公开(公告)号：US20190326490A1

公开(公告)日：2019-10-24

申请号：US16382008

申请日：2019-04-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Sam Chou ,  Martin Brandl

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/44

Abstract: A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.

公开(公告)号：US11069844B2

公开(公告)日：2021-07-20

申请号：US16382008

申请日：2019-04-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Sam Chou ,  Martin Brandl

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/44 ,  H01L33/50

Abstract: A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.

公开(公告)号：US10230031B2

公开(公告)日：2019-03-12

申请号：US15557564

申请日：2016-03-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Sam Chou

IPC: H01L33/60 ,  H01L33/10 ,  H01L33/50 ,  H01L33/54 ,  H01L33/48 ,  H01L33/62 ,  H01L33/46 ,  H01L27/32 ,  H01L51/52

Abstract: An electromagnetic radiation-emitting assembly is disclosed. In an embodiment the assembly includes an electromagnetic radiation-emitting component arranged above a carrier, the electromagnetic radiation-emitting component including a first side facing away from the carrier, a second side facing the carrier, and at least one side wall connecting the first side and the second side of the electromagnetic radiation-emitting component to one another, an encapsulating body, into which the electromagnetic radiation-emitting component is embedded, which adjoins the first side and the side wall of the electromagnetic radiation-emitting component, a potting material at least partly surrounding the encapsulating body and a reflector body at least partly surrounding the potting material.

公开(公告)号：US20180062051A1

公开(公告)日：2018-03-01

申请号：US15557564

申请日：2016-03-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Sam Chou

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L27/322 ,  H01L33/10 ,  H01L33/46 ,  H01L33/486 ,  H01L33/504 ,  H01L33/54 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5268 ,  H01L51/5271 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: An electromagnetic radiation-emitting assembly is disclosed. In an embodiment the assembly includes an electromagnetic radiation-emitting component arranged above a carrier, the electromagnetic radiation-emitting component including a first side facing away from the carrier, a second side facing the carrier, and at least one side wall connecting the first side and the second side of the electromagnetic radiation-emitting component to one another, an encapsulating body, into which the electromagnetic radiation-emitting component is embedded, which adjoins the first side and the side wall of the electromagnetic radiation-emitting component, a potting material at least partly surrounding the encapsulating body and a reflector body at least partly surrounding the potting material.