure mask are disclosed on which a mask production error, an influence of flare of an exposure apparatus and a development characteristic of resist reflect on the design. The exposure mask has a block area in which a plurality of pattern sites in each of which light intercepting patterns for intercepting illumination light emitted from an exposure apparatus and light transmitting patterns for transmitting the illumination light therethrough are formed at an equal ratio and an equal pitch are disposed. The pattern sites which form the block area are disposed such that the pitches of the light intercepting patterns and the light transmitting patterns are equal while the ratio varies gradually.
摘要:
In an exposure method which illuminates a first object with an exposure beam and exposes a second object through a projection system with the exposure beam passing through a pattern of the first object, a correlation between a light amount of the exposure beam detected at a measuring point on an optical path to the first object and a light amount of the exposure beam on an image plane of the projection system is previously obtained, and when an integrated exposure amount with respect to the second object is controlled based on the light amount of the exposure beam detected at the measuring point and the correlation at the time of exposure of the second object, a variation amount of transmittance of the projection system is forecast in accordance with a process condition and exposure progression, and the correlation is renewed based on the forecast variation amount of the transmittance.
摘要:
In a scan type exposure apparatus which provides relative movement between an exposure beam and an object in a predetermined direction to expose the object, performance of the apparatus is evaluated by a method that comprises detecting the exposure beam under an operation condition to be used in a scan exposure for the object, and evaluating the performance of the apparatus based on information obtained by detecting the exposure beam. The operation condition may be one that causes unevenness in the integrated exposure amount for the object to be exposed or movement speed of a movable member holding the object. The detecting may involve the detection of exposure beam pulses.
摘要:
Projection for evaluation is carried out prior to actual projection according to a predetermined projection sequence without performing shot-by-shot light exposure control to measure average pulse energy p(i) through an integrator sensor every shot area. Then set pulse energy S.sub.0 /N is divided by the average pulse energy p(i), thereby calculating correction coefficients t(i) (=S.sub.0 /p(i).multidot.N)) of pulse energy for the i-th shot areas and thus producing a correction data map upon actual projection on the i-th shot area, an adjustment amount obtained by multiplying an adjustment amount before correction by the correction coefficient t(i) is used as an adjustment amount in an energy fine adjuster.