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公开(公告)号：US20230157055A1
公开(公告)日：2023-05-18
申请号：US17979984
申请日：2022-11-03
发明人： Hironori FURUTA , Genichirou MATSUO , Akihiro IINO , Takahito SUZUKI , Kenichi TANIGAWA , Yusuke NAKAI , Shinya JUMONJI , Yuuki SHINOHARA
CPC分类号： H01L51/5253 , H01L51/56 , H05K1/181 , H05K3/303 , H05K2201/10106 , H05K2201/10128
摘要： An electronic structure includes a substrate having a first surface; a functional unit including a functional section that has an electronic function and a protective member that protects the functional section and having a second surface formed on the first surface’s side; and a support layer provided at a position to contact the first surface and having a third surface in contact with the second surface of the functional unit, area of the third surface being smaller than area of the second surface, wherein one of part of the functional unit forming the second surface of the protective member and part of the support layer forming the third surface contains organic material as its principal component and the other contains inorganic material as its principal component.
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公开(公告)号：US20230420427A1
公开(公告)日：2023-12-28
申请号：US18320618
申请日：2023-05-19
发明人： Akihiro IINO , Toru KOSAKA , Hironori FURUTA , Genichirou MATSUO , Shinya JUMONJI , Hiroto KAWADA , Yuuki SHINOHARA
CPC分类号： H01L25/13 , H01L33/52 , H01L33/0093 , H01L33/62 , H01L2933/005 , H01L2933/0066 , H01L2933/0016
摘要： A semiconductor device includes: a planarized layer having insulating properties, the planarized layer having a first surface and a second surface opposite the first surface; a plurality of semiconductor elements formed on the first surface of the planarized layer; and a groove provided in the second surface of the planarized layer. The groove is formed in a region outside the plurality of semiconductor elements as viewed in a direction perpendicular to the first surface.
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公开(公告)号：US20230268219A1
公开(公告)日：2023-08-24
申请号：US18165442
申请日：2023-02-07
发明人： Genichirou MATSUO , Toru KOSAKA , Takahito SUZUKI , Hironori FURUTA , Shinya JUMONJI , Hiroto KAWADA , Yuuki SHINOHARA , Akihiro IINO
IPC分类号： H01L21/683 , H01L33/38 , H01L33/52 , H01L33/62 , H01L27/15 , H01L25/10 , H01L25/00 , H01L21/56
CPC分类号： H01L21/6835 , H01L33/38 , H01L33/52 , H01L33/62 , H01L27/153 , H01L25/105 , H01L25/50 , H01L21/568 , H01L2933/005 , H01L2933/0016 , H01L2933/0066 , H01L2221/68318 , H01L2221/68381
摘要： An electronic structure includes: a substrate having a first surface; a functional element unit including a functional element having an electronic function, and a protector covering the functional element, the functional element unit having a second surface facing the first surface; a support disposed between the first surface and the second surface, the support supporting the second surface; and a projection disposed on a first surface side of the substrate, the projection projecting toward the functional element unit. The support has a third surface in contact with the second surface of the functional element unit, the third surface having an area smaller than an area of the second surface. The projection has a fourth surface in contact with or close to the functional element unit, the fourth surface having an area smaller than the area of the second surface, the projection being formed by a different material from the support.
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公开(公告)号：US20230063063A1
公开(公告)日：2023-03-02
申请号：US17884665
申请日：2022-08-10
发明人： Takuma ISHIKAWA , Takahito SUZUKI , Kenichi TANIGAWA , Hironori FURUTA , Toru KOSAKA , Yusuke NAKAI , Shinya JYUMONJI , Genichirou MATSUO , Chihiro TAKAHASHI , Hiroto KAWADA , Yuuki SHINOHARA , Akihiro IINO
IPC分类号： H01L25/075 , H01L25/16 , H01L33/62
摘要： A light emitting device includes: a first layer in which a first light emitting element is disposed; a second layer stacked on the first layer and including a second light emitting element that at least partially overlaps the first light emitting element as viewed in a light emitting direction perpendicular to a light emitting surface of the first light emitting element; and a control substrate on which the first layer is stacked and that controls light emission of the first light emitting element and the second light emitting element. The first layer includes a first surface facing the second layer in the light emitting direction, a second surface facing the control substrate in the light emitting direction, and a first opening formed from the first surface to the second surface. The second light emitting element and the control substrate are electrically connected together through the first opening.
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公开(公告)号：US20240145620A1
公开(公告)日：2024-05-02
申请号：US18446214
申请日：2023-08-08
发明人： Hironori FURUTA , Takuma ISHIKAWA , Yuuki SHINOHARA , Takahito SUZUKI , Kenichi TANIGAWA , Yutaka KITAJIMA
CPC分类号： H01L31/1896 , H10N30/03
摘要： A manufacturing method of an electronic device includes forming a support layer that is provided to extend from a first surface of a functional layer formed on a first substrate via a first layer, as a surface on a side opposite to the first substrate, to the first substrate and supports the functional layer with respect to the first substrate, forming a thin film holding layer on at least one of the support layer and the first surface of the functional layer, removing the first layer, joining a transfer member to a surface of the thin film holding layer on a side opposite to the functional layer, separating the functional layer, the support layer and the thin film holding layer from the first substrate, transferring the functional layer, the support layer and the thin film holding layer to a different second substrate, and removing the thin film holding layer.
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公开(公告)号：US20220310817A1
公开(公告)日：2022-09-29
申请号：US17556450
申请日：2021-12-20
发明人： Yuuki SHINOHARA , Takahito SUZUKI , Kenichi TANIGAWA , Hironori FURUTA , Toru KOSAKA , Yusuke NAKAI , Shinya JYUMONJI , Genichirou MATSUO , Takuma ISHIKAWA , Chihiro TAKAHASHI , Hiroto KAWADA
摘要： A semiconductor element unit includes a semiconductor element; and a first electrode having a flat first electrode mounting surface whose surface roughness is less than or equal to 10 [nm] and forming eutectic bonding with the semiconductor element in a part different from the first electrode mounting surface. A semiconductor element unit supply substrate includes one or more semiconductor element units. A semiconductor packaging circuit includes the semiconductor element unit.
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公开(公告)号：US20220157796A1
公开(公告)日：2022-05-19
申请号：US17504306
申请日：2021-10-18
发明人： Takuma ISHIKAWA , Takahito SUZUKI , Kenichi TANIGAWA , Hironori FURUTA , Toru KOSAKA , Yusuke NAKAI , Shinya JYUMONJI , Genichiro MATSUO , Chihiro TAKAHASHI , Hiroto KAWADA , Yuuki SHINOHARA
摘要： A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.
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