公开(公告)号：US20180145235A1

公开(公告)日：2018-05-24

申请号：US15574809

申请日：2016-05-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Korbinian PERZLMAIER ,  Stefanie RAMMELSBERGER ,  Anna KASPRZAK-ZABLOCKA ,  Julian IKONOMOV ,  Christian LEIRER

IPC: H01L33/62 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/48 ,  H01L33/60 ,  H01L27/15 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L24/29 ,  H01L27/153 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/405 ,  H01L33/486 ,  H01L33/60 ,  H01L2933/0066

Abstract: An optoelectronic semiconductor component comprises an optoelectronic semiconductor chip (C1) having an electrically conductive substrate (T), an active part (AT) containing epitaxially grown layers, and an intermediate layer (ZS) which is arranged between the substrate (T) and the active part (AT) and contains a solder material. The optoelectronic semiconductor component further comprises an electrical connection point, which at least partially covers an underside of the substrate (T), wherein the electrical connection point comprises a first contact layer (KS1) on a side facing the substrate (T), and the first contact layer (KS1) contains aluminium or consists of aluminium.