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公开(公告)号：US11531279B2
公开(公告)日：2022-12-20
申请号：US17407678
申请日：2021-08-20
Applicant: Onto Innovation, Inc.
Inventor： Elvino da Silveira , Keith F. Best , Wayne Fitzgerald , Jian Lu , Xin Song , J. Casey Donaher , Christopher J. McLaughlin
Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.
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公开(公告)号：US20240281953A1
公开(公告)日：2024-08-22
申请号：US18443748
申请日：2024-02-16
Applicant: Onto Innovation Inc.
Inventor： Longjiang Xiang , Hongshuo Zhang , Xin Song
IPC: G06T7/00 , G06V10/764 , G06V10/82
CPC classification number: G06T7/0004 , G06V10/764 , G06V10/82 , G06T2207/20084
Abstract: Systems and methods for identifying and classifying defects in a manufactured article, such as an article containing a semiconductor substrate, are provided. Inspection data generated by an inspection tool inspecting the manufactured article is used to generate a defect map. The defect map includes an arrangement of potential defect indicators. Thresholding is performed between potential defect indicators, removing, based on the dynamic thresholding, a subset of the potential defect indicators from the arrangement to generate a modified defect map. Based on the modified defect map, a defect can be identified and classified.
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公开(公告)号：US20220075282A1
公开(公告)日：2022-03-10
申请号：US17407678
申请日：2021-08-20
Applicant: Onto Innovation, Inc.
Inventor： Elvino da Silveira , Keith F. Best , Wayne Fitzgerald , Jian Lu , Xin Song , J. Casey Donaher , Christopher J. McLaughlin
Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.
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Patent Agency Ranking
4.发明授权公开(公告)号：US12111355B2
公开(公告)日：2024-10-08
申请号：US17532700
申请日：2021-11-22
Applicant: Onto Innovation Inc.
CPC classification number: G01R31/318511 , G01R31/2642 , G01R31/2831 , G01R31/2886 , H01L22/14 , G01R1/07342 , G06F30/00 , H01L22/34 , H01L2924/00 , H01L2924/0002
Abstract: Systems and methods for improving substrate fabrication are provided. Subsets of dies of substrates may be inspected at various points in the fabrication process to generate spectra data. The spectra data can be used to generate data that are input to a machine learning model to predict yields for the substrates.
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公开(公告)号：US11126096B2
公开(公告)日：2021-09-21
申请号：US16650359
申请日：2018-09-28
Applicant: Onto Innovation, Inc.
Inventor： Elvino Da Silveira , Keith Frank Best , Wayne Fitzgerald , Jian Lu , Xin Song , J. Casey Donaher , Christopher J. McLaughlin
Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.
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公开(公告)号：US20240295829A1
公开(公告)日：2024-09-05
申请号：US18574554
申请日：2023-05-24
Applicant: Onto Innovation Inc.
Inventor： Xin Song
IPC: G03F7/00
CPC classification number: G03F7/706841 , G03F7/70608 , G03F7/706845
Abstract: Proactive management of semiconductor substrate tools. A machine learning model is used to predict future performance characteristics for such tools. In some examples, the model can diagnose issues with tools or with ambient conditions of the tools' environment. In some examples, the model can recommend one or more remedial actions to maintain adequate performance of the substrate tool.
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公开(公告)号：US20240169514A1
公开(公告)日：2024-05-23
申请号：US18170792
申请日：2023-02-17
Applicant: Onto Innovation Inc.
Inventor： Longjiang Xiang , Xin Song
IPC: G06T7/00 , G01N21/88 , G06V10/40 , G06V10/764
CPC classification number: G06T7/001 , G01N21/8851 , G06V10/40 , G06V10/764 , G06T2207/10152 , G06T2207/20076 , G06T2207/20084 , G06T2207/20224 , G06T2207/30148
Abstract: A system and/or method of detecting a defect in a manufactured article. Images of the manufactured article are generated having different imaging attributes from one another. A multi-channel image is constructed using the images, each image channel of the multi-channel image corresponding to one of the images. The multi-channel image is input to a processor, which determines, based on the input. at least whether the manufactured article includes a defect.
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公开(公告)号：US20230186461A1
公开(公告)日：2023-06-15
申请号：US18062112
申请日：2022-12-06
Applicant: Onto Innovation Inc.
Inventor： Xin Song
CPC classification number: G06T7/001 , H01L21/67288 , G06T2207/30148
Abstract: Dynamic modeling for detecting and classifying defects of fabricated substrates, such as semiconductor substrates. A model includes pixel-by-pixel distributions of pixel data that define a range of known acceptability for substrates based on images of those substrates. The range of acceptability can be defined between upper and lower thresholds. The model is dynamically updated as new imaging data of substrates is obtained, and particularly new imaging data for which an imaging factor not relevant to substrate acceptability has changed. The model can be updated by shifting one or more of the thresholds for one or more of the pixels.
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