-
公开(公告)号:US20220064456A1
公开(公告)日:2022-03-03
申请号:US17310343
申请日:2020-01-29
Applicant: Osaka Soda Co., Ltd.
Inventor: Takuya Fujiyama , Reina Iwasaki , Satoshi Inoue
IPC: C09D4/06 , C09D11/101 , C09D11/107 , C09D135/02
Abstract: The purpose of the present invention is to provide a photocurable resin composition which exhibits excellent compatibility, drying properties when cured by irradiation with light, scratch resistance and adhesion to a substrate. The present invention is a photocurable resin composition containing a styrene-acrylate copolymer and an ethylenically unsaturated compound. The styrene-acrylate copolymer contains 10-90 mol % of constituent units (A) derived from a styrene-based compound and 10-90 mol % of constituent units (B) derived from an acrylate compound. The constituent units (B) derived from an acrylate compound contain constituent units (b-1) derived from a compound having at least three (meth)acryloyl groups in the molecule.
-
公开(公告)号:US11084891B2
公开(公告)日:2021-08-10
申请号:US16204757
申请日:2018-11-29
Applicant: OSAKA SODA CO., LTD.
Inventor: Katsutoshi Yokoyama , Shinichiro Ohashi , Satoshi Inoue
IPC: C08F20/40 , C08F2/44 , C09D11/101 , C09D11/106 , C09D131/06 , C08F122/26 , C09D4/06 , C08F120/40 , C08F118/16 , C08F2/48 , C09D129/06
Abstract: Provided is a photocurable resin composition containing an allylic polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition containing an allylic polymer (A), the allylic polymer (A) being produced by polymerization of an allylic compound represented by the following formula (I):
-
公开(公告)号:US10941232B2
公开(公告)日:2021-03-09
申请号:US16085432
申请日:2017-03-27
Applicant: OSAKA SODA CO., LTD.
Inventor: Shinichiro Ohashi , Katsutoshi Yokoyama , Satoshi Inoue
IPC: C08F222/26 , C08F2/44 , C09D11/101 , C09D7/40 , C08L29/06 , C08K5/00 , C08F263/00 , C08F18/14 , C09D4/00 , C09D147/00 , C08K5/14 , C08K5/23 , C08K5/56 , C08L33/14 , C09D11/106 , C09D129/06 , C08F263/06
Abstract: The present invention aims to provide a photocurable resin composition capable of constituting a composition having high printability. The present invention relates to a photocurable resin composition containing (A) an allylic polymer produced by polymerization of an allylic compound represented by the following formula (I), and (B) a gelling agent, wherein R1 and R2 each represent H or CH3; X represents an a-valent group having an unsubstituted saturated or partially unsaturated four- to eight-membered cyclic structure; and a represents 2 or 3.
-
公开(公告)号:US11149157B2
公开(公告)日:2021-10-19
申请号:US16323697
申请日:2017-08-08
Applicant: Osaka Soda Co., Ltd.
Inventor: Yuna Honmura , Satoshi Inoue , Shinichiro Ohashi , Katsutoshi Yokoyama
IPC: C09D11/10 , C09D11/101 , C08F26/06 , C08F2/50 , C08F271/02 , C09D139/04 , C09D4/00 , C09D11/107 , C09D11/54
Abstract: The present invention provides a photocurable resin composition containing a polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition that contains a polymer (A) produced by polymerization of a compound represented by the following formula [I]: wherein each R1 may be the same or different and represents a hydrogen atom, a C1-C5 alkyl group, a glycidyl group, or the group —CH2—CR3═CHR2 wherein R2 and R3 each represent H or CH3, provided that at least one R1 is the group —CH2—CR3═CHR2.
-
公开(公告)号:US10336836B2
公开(公告)日:2019-07-02
申请号:US15517868
申请日:2016-01-27
Applicant: Osaka Soda Co., Ltd.
Inventor: Katsutoshi Yokoyama , Shinichiro Ohashi , Masahiro Kohara , Satoshi Inoue
IPC: C08F20/40 , C09D7/40 , C08F2/44 , C09D131/02 , C08F263/06 , C09D11/101 , C09D11/106 , C08F291/00 , C08F2/48 , C09D129/06 , C08F222/26 , C09J131/02
Abstract: An object of the present invention is to provide a photocurable resin composition that has excellent adhesion to plastic substrates and can form a composition with good compatibility. The present invention relates to a photocurable resin composition containing: an allylic polymer (A) produced by polymerization of an allylic compound represented by the formula (I) below; and a tackifier resin (B),
-
-
-
-