Abstract:
In at least one embodiment, a light-emitting diode includes a carrier and an organic layer sequence with an active layer. A mirror layer and electrical contact regions are located on a connection side of the carrier. The contact regions are provided for electrically contacting the organic layer sequence. Electrical dummy regions are located on the connection side. The dummy regions are electrically insulated from the contact regions. The mirror layer is present in the dummy regions and in the contact regions. At least two of the dummy regions are arranged in such a way that base areas of these dummy regions cannot be congruently superimposed merely by arbitrary rotation of the carrier relative to a center axis of the carrier perpendicular to the connection side.
Abstract:
An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.
Abstract:
Various embodiments may relate to an electronic component including a layer to be protected against moisture, and a moisture barrier layer arranged at least partly on or above and/or below the layer to be protected. The moisture bather layer includes a plurality of layers composed of the same material having different stoichiometric compositions.
Abstract:
The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μ.
Abstract:
The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
Abstract:
Various embodiments may relate to an electronic structure, including at least one organic layer, at least one metal growth layer grown onto the organic layer, and at least one metal layer grown on the metal growth layer. The at least one metal growth layer contains germanium. Various embodiments further relate to a method for producing the electronic structure.
Abstract:
In at least one embodiment, a light-emitting diode includes a carrier and an organic layer sequence with an active layer. A mirror layer and electrical contact regions are located on a connection side of the carrier. The contact regions are provided for electrically contacting the organic layer sequence. Electrical dummy regions are located on the connection side. The dummy regions are electrically insulated from the contact regions. The mirror layer is present in the dummy regions and in the contact regions. At least two of the dummy regions are arranged in such a way that base areas of these dummy regions cannot be congruently superimposed merely by arbitrary rotation of the carrier relative to a center axis of the carrier perpendicular to the connection side.
Abstract:
Various embodiments relate to an optoelectronic component, including a first electrode layer, a first organic functional layer structure on or over the first electrode layer, a nontransparent second electrode layer on or over the first organic functional layer structure, a second organic functional layer structure on or over the second electrode layer, and a third electrode layer on or over the second organic functional layer structure. The material for the second electrode layer is selected in such a way that a matt impression of at least one side of the optoelectronic component is imparted.
Abstract:
The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
Abstract:
An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.