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公开(公告)号:US10811843B2
公开(公告)日:2020-10-20
申请号:US15761419
申请日:2016-09-27
Applicant: OSRAM OLED GMBH
Inventor: Sven Gerhard , Alfred Lell , Clemens Vierheilig , Andreas Loeffler , Christoph Eichler
Abstract: The disclosure relates to a semiconductor laser includes a semiconductor layer sequence with an-n-type n-region, a p-type p-region and an active zone lying between the two for the purpose of generating laser radiation. A p-contact layer that is permeable to the laser radiation and consists of a transparent conductive oxide is located directly on the p-region for the purpose of current input. An electrically-conductive metallic p-contact structure is applied directly to the p-contact layer. The p-contact layer is one part of a cover layer, and therefore the laser radiation penetrates as intended into the p-contact layer during operation of the semiconductor laser. Two facets of the semiconductor layer sequence form resonator end surfaces for the laser radiation.
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公开(公告)号:US10784653B2
公开(公告)日:2020-09-22
申请号:US16079678
申请日:2017-02-23
Applicant: OSRAM OLED GmbH
Inventor: Andreas Loeffler , Clemens Vierheilig , Sven Gerhard
IPC: H01S5/22 , H01S5/40 , H01L25/16 , H01L33/00 , H01L33/22 , H01L33/24 , H01L33/32 , H01S5/02 , H01S5/042 , H01S5/343 , H01S5/323 , H01S5/227
Abstract: A laser bar includes a semiconductor layer including a plurality of layers and includes an active zone, wherein the active zone is arranged in an x-y-plane, laser diodes each form a mode space in an x-direction between two end faces, the mode spaces of the laser diodes are arranged alongside one another in a y-direction, a trench is provided in the semiconductor layer between two mode spaces, the trenches extend in the x-direction, and the trenches extend from a top side of the semiconductor layer in a z-direction to a predefined depth in the direction of the active zone.
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公开(公告)号:US11557698B2
公开(公告)日:2023-01-17
申请号:US16072865
申请日:2017-01-17
Applicant: OSRAM OLED GMBH
Inventor: Andreas Loeffler , Adam Bauer , Matthias Peter , Michael Binder
Abstract: Disclosed is a conversion element (1) comprising an active region (13) that is formed by a semiconductor material and includes a plurality of barriers (131) and quantum troughs (132), a plurality of first structural elements (14) on a top face (la) of the conversion element (1), and a plurality of second structural elements (15) and/or third structural elements (16) which are arranged on a face of the active region (13) facing away from the plurality of first structural elements (14). Also disclosed is a method for producing a conversion element of said type.
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公开(公告)号:US11165223B2
公开(公告)日:2021-11-02
申请号:US16890776
申请日:2020-06-02
Applicant: OSRAM OLED GMBH
Inventor: Bernhard Stojetz , Alfred Lell , Christoph Eichler , Andreas Loeffler
IPC: H01S5/06 , H01L33/50 , H01S5/00 , F21K9/64 , H01S5/22 , H01S5/30 , H01S5/34 , H01L33/18 , F21Y115/30
Abstract: A semiconductor light source is disclosed. In one embodiment, a semiconductor light source includes at least one semiconductor laser configured to generate a primary radiation and at least one conversion element configured to generate a longer-wave visible secondary radiation from the primary radiation, wherein the conversion element includes a semiconductor layer sequence having one or more quantum well layers, wherein, in operation, the primary radiation is irradiated into the semiconductor layer sequence parallel to a growth direction thereof, with a tolerance of at most 15°, wherein, in operation, the semiconductor layer sequence is homogeneously illuminated with the primary radiation, and wherein a growth substrate of the semiconductor layer sequence is located between the semiconductor layer sequence and the semiconductor laser, the growth substrate being oriented perpendicular to the growth direction.
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公开(公告)号:US20200303898A1
公开(公告)日:2020-09-24
申请号:US16890776
申请日:2020-06-02
Applicant: OSRAM OLED GMBH
Inventor: Bernhard Stojetz , Alfred Lell , Christoph Eichler , Andreas Loeffler
Abstract: A semiconductor light source is disclosed. In one embodiment, a semiconductor light source includes at least one semiconductor laser configured to generate a primary radiation and at least one conversion element configured to generate a longer-wave visible secondary radiation from the primary radiation, wherein the conversion element includes a semiconductor layer sequence having one or more quantum well layers, wherein, in operation, the primary radiation is irradiated into the semiconductor layer sequence parallel to a growth direction thereof, with a tolerance of at most 15°, wherein, in operation, the semiconductor layer sequence is homogeneously illuminated with the primary radiation, and wherein a growth substrate of the semiconductor layer sequence is located between the semiconductor layer sequence and the semiconductor laser, the growth substrate being oriented perpendicular to the growth direction.
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公开(公告)号:US11004876B2
公开(公告)日:2021-05-11
申请号:US16528307
申请日:2019-07-31
Applicant: OSRAM OLED GMBH
Inventor: Christoph Eichler , Andre Somers , Harald Koenig , Bernhard Stojetz , Andreas Loeffler , Alfred Lell
IPC: H01L21/66 , H01L27/12 , H01L21/02 , H01L21/20 , H01L21/762 , H01S5/22 , H01L33/02 , H01L33/00 , H01L21/268 , H01L21/3105 , H01L21/324 , H01S5/20 , H01S5/223 , H01L33/08 , H01L33/12
Abstract: A method for producing a semiconductor chip (100) is provided, in which, during a growth process for growing a first semiconductor layer (1), an inhomogeneous lateral temperature distribution is created along at least one direction of extent of the growing first semiconductor layer (1), such that a lateral variation of a material composition of the first semiconductor layer (1) is produced. A semiconductor chip (100) is additionally provided.
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公开(公告)号:US10811582B2
公开(公告)日:2020-10-20
申请号:US15737738
申请日:2016-06-15
Applicant: OSRAM OLED GmbH
Inventor: Andreas Loeffler , Thomas Hager , Christoph Walter , Alfred Lell
IPC: H01L33/64 , H01L25/16 , H01L31/02 , H01L31/024 , H01L31/167 , H01L33/48 , H01L33/62 , H01S5/022 , H01S5/024 , H01L31/0232 , H01L33/58 , H01S5/00
Abstract: An arrangement is disclosed. In an embodiment the arrangement includes at least one semiconductor component and a heat sink, wherein the semiconductor component is arranged on the heat sink, wherein the heat sink is configured to dissipate heat from the semiconductor component, wherein the heat sink comprises a thermally conductive material, and wherein the material comprises at least aluminum and silicon.
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