公开(公告)号：US20150107882A1

公开(公告)日：2015-04-23

申请号：US14407074

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： Jianghui Yang ,  Chuanpeng Zhong ,  Hao Li ,  Xiaomian Chen

IPC: H05K1/05 ,  H05K1/18 ,  H05K3/10 ,  H05K1/02

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。

公开(公告)号：US20150292725A1

公开(公告)日：2015-10-15

申请号：US14438639

申请日：2013-11-08

Applicant: OSRAM GMBH

Inventor： Tingming Liu ,  Jianghui Yang ,  Shengmei Zheng ,  Aiai Li

IPC: F21V29/70 ,  F21V3/02 ,  F21K99/00 ,  F21V29/85 ,  F21V23/00

CPC classification number: F21V29/70 ,  F21K9/232 ,  F21V3/02 ,  F21V23/002 ,  F21V29/86 ,  F21Y2115/10

Abstract: Various embodiments may relate to a lighting device, including an electronic device housing, an electrical connecting part mounted at one side of the electronic device housing, a heat sink mounted at the other side of the electronic device housing, and a plurality of light sources arranged on the heat sink. The heat sink is made of a transparent material and forms at least a part of a light emergent surface for the light from the light sources.

Abstract translation: 各种实施例可以涉及一种照明装置，包括电子装置壳体，安装在电子装置壳体的一侧的电连接部分，安装在电子装置壳体的另一侧的散热片，以及多个光源， 在散热片上 散热器由透明材料制成，并形成用于来自光源的光的光出射表面的至少一部分。

公开(公告)号：US09516748B2

公开(公告)日：2016-12-06

申请号：US14407074

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： Jianghui Yang ,  Chuanpeng Zhong ,  Hao Li ,  Xiaomian Chen

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/18 ,  H05K1/03 ,  H05K3/10 ,  H05K1/14

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。