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公开(公告)号：US20070081565A1
公开(公告)日：2007-04-12
申请号：US11452312
申请日：2006-06-14
申请人： Noriko Sasada , Kazuhiko Naoe , Kazuhise Uomi , Masanobu Okayasu
发明人： Noriko Sasada , Kazuhiko Naoe , Kazuhise Uomi , Masanobu Okayasu
CPC分类号： H04B10/505 , H01S5/06251 , H01S5/06804 , H01S5/0683 , H04B10/504 , H04B10/572
摘要： A wavelength tunable laser module for DWDM is used, in which a single electroabsorption modulator integrated laser is mounted and an oscillation wavelength is made tunable by temperature control. Driving conditions of a laser and a modulator are determined such that they have approximately the same modulation and transmission characteristics in a temperature control range. Such an electroabsorption modulator integrated laser is used and the driving conditions are incorporated, thereby a small, inexpensive wavelength tunable optical transmitter can be provided.
摘要翻译： 使用用于DWDM的波长可调激光器模块，其中安装单个电吸收调制器集成激光器，并且通过温度控制使振荡波长可调。 确定激光器和调制器的驱动条件使得它们在温度控制范围内具有大致相同的调制和传输特性。 使用这样的电吸收调制器集成激光器，并且结合驱动条件，从而可以提供小型廉价的波长可调光发射器。
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公开(公告)号：US07733929B2
公开(公告)日：2010-06-08
申请号：US11452312
申请日：2006-06-14
申请人： Noriko Sasada , Kazuhiko Naoe , Kazuhise Uomi , Masanobu Okayasu
发明人： Noriko Sasada , Kazuhiko Naoe , Kazuhise Uomi , Masanobu Okayasu
CPC分类号： H04B10/505 , H01S5/06251 , H01S5/06804 , H01S5/0683 , H04B10/504 , H04B10/572
摘要： A wavelength tunable laser module for DWDM is used, in which a single electroabsorption modulator integrated laser is mounted and an oscillation wavelength is made tunable by temperature control. Driving conditions of a laser and a modulator are determined such that they have approximately the same modulation and transmission characteristics in a temperature control range. Such an electroabsorption modulator integrated laser is used and the driving conditions are incorporated, thereby a small, inexpensive wavelength tunable optical transmitter can be provided.
摘要翻译： 使用用于DWDM的波长可调激光器模块，其中安装单个电吸收调制器集成激光器，并且通过温度控制使振荡波长可调。 确定激光器和调制器的驱动条件使得它们在温度控制范围内具有大致相同的调制和传输特性。 使用这样的电吸收调制器集成激光器，并且结合驱动条件，从而可以提供小型廉价的波长可调光发射器。
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公开(公告)号：US07593445B2
公开(公告)日：2009-09-22
申请号：US11668204
申请日：2007-01-29
申请人： Noriko Sasada , Kazuhiko Naoe
发明人： Noriko Sasada , Kazuhiko Naoe
IPC分类号： H01S5/00
CPC分类号： H01S5/0265 , B82Y20/00 , H01S5/02248 , H01S5/02284 , H01S5/026 , H01S5/0287 , H01S5/0425 , H01S5/0683 , H01S5/22 , H01S5/2213 , H01S5/34306
摘要： A semiconductor optical device has a semiconductor laser portion and a modulator portion which have different mesa structures. The mesa structure of the semiconductor laser portion is a ridge waveguide structure which has air around the mesa. The mesa structure of the modulator portion is a planarized ridge waveguide structure which has an organic insulator buried around the mesa.
摘要翻译： 半导体光学器件具有半导体激光器部分和具有不同台面结构的调制器部分。 半导体激光器部分的台面结构是在台面周围具有空气的脊波导结构。 调制器部分的台面结构是平面化的脊波导结构，其具有埋在台面周围的有机绝缘体。
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公开(公告)号：US20060076573A1
公开(公告)日：2006-04-13
申请号：US11281503
申请日：2005-11-18
申请人： Noriko Sasada , Kazuhiko Naoe , Masataka Shirai , Hideo Arimoto , Satoshi Tada
发明人： Noriko Sasada , Kazuhiko Naoe , Masataka Shirai , Hideo Arimoto , Satoshi Tada
CPC分类号： G02B6/4201 , G02B6/4279 , G02B6/428 , H01L2224/48091 , H01S5/0085 , H01S5/02248 , H01S5/02272 , H01S5/0265 , H01S5/06226 , H01L2924/00014
摘要： A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device.
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5.发明申请Chip carrier used for semiconductor optical device, optical module, and optical transmitter and receiver 有权用于半导体光器件，光模块和光发射器和接收器的芯片载体公开(公告)号：US20050139843A1
公开(公告)日：2005-06-30
申请号：US10808393
申请日：2004-03-25
申请人： Noriko Sasada , Kazuhiko Naoe , Masataka Shirai , Hideo Arimoto , Satoshi Tada
发明人： Noriko Sasada , Kazuhiko Naoe , Masataka Shirai , Hideo Arimoto , Satoshi Tada
CPC分类号： G02B6/4201 , G02B6/4279 , G02B6/428 , H01L2224/48091 , H01S5/0085 , H01S5/02248 , H01S5/02272 , H01S5/0265 , H01S5/06226 , H01L2924/00014
摘要： A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device.
