公开(公告)号：US11923487B2

公开(公告)日：2024-03-05

申请号：US17296378

申请日：2019-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Gregory Bellynck ,  Ivar Tangring

IPC: H01L33/56 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L33/60 ,  H01L33/507 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: In an embodiment a method includes providing a carrier with an optoelectronic semiconductor chip-component arranged on a top side of the carrier, arranging a first potting material on the top side of the carrier, arranging a second potting material on the first potting material, wherein the second potting material comprises a higher density than the first potting material, wherein a top side of the optoelectronic semiconductor chip-component is covered by neither the first potting material nor the second potting material and allowing a force to act on the first potting material and the second potting material such that the second potting material migrates in a direction toward the top side of the carrier.

公开(公告)号：US20220020902A1

公开(公告)日：2022-01-20

申请号：US17296378

申请日：2019-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Gregory Bellynck ,  Ivar Tangring

IPC: H01L33/56 ,  H01L33/60

Abstract: In an embodiment a method includes providing a carrier with an optoelectronic semiconductor chip-component arranged on a top side of the carrier, arranging a first potting material on the top side of the carrier, arranging a second potting material on the first potting material, wherein the second potting material comprises a higher density than the first potting material, wherein a top side of the optoelectronic semiconductor chip-component is covered by neither the first potting material nor the second potting material and allowing a force to act on the first potting material and the second potting material such that the second potting material migrates in a direction toward the top side of the carrier.

公开(公告)号：US20200251624A1

公开(公告)日：2020-08-06

申请号：US16640033

申请日：2018-08-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ivar Tangring ,  Gregory Bellynck

IPC: H01L33/50 ,  H01L33/56

Abstract: In an embodiment a method for producing a semiconductor device includes providing a carrier with a semiconductor component arranged on the carrier, providing a layer arrangement on the carrier, the layer arrangement adjoining the semiconductor component and comprising a first and a second flowable layer, wherein the first layer is formed on the carrier and then the second layer is formed on the first layer, wherein the first layer comprises particles, wherein a density of the first layer is greater than a density of the second layer, and wherein a lateral wetting of the semiconductor component with the first layer occurs such that the first layer comprises a first configuration comprising a curved layer surface laterally with respect to the semiconductor component, and centrifuging the carrier such that the first layer comprises a second configuration as a result, wherein the first layer cannot return to the first configuration since the second layer is arranged on the first layer.