Optoelectronic semiconductor component

    公开(公告)号:US11527865B2

    公开(公告)日:2022-12-13

    申请号:US16641851

    申请日:2018-08-10

    Abstract: An optoelectronic semiconductor device includes a semiconductor body in which an active layer configured to generate or detect electromagnetic radiation, a first interlayer and a p-conducting contact layer are formed, and a connection layer applied to the semiconductor body, wherein the contact layer is disposed between the first interlayer and the connection layer and adjoins the connection layer, the active layer is arranged on a side of the first interlayer remote from the contact layer, the first interlayer and the contact layer are based on a nitride compound semiconductor, the contact layer is doped with a p-dopant, the contact layer has a thickness of at most 50 nm, and the contact layer includes a lower aluminum content than the first interlayer.

    LASER DIODE
    3.
    发明申请
    LASER DIODE 审中-公开

    公开(公告)号:US20200220330A1

    公开(公告)日:2020-07-09

    申请号:US16642610

    申请日:2018-09-19

    Abstract: A laser diode having a semiconductor layer sequence based on a nitride compound semiconductor material includes an n-type cladding layer, a first waveguide layer, a second waveguide layer and an active layer, and a p-type cladding layer including a first partial layer and a second partial layer, wherein the first partial layer includes Alx1Ga1-x1N with 0≤x1≤1 or Alx1Iny1Ga1-x1-y1N with 0≤x1≤1, 0≤y1

    OPTOELECTRONIC SEMICONDUCTOR COMPONENT
    4.
    发明申请

    公开(公告)号:US20200220325A1

    公开(公告)日:2020-07-09

    申请号:US16641851

    申请日:2018-08-10

    Abstract: An optoelectronic semiconductor device includes a semiconductor body in which an active layer configured to generate or detect electromagnetic radiation, a first interlayer and a p-conducting contact layer are formed, and a connection layer applied to the semiconductor body, wherein the contact layer is disposed between the first interlayer and the connection layer and adjoins the connection layer, the active layer is arranged on a side of the first interlayer remote from the contact layer, the first interlayer and the contact layer are based on a nitride compound semiconductor, the contact layer is doped with a p-dopant, the contact layer has a thickness of at most 50 nm, and the contact layer includes a lower aluminum content than the first interlayer.

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