Abstract:
A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
Abstract:
In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.
Abstract:
An optoelectronic component, comprising an electrically conductive layer, an electrically insulating layer formed above a partial region of the electrically conductive layer, an electrically weakly conductive encapsulation layer formed outside the partial region on the electrically conductive layer and above the partial region on the electrically insulating layer, a first electrode formed above the partial region on the electrically weakly conductive encapsulation layer, an organic functional layer structure formed on the first electrode, and a second electrode formed above the partial region on the organic functional layer structure and where the second electrode is formed outside the partial region on the electrically weakly conductive encapsulation layer.
Abstract:
A light-emitting module including a light-emitting component and a resilient body is provided. The light-emitting component includes a light-emitting layer structure for generating light and includes a light-emitting main face through which the generated light leaves the light-emitting component. The resilient body, which is arranged over the light-emitting main face, is connected firmly to the light-emitting component, includes at least one light-deviating region, and includes a free-lying surface which includes at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.
Abstract:
An OLED and a method for producing an OLED are disclosed. In an embodiment, the OLED includes a substrate and an organic layer stack with at least one active light-generating layer, which is suitable for generating electromagnetic radiation, wherein the organic layer stack is arranged between a first electrode and a second electrode. The OLED further includes a buffer layer arranged between the substrate and the first electrode, wherein the buffer layer includes an organic material, wherein a polymeric planarization layer is in direct contact with the substrate, wherein the buffer layer is in direct contact with the polymeric planarization layer, and wherein the first electrode is in direct contact with the buffer layer.
Abstract:
An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.
Abstract:
In various exemplary embodiments, an optoelectronic component device is provided. The optoelectronic component device includes a first organic light emitting diode and a second organic light emitting diode, which are connected to one another in physical contact one above the other. The first organic light emitting diode is electrically connected in parallel with the second organic light emitting diode. The first organic light emitting diode and the second organic light emitting diode have at least an approximately identical or identical electronic diode characteristic and/or an approximately identical or identical electronic diode characteristic variable.
Abstract:
An organic light-emitting component may include a first electrode, an organic functional layer structure over the first electrode in order to generate light, and a second electrode over the organic functional layer structure. The organic functional layer structure includes at least one layer having an organic carrier material, which has a first refractive index, and having nano-additives which are embedded in the carrier material and have a second refractive index, which is greater than the first refractive index, and which have at least one external dimension which is less than one fourth of a predetermined wavelength of the light generated. The nano-additives, the material thereof and/or a fraction thereof relative to the carrier material of the layer are selected and/or predetermined as a function of an optical path length in the organic light-emitting component or as a function of a size of a microcavity of the organic light-emitting component.
Abstract:
In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.
Abstract:
According to the present disclosure, a method for producing an optoelectronic component is provided. The method includes forming an organic first layer above a substrate, and forming an organic second layer above the first surface region. The first layer includes a surface. The surface is opposite the substrate and includes a first surface region and a second surface region. The second surface region surrounds the first surface region. The second surface region remains free of the second layer. The first layer and the second layer differ in their chemical composition.