公开(公告)号：US10299341B2

公开(公告)日：2019-05-21

申请号：US15882842

申请日：2018-01-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Boris Eichenberg ,  Juergen Holz

IPC: B60Q1/02 ,  H05B33/08 ,  H01L25/075 ,  B60Q1/14 ,  H01L25/16

Abstract: A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (Z1, Z2) and a plurality of column lines (S1, S2, . . . , S5) is specified, wherein the components are in each case electrically conductively connected to a row line and to a column line and the lighting device is provided for the simultaneous operation of at least two components. A lighting arrangement comprising such a lighting device and a method for operating a lighting device are furthermore specified.

公开(公告)号：US20160118553A1

公开(公告)日：2016-04-28

申请号：US14889653

申请日：2013-05-17

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Juergen Holz ,  Michael Zitzlsperger

IPC: H01L33/54 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0091

Abstract: An optoelectronic component includes a housing having a first cavity open toward an upper side of the housing, and a second cavity open toward the upper side of the housing, wherein the first cavity and the second cavity connect by a connecting channel, an optoelectronic semiconductor chip is arranged in the first cavity, a potting material is arranged in a region of the first cavity enclosing the optoelectronic semiconductor chip, a bond wire is arranged between an electrical contact surface of the optoelectronic semiconductor chip and a bond surface of the housing, and the bond surface is arranged in the connecting channel.

Abstract translation: 光电子部件包括壳体，其具有朝向壳体的上侧开口的第一腔体和朝向壳体的上侧开口的第二腔体，其中第一腔体和第二腔室通过连接通道连接，光电半导体芯片 布置在第一空腔中，封装材料布置在封装光电半导体芯片的第一腔的区域中，在光电半导体芯片的电接触表面和壳体的接合表面之间布置有接合线，并且 接合表面布置在连接通道中。

公开(公告)号：US09991428B2

公开(公告)日：2018-06-05

申请号：US14889653

申请日：2013-05-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Juergen Holz ,  Michael Zitzlsperger

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/48 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0091

Abstract: An optoelectronic component includes a housing having a first cavity open toward an upper side of the housing, and a second cavity open toward the upper side of the housing, wherein the first cavity and the second cavity connect by a connecting channel, an optoelectronic semiconductor chip is arranged in the first cavity, a potting material is arranged in a region of the first cavity enclosing the optoelectronic semiconductor chip, a bond wire is arranged between an electrical contact surface of the optoelectronic semiconductor chip and a bond surface of the housing, and the bond surface is arranged in the connecting channel.