摘要:
A semiconductor device according to the embodiments includes: a first substrate having a plurality of first through-holes; a plurality of first electrodes provided on the first substrate to be adjacent to the respective first through-holes; a plurality of second electrodes provided on the first substrate to be adjacent to the respective first through-holes and to face the respective first electrodes; and a second substrate provided to face the first substrate, the second substrate having a plurality of second through-holes facing the respective first through-holes, at least a surface of the second substrate facing the first substrate having conductivity, the second substrate being electrically connected to the second electrodes.
摘要:
In one embodiment, a blanking aperture array includes a substrate including an upper surface on which an insulating film is provided, a plurality of blanking aperture portions provided in the substrate, each of the plurality of blanking aperture portions including one of penetration holes, through which a predetermined beam passes, and one of blanking electrodes and one of ground electrodes which are provided on the insulating film, and the blanking electrodes and the ground electrodes configured to perform blanking deflection of the predetermined beam, and a high-resistivity film provided so as to cover the insulating film and at least part of the ground electrodes, the high-resistivity film having an electric resistance that is higher than an electric resistance of the ground electrodes and lower than an electric resistance of the insulating film.
摘要:
In one embodiment, a multi-beam blanking device includes a semiconductor substrate, an insulating film that is disposed on the semiconductor substrate, an antistatic film that is disposed on the insulating film, a plurality of cells each of which is related to a through-hole that penetrate the semiconductor substrate and the insulating film and each of which includes a blanking electrode and a ground electrode that are disposed on the insulating film, and a ground wiring line that is disposed in the insulating film. The antistatic film and the ground wiring line are connected to each other at a joint that extends through the insulating film on the ground wiring line.
摘要:
An inspection method for a blanking device for multi-beams, for inspecting whether a separate blanking system of the blanking device is defective, includes, using the blanking device, measuring a value of current flowing from a power source for supplying voltage based on a difference between a first potential and a second potential to each of a plurality of separate blanking systems, in a state where the first potential is applied to a first electrode from a first potential applying unit and the second potential is applied to a second electrode from a corresponding second potential applying unit in at least one second potential applying unit in each of a plurality of separate blanking systems of the blanking device, and determining, when a measured current value is a finite value and equal to or below a preset threshold, that a separate blanking system where a short circuit has occurred exists.
摘要:
In one embodiment, an aperture for inspecting a multi-beam allows passage of one beam among multi-beams applied in a multi-beam writing apparatus. The aperture includes a scattering layer that is provided with a through-hole through which the one beam passes, and by which the other beams are scattered, and an absorbing layer that is provided with an opening having a diameter greater than the diameter of the through-hole and that absorbs at least some of the beams entering it.
摘要:
In one embodiment, a multi charged particle beam writing apparatus includes an emitter emitting a charged particle beam, a shaping aperture array member having a plurality of first apertures, and allowing the charged particle beam to pass through the first apertures to form multiple beams, an X-ray shielding plate having a plurality of second apertures through each of which a corresponding one of the multiple beams that have passed through the first apertures passes, and a blanking aperture array member having a plurality of third apertures through each of which a corresponding one of the multiple beams that have passed through the first apertures and the second apertures passes, the blanking aperture array member including a blanker performing blanking deflection on the corresponding beam. The X-ray shielding plate blocks X-rays produced by irradiation of the shaping aperture array member with the charged particle beam.
摘要:
A blanking device for multi-beams includes arrayed plural separate blanking systems, each performing blanking control switching a corresponding beam of multi charged particle beams between a beam ON state and a beam OFF state and each including a first electrode, a first potential applying mechanism applying two different potentials selectively to the first electrode for the blanking control, and a second electrode performing blanking deflection of the corresponding beam, the second electrode being grounded and paired with the first electrode, and a potential change mechanism changing a potential of the second electrode from a ground potential to another potential, wherein when a potential of the first electrode included in one of the separate blanking systems is fixed to the ground potential, the potential change mechanism changes the potential of the second electrode corresponding to the first electrode fixed to the ground potential, from the ground potential to the another potential.
摘要:
In one embodiment, a charged particle beam drawing apparatus includes a drawing unit that draws a pattern in a drawing area on a substrate and a control processing circuitry that controls the drawing unit via a process including receiving drawing data with a hierarchical correction map input to the control processing circuitry, the drawing data with the hierarchical map including a plurality of files in which division maps are respectively described in files in units of subframes, each division map including dose information associated with corresponding one of blocks of the drawing area, and the process further including generating shot data by performing a data conversion process on the drawing data, reading a division map corresponding to a block in the area to be drawn from the hierarchical correction map, calculating a dose, and controlling the drawing unit based on the shot data and the calculated dose.
摘要:
A semiconductor device according to the embodiments includes: a first substrate having a plurality of first through-holes; a plurality of first electrodes provided on the first substrate to be adjacent to the respective first through-holes; a plurality of second electrodes provided on the first substrate to be adjacent to the respective first through-holes and to face the respective first electrodes; and a second substrate provided to face the first substrate, the second substrate having a plurality of second through-holes facing the respective first through-holes, at least a surface of the second substrate facing the first substrate having conductivity, the second substrate being electrically connected to the second electrodes.
摘要:
In one embodiment, an aperture set for a multi-beam includes a shaping aperture array in which a plurality of first openings are formed, a region including the plurality of first openings is irradiated with a charged particle beam discharged from a discharge unit, and portions of the charged particle beam pass through the plurality of respective first openings to form a multi-beam, a first shield plate in which a plurality of second openings is formed, through which a corresponding beam in the multi-beam, which passes through the plurality of first openings, passes, and a blanking aperture array in which a plurality of third openings is formed, through which a corresponding beam in the multi-beam, which passes through the plurality of first openings and the plurality of second openings, passes. The second openings are wider than the first openings.