摘要翻译： 芯片载体包括形成在基板的前表面上并被安装的装置的金属涂覆部分，以及涂覆有金属的基板的后表面，金属涂覆部分形成在侧面上 通过形成在基板的侧面的金属被覆部与背面的金属被覆部连接基板的前表面的金属被覆部分，从而保持光半导体的频率特性 设备。
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6.发明授权Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver 有权用于半导体光器件，光模块和光发射机和接收机的芯片载体的结构公开(公告)号：US07605402B2
公开(公告)日：2009-10-20
申请号：US11281503
申请日：2005-11-18
申请人： Noriko Sasada , Kazuhiko Naoe , Masataka Shirai , Hideo Arimoto , Satoshi Tada
发明人： Noriko Sasada , Kazuhiko Naoe , Masataka Shirai , Hideo Arimoto , Satoshi Tada
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/4279 , G02B6/428 , H01L2224/48091 , H01S5/0085 , H01S5/02248 , H01S5/02272 , H01S5/0265 , H01S5/06226 , H01L2924/00014
摘要： A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device.
摘要翻译： 芯片载体包括形成在基板的前表面上并被安装的装置的金属涂覆部分，以及涂覆有金属的基板的后表面，金属涂覆部分形成在侧面上 通过形成在基板的侧面的金属被覆部与背面的金属被覆部连接基板的前表面的金属被覆部分，从而保持光半导体的频率特性 设备。
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公开(公告)号：US20070297475A1
公开(公告)日：2007-12-27
申请号：US11668204
申请日：2007-01-29
申请人： Noriko Sasada , Kazuhiko Naoe
发明人： Noriko Sasada , Kazuhiko Naoe
IPC分类号： H01S5/20
CPC分类号： H01S5/0265 , B82Y20/00 , H01S5/02248 , H01S5/02284 , H01S5/026 , H01S5/0287 , H01S5/0425 , H01S5/0683 , H01S5/22 , H01S5/2213 , H01S5/34306
摘要： A semiconductor optical device has a semiconductor laser portion and a modulator portion which have different mesa structures. The mesa structure of the semiconductor laser portion is a ridge waveguide structure which has air around the mesa. The mesa structure of the modulator portion is a planarized ridge waveguide structure which has an organic insulator buried around the mesa.
摘要翻译： 半导体光学器件具有半导体激光器部分和具有不同台面结构的调制器部分。 半导体激光器部分的台面结构是在台面周围具有空气的脊波导结构。 调制器部分的台面结构是平面化的脊波导结构，其具有埋在台面周围的有机绝缘体。
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公开(公告)号：US07130100B2
公开(公告)日：2006-10-31
申请号：US11131309
申请日：2005-05-18
申请人： Osamu Kagaya , Noriko Sasada , Kazuhiko Naoe
发明人： Osamu Kagaya , Noriko Sasada , Kazuhiko Naoe
CPC分类号： G02F1/0121 , H01L2224/48091 , H01L2224/48137 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014
摘要： Even for a driving impedance of 25 Ω, high transmission waveform quality of an optical transmission module is maintained using an optical modulator element designed for a driving impedance of 50 Ω. The above can be achieved by adopting an optical module 100 that includes an input electrode for electrical signals, an optical modulator element for modulating laser light using the electrical signals, a termination resistance element, a first bonding wire for connecting the input electrode and the optical modulator element, a second bonding wire for connecting the optical modulator element and the termination resistance element, and a third bonding wire for connecting the input electrode and the termination resistance element.
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公开(公告)号：US07030418B2
公开(公告)日：2006-04-18
申请号：US10808393
申请日：2004-03-25
申请人： Noriko Sasada , Kazuhiko Naoe , Masataka Shirai , Hideo Arimoto , Satoshi Tada
发明人： Noriko Sasada , Kazuhiko Naoe , Masataka Shirai , Hideo Arimoto , Satoshi Tada
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/4279 , G02B6/428 , H01L2224/48091 , H01S5/0085 , H01S5/02248 , H01S5/02272 , H01S5/0265 , H01S5/06226 , H01L2924/00014
摘要： A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device.
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公开(公告)号：US20060007516A1
公开(公告)日：2006-01-12
申请号：US11131309
申请日：2005-05-18
申请人： Osamu Kagaya , Noriko Sasada , Kazuhiko Naoe
发明人： Osamu Kagaya , Noriko Sasada , Kazuhiko Naoe
IPC分类号： G02F1/03
CPC分类号： G02F1/0121 , H01L2224/48091 , H01L2224/48137 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014
摘要： Even for a driving impedance of 25 Ω, high transmission waveform quality of an optical transmission module is maintained using an optical modulator element designed for a driving impedance of 50 Ω. The above can be achieved by adopting an optical module 100 that includes an input electrode for electrical signals, an optical modulator element for modulating laser light using the electrical signals, a termination resistance element, a first bonding wire for connecting the input electrode and the optical modulator element, a second bonding wire for connecting the optical modulator element and the termination resistance element, and a third bonding wire for connecting the input electrode and the termination resistance element.
摘要翻译： 即使对于25欧姆的驱动阻抗，光传输模块的高传输波形质量仍然使用为50欧姆的驱动阻抗设计的光调制器元件。 上述可以通过采用包括电信号输入电极的光学模块100，使用电信号调制激光的光调制元件，终端电阻元件，用于连接输入电极和光学元件的第一接合线 调制器元件，用于连接光调制器元件和端接电阻元件的第二接合线，以及用于连接输入电极和端接电阻元件的第三接合线。
